Full-Time
NFC System Software Engineer
NXP Semiconductors
10,001+ employees
Automotive semiconductors and secure embedded solutions
Compensation Overview
$83.8k - $115.2k/yr
Company Historically Provides H1B Sponsorship
San Jose, CA, USA
In Person
Bachelor's, Master's
 Software Engineering (1) |
|---|
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- A recent Bachelor's or Master's degree in Computer Science, Electrical Engineering, or a related technical field is required.
- Proven experience in software development and software validation and testing, preferably in an embedded systems environment, is required.
- Basic knowledge of wireless communications and connectivity concepts, including Bluetooth, Wi-Fi, NFC, Zigbee, and secure payments, is required.
- Strong proficiency in at least one programming language, such as C, C++, Java, or Python, is required.
- Experience with laboratory equipment such as oscilloscopes, spectrum analyzers, and logic analyzers is required.
- Experience with embedded development tools, including debuggers, compilers, and version control systems such as Git, is required.
- Strong problem-solving and analytical skills are required.
- The ability to work independently and collaboratively is required.
- Good written and verbal communication skills in English are required.
- Validate and verify NFC components at the system level as a validation engineer.
- Implement tests for software features and enhancements according to product specifications and architectural guidelines.
- Develop, modify, and execute software test plans, automated scripts, and testing programs.
- Analyze and write test standards and procedures, and maintain test-result documentation to assist with software debugging and modification.
- Work with debuggers, logic analyzers, multimeters, oscilloscopes, RF tracers, and development tools such as RF sniffers.
- Collaborate with hardware engineers, firmware developers, and other software teams to ensure seamless integration and optimal system performance.
- Troubleshoot and resolve software defects and issues in a timely manner.
- Stay current with emerging technologies and industry best practices in embedded-systems software development.
- Experience with Smart Card Operating Systems or Java Card Operating System.
- Knowledge of secure coding practices and cryptography.
- Exposure to GlobalPlatform Standards and EMVCo Standards.
NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.
Company Size
10,001+
Company Stage
IPO
Headquarters
Eindhoven, Netherlands
Founded
2004
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Simplify's Take
What believers are saying
- Q2 2026 revenue hit $3.5 billion, with automotive and communications infrastructure both surging.
- Malaysia's new 500,000-square-foot test plant starts ramping Q1 2028, easing supply constraints.
- NXP's data-center business should exceed $500 million in 2026, expanding beyond automotive dependence.
What critics are saying
- South Korea's FTC opened antitrust deliberations July 2026; fines could hit NXP's distributor model.
- Patent suits in Texas, including UNM Rainforest Innovations filed February 2026, drain cash and management time.
- If software-defined vehicle programs slip, NXP's 2027 revenue target and margin expansion collapse.
What makes NXP Semiconductors unique
- NXP dominates automotive edge silicon, pairing S32 platforms with secure connectivity and functional safety.
- Its hybrid manufacturing model spans internal fabs, TSMC, Malaysia, Singapore VSMC, and Dresden ESMC.
- MCX A5 and Kinara extend NXP from cars into secure industrial edge AI.
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↑ 0%Edge AI must be designed for trust, latency & power, says NXP's Hitesh Garg. Speaking at the ETElectronicsWorld Design & Verification Summit 2026 in Bengaluru, Hitesh Garg, Vice President & India Country Manager, NXP Semiconductors, said the shift from cloud AI to physical and edge AI will require architectures that combine ultra-low latency, power efficiency and security by design. * Updated On Aug 18, 2026 at 11:59 AM IST * * Copy Link * Share on WhatsApp * Share on Linkedin * Share on X * Share on Telegram * Share on Facebook BENGALURU: As artificial intelligence moves from the cloud into robots, vehicles, drones and industrial systems, trust, latency and power efficiency will become non-negotiable design requirements, according to Hitesh Garg, vice president & India country manager, NXP Semiconductors. Delivering an industry address at the ETElectronicsWorld Design & Verification Summit 2026 in Bengaluru, Garg said the industry is entering an era in which intelligence increasingly needs to operate at the edge, particularly as machines begin interacting directly with the physical world. "We are moving from AI on the cloud to AI on the edge," he said, arguing that the transition will demand a rethink of how intelligent systems are architected. The difficulty, Garg noted, is that many tasks humans perform instinctively - walking, maintaining balance, handling objects or reacting to sudden movement - remain highly complex for machines. As robotics, software-defined vehicles, autonomous mobile robots and drones evolve, engineers will need to recreate such real-time responses within constrained computing and power environments. Bringing human-like reflexes to machines Garg drew inspiration from the way the human nervous system distributes intelligence. He described a three-layer architecture consisting of a reasoning layer for higher-level decision-making, a coordination layer for managing different functions, and a reflexive layer capable of responding almost instantaneously without waiting for central processing. In an autonomous system such as a drone, for instance, central computing can handle planning, while another layer coordinates the system and local controllers manage individual motors and immediate responses. Such distributed architectures can help reduce dependence on a single processing point while improving response time and power efficiency. For real-world intelligent systems, Garg identified three critical requirements: ultra-low latency responses, distributed control and power efficiency. The approach, he said, can extend across applications ranging from drones and autonomous mobile robots to automotive, aerospace and industrial systems. Trust cannot be added later But faster edge intelligence alone will not be sufficient. "Trust in human beings, we kind of build the trust. For machines, they have to be designed," Garg said. As intelligent machines take on greater responsibility, failures can have consequences beyond software errors. Industrial accidents, compromised autonomous systems or vulnerabilities in connected equipment make safety and security fundamental architecture considerations. Garg outlined several layers required to establish that trust. The first is functional safety and redundancy, allowing another part of the system to take over when a component fails. The second is scalable hardware security, including the ability to prepare systems for emerging threats such as quantum computing. He also highlighted the need to secure AI itself as it becomes embedded in more devices and applications. Verification forms another critical layer. Rather than treating it simply as certification at the end of development, Garg said it should be incorporated into the design process and test whether chips and systems continue to operate reliably across different temperatures and operating conditions. Hardware must remain secure for years The challenge becomes particularly significant for products expected to remain deployed for a decade or longer. Automotive and industrial hardware designed today may still be operating 10 to 15 years from now, even as cybersecurity threats continue to change. Garg said systems therefore need mechanisms such as secure lifecycle updates and "crypto agility" so that protection can evolve after hardware has entered the field. "How do we make ourselves future-proof?" he said, framing it as a fundamental requirement for engineers designing long-life systems. That ability to adapt becomes increasingly important as AI migrates into devices whose physical actions cannot simply be reversed. "Real life has no undo button," Garg said. If an intelligent machine makes the wrong physical decision, a subsequent software update cannot reverse the consequences. Edge AI needs a different design mindset The shift towards physical AI therefore changes both where intelligence resides and how semiconductor systems must be designed. Cloud computing will continue to play a role, but applications requiring immediate reactions increasingly need inference and control closer to where data is generated and actions are taken. For semiconductor companies, that means delivering enough intelligence at the edge while simultaneously managing tight power budgets, latency requirements, functional safety and cybersecurity. Garg said these requirements need to be considered together rather than solved independently. Distributed, biologically inspired architectures provide one way to balance the competing demands, but trust must remain embedded throughout the system. As AI moves from generating digital outputs to controlling machines in factories, vehicles and other physical environments, Garg's central argument was that computing capability alone will not determine adoption. The systems that succeed will be those designed from the outset to respond quickly, operate efficiently and remain trustworthy throughout their working life. * Published On Aug 18, 2026 at 11:59 AM IST
Nokia is expanding its US optical manufacturing capabilities with a multi-state strategy. The company is opening a new optical components plant in San Jose, California, scheduled to begin production in Q4 2026. It is also increasing its Pennsylvania facility's testing and packaging capacity tenfold, with the first phase launching in Q3 2026. Additionally, Nokia has reached a final agreement to acquire NXP Semiconductors' fabrication campus in Chandler, Arizona. The company will lease and begin converting part of the facility in early 2027 to manufacture Indium Phosphide semiconductors, which are critical for high-speed optical devices used in AI data centres. Nokia will complete the acquisition in Q1 2029. The expansion aims to create a domestic US supply chain for optical components amid surging demand from AI infrastructure development.
NXP simplifies secure industrial connectivity with new MCX A5 MCUs. * August 18, 2026 * 9:00 AM * by NXP Semiconductors * News Brief * Twitter * LinkedIn * Facebook What's new: NXP Semiconductors today announced the MCX A5 family of MCUs, simplifying secure connectivity for industrial and IoT edge applications. The MCX A5 family delivers the industry's first implementation of topology discovery enabled on a wired MCU with 10BASE-T1S Ethernet digital PHY, secured by post-quantum cryptography (PQC). Developers are able to connect more industrial edge devices while preparing designs for evolving cybersecurity requirements. Why it matters: According to Omdia, artificial intelligence and edge processing integration are accelerating across industrial automation use cases. This reflects a growing trend of manufacturers connecting equipment for greater operational intelligence. However, many industrial edge devices today remain disconnected or rely on legacy connections such as RS-232 and RS-485, limiting access to the real-time operational data needed to enable effective automation. NXP's new MCX A5 MCU family helps customers connect more edge nodes to Ethernet without the cost and complexity traditionally associated with industrial networking. By extending secure connectivity to more endpoints, manufacturers can access richer operational data for predictive maintenance, intelligent energy management, industrial automation, edge AI and more. "Industrial edge AI cannot realize its full potential without access to real-time data, requiring developers to have expertise in networking, security, software and long product lifecycles. That's why we're investing across our portfolio in solutions like the MCX A5 family, helping customers securely connect more devices, simplify software development and unlock the trusted data needed for intelligent edge applications." Charles Dachs, Executive Vice President and General Manager, Secure Connected Edge, NXP Semiconductors "The future of industrial AI depends on access to trusted data, requiring connectivity, cybersecurity and AI to work together seamlessly. The MCX A5 family delivers the forward-looking innovation we require, combining advanced Ethernet connectivity with next-generation security technologies such as post-quantum cryptography to gather trusted data from the very edge of industrial systems. This ensures we are more than ready to deliver state-of-the-art solutions our customers need and to meet the challenges that will emerge over the coming years." Paolo Faraldi, Chief Technology Officer, CAREL More details: The MCX A5 family is built on an Arm(R) Cortex(R)-M33 core, running up to 240 MHz. Integrated 10BASE-T1S digital PHY supports compact, low-cost multi-drop Ethernet networks for distributed industrial nodes, reducing components, cost, and design complexity for industrial connectivity. Designed for long product lifecycles, the MCX A5 family combines PSA Certified Level 3 security with support for PQC, including a PQC-based hardware root of trust including secure boot, secure firmware updates, secure attestation and secure debug authentication. Selected devices also support the Rust programming language, enabling developers to adopt modern, memory-safe software development practices. The MCX A5 family is supported by NXP's MCUXpresso software and tools ecosystem, including the MCUXpresso SDK with Long Term Support (LTS) releases, development tools, middleware and security enablement. The family also supports Zephyr RTOS, providing developers with flexibility to leverage both commercial and open-source software environments that bring long-term product maintenance and security updates. Together, these capabilities help developers build and maintain secure connected products while addressing evolving cybersecurity requirements, including those introduced by the European Cyber Resilience Act. When paired with NXP's TJF1410 10BASE-T1S Physical Medium Dependent (PMD) transceiver, the MCX A5 family provides a complete single pair Ethernet (SPE) solution for industrial and building automation applications, with the TJF1410 acting as the analog front-end to the MCX A5's integrated digital PHY. The TJF1410 is optimized for IEEE 802.3cg-compliant 10BASE-T1S networks and complements the MCX A5's integrated digital PHY, simplifying the system design and reducing the bill-of-material costs for industrial automation, building automation, energy infrastructure and other distributed edge applications. The MCX A5 family offers up to 2 MB Flash, 640 KB RAM and a rich set of connectivity interfaces, including UART, I[2]C, I3C, SPI, CAN FD, High-Speed USB and FlexIO, giving developers flexibility. Along with support from NXP's FRDM development boards, the MCX A5 family is supported by the MCUXpresso developer ecosystem, including Rust support, comprehensive SDKs, Visual Studio Code integration and LTS software releases. Availability. The MCX A5 family is sampling now. For more information, please visit NXP.com/MCXA5. About NXP Semiconductors. NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.27 billion in 2025. Find out more at www.nxp.com. View this News Brief in German * Twitter * LinkedIn * Facebook Americas / europe.
NXP Semiconductors sees Demand rebound as auto, AI and data center growth accelerate. August 15, 2026 Key points. * Demand is rebounding across NXP's markets: Book-to-bill ratios are above one, distribution inventory has normalized, lead times are extending in some areas, and automotive sales grew across all geographies and product categories in the latest quarter. * Automotive technology and AI are key growth drivers: Software-defined vehicles, radar, battery-management systems and zonal architectures now represent nearly half of automotive revenue, while automotive AI and Kinara NPU opportunities are expanding but remain largely pre-revenue. * Data-center growth and margin targets remain strong: NXP expects its data-center business to double to $500 million this year and is developing new 5-nanometer products for future hyperscaler customers. The company maintains its goal of roughly $16 billion in 2027 revenue and a 60% gross margin. * Interested in NXP Semiconductors? Here are five stocks we like better. NXP Semiconductors NASDAQ: NXPI sees a meaningfully improved business environment compared with 90 days ago and a year ago, with book-to-bill ratios solidly above one across its end markets, according to Senior Vice President of Investor Relations Jeff Palmer. Speaking at a KeyBanc Capital Markets conference, Palmer said lead times have begun to extend in certain areas, distribution inventory has returned to the company's 11-week target, and customer escalations - orders placed inside lead times - have increased. NXP has also implemented targeted price increases in response to inflation in certain input costs, though Palmer described the first-half impact as immaterial to overall financial results. "All in all, I'd say we feel very good about where things are at," Palmer said. Inventory and automotive supply. Palmer said NXP is not planning to hold inventory on behalf of automotive Tier 1 suppliers, even as some suppliers maintain lower-than-desired levels of NXP components. The company's preferred inventory level for these customers is roughly 10 to 12 weeks, but Palmer said a number of large Tier 1s currently hold only three to six weeks of inventory. Some vehicle manufacturers are holding inventory in targeted situations for their suppliers, Palmer said, but he characterized that practice as limited rather than broad-based. He said Tier 1 suppliers may eventually face longer waits if NXP needs to start production from raw die rather than finished goods or available die inventory. NXP currently has 156 days of inventory, versus a target of 110 days. Palmer said approximately 15 to 20 days of inventory by year-end will likely represent buffer stock related to the company's ongoing fabrication-site rationalization efforts. He said the company would prefer to reduce overall inventory and emphasized that its model is fundamentally build-to-order. Automotive conditions began improving for NXP in late 2025, Palmer said, and in the company's most recently reported quarter, all automotive geographies and product categories grew. He described the automotive market as generally healthy despite low order rates from certain Tier 1 customers. Discover more ETF screener access Cryptocurrency market data Palmer said NXP views the global auto market as a roughly 90-million-unit market over time. While Chinese automakers have "clearly" won the electric-vehicle battle from NXP's perspective, he said weaker domestic Chinese sales have been partly offset by exports from larger manufacturers. European auto companies face challenges in determining their next phase, he added, though luxury brands should continue to benefit from customer loyalty. Vehicle technology and physical AI. NXP said its accelerated automotive growth drivers accounted for just under 50% of automotive revenue in the latest quarter and grew strongly year over year. Those drivers include software-defined vehicles, radar and battery-management systems. The company also cited longer-term customer programs that are expected to begin production between late 2027 and 2030. Palmer highlighted NXP's five-nanometer S32N automotive product, for which an initial customer is expected to begin taking product in late 2027 for a 2028 model year program. He also said customer engagement for the company's 16-nanometer S32K5 zonal product has been particularly strong, although revenue from those programs remains several years away. The company is also seeing early interest in automotive artificial-intelligence applications, including in-cabin systems that could use distilled large language models to interpret voice commands locally. Palmer said these opportunities could allow car manufacturers to maintain ownership of the model and voice interface, but stressed that they are not yet generating revenue. In industrial markets, NXP's smaller embedded neural processing units, or NPUs, accounted for about 6% of its industrial internet-of-things processor business in 2025 and are expected to represent about 15% in 2026, according to Palmer. The company's Kinara NPU offers about 40 TOPS of performance and can be paired with NXP's i.MX application processors. Palmer said Kinara's opportunity pipeline grew to approximately $1.5 billion from $1 billion last year, calling it the fastest-growing pipeline in the company's history. He cautioned, however, that opportunities still must progress through proof-of-concept work, design wins and ultimately revenue. Data center, manufacturing and margins. NXP expects its data-center business to double to $500 million this year, Palmer said. The company focuses on control-plane management rather than data-plane processing or power delivery. About half of its current data-center business comes from its Layerscape control-plane switch products, which have gained traction with a small number of hyperscale customers. NXP is developing a next-generation, five-nanometer data-center product family that could sample in 2027 and begin production ramping in 2028 or later. Palmer said the company hopes the product will broaden its addressable market with additional hyperscalers. Its board-management control business, meanwhile, serves ecosystem participants, server original design manufacturers in Taiwan and other hyperscalers, with functions including security, power and cooling controls. The company is seeing cost pressure primarily in packaging, testing, precious metals and substrates rather than wafer supply. Palmer said NXP's major wafer partners, TSMC and GlobalFoundries, remain reliable suppliers. NXP produces about 40% of its wafers internally and sources about 60% externally. Its Singapore joint venture, VSMC, is expected to have capacity of 55,000 wafers per month, with NXP receiving 40% of output. Once fully operational, Palmer said NXP's wafer mix could shift toward 80% outsourced and 20% internally produced. The company is also rationalizing its three older internal eight-inch fabrication facilities. On profitability, Palmer reiterated NXP's rule of thumb that each additional $1 billion in revenue can generate roughly 100 basis points of gross-margin expansion. The company remains confident in its long-term target of approximately $16 billion in revenue and a 60% gross margin in 2027, plus or minus, he said. About NXP Semiconductors (NASDAQ:NXPI). NXP Semiconductors N.V. is a global semiconductor company headquartered in Eindhoven, the Netherlands, that designs and supplies mixed-signal and standard product solutions for a broad range of end markets. The company focuses on enabling secure connections and infrastructure for embedded applications, developing technologies used across automotive, industrial and Internet of Things (IoT), mobile, and communication infrastructure segments. NXP's offerings target customers that require reliable, secure, and high-performance semiconductor components for connected devices and systems. Product lines include microcontrollers and application processors, secure elements and authentication technologies, RF and high-power analog components, connectivity solutions, and vehicle networking and infotainment systems. This instant news alert was generated by narrative science technology and financial data from MarketBeat in order to provide readers with the fastest reporting and unbiased coverage. Please send any questions or comments about this story to [email protected]. Continue following MarketBeat Before you consider NXP Semiconductors, you'll want to hear this. MarketBeat keeps track of Wall Street's top-rated and best performing research analysts and the stocks they recommend to their clients on a daily basis. MarketBeat has identified the five stocks that top analysts are quietly whispering to their clients to buy now before the broader market catches on... and NXP Semiconductors wasn't on the list. While NXP Semiconductors currently has a Moderate Buy rating among analysts, top-rated analysts believe these five stocks are better buys. MarketBeat just released its list of the 7 hottest IPOs expected to hit Wall Street in 2026. See which companies are preparing to go public and why investors are watching closely.
NXP Semiconductors has broken ground on an assembly and test facility expansion in Petaling Jaya, Malaysia. The new factory will add approximately 500,000 square feet of production space to NXP's existing site, bringing total production space to around 900,000 square feet. The facility is expected to begin production in the first quarter of 2028. Once fully operational, the site's output is projected to more than double. The expansion will increase NXP's internal assembly and test capacity and support future growth across its manufacturing ecosystem, including joint ventures in Singapore and Dresden, Germany. The facility will function as a smart factory, featuring automated material handling systems and advanced quality management technologies. The groundbreaking ceremony included government officials and NXP executives, with Malaysia's Minister of Digital and the Dutch Ambassador to Malaysia in attendance.