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Micron Technology

Makes memory and storage chips for AI and PCs

MTS Package Engineer - ASIC Package Design, Logic Integration and Design Rules

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field, and 10 or more years of experience.
  • Proven experience in hardware design and development, including block diagrams, schematics, and electrical requirements.
  • Strong understanding of system architecture and the ability to collaborate with system-level architects.
  • Familiarity with NAND flash memory technology, controller design, and storage system behavior.
  • Proficiency with electronic design automation schematic and simulation tools such as Cadence Allegro System Capture, Synopsys Design Compiler, Mentor Graphics PADS, Altium Designer, and OrCAD.
  • Experience with ASIC architecture in storage products such as SSD, eMMC, UFS, and USB, and with high-speed serial and parallel interfaces such as PCIe, MIPI, DDR, LPDDR, and ONFI.

Responsibilities

  • Partner with system architects and engineering teams to define package architecture, connectivity, and electrical requirements.
  • Develop block diagrams, schematics, and logical connectivity for system-in-package designs.
  • Create and verify package netlists using schematic and automation-based design flows.
  • Support ASIC/package co-design, including pad/bump maps, connectivity, and package integration.
  • Evaluate package designs for electrical performance, manufacturability, reliability, and system requirements.
  • Collaborate with package design and signal integrity/power integrity teams to support physical and electrical implementation.
  • Support integration of memory, ASICs/controllers, and other devices within complex package architectures.
  • Support new and evolving interfaces such as LPDDR/DDR, ONFI, UFS, PCIe, and other high-speed protocols.
  • Lead technical reviews and resolve package connectivity and integration issues through design, validation, and product bring-up.
  • Develop technical documentation and provide technical guidance and mentoring to engineering teams.
  • Work with technical program management and factory teams to develop a design-rules roadmap for packaging across memory and ASIC roadmaps.
  • Support improvements in package integration, design methodology, verification, and automation.
  • Support new protocol enablement, including Separate Command Address, ONFI, UFS, and PCIe, and capability bring-up.
  • Support root-cause debugging of failures in reliability tests using electrical failure analysis and physical failure analysis, and work with multifunctional teams to resolve issues and drive improvements.
  • Develop or help develop agentic AI workflows for current or future processes.

Desired Qualifications

  • Experience in semiconductor package design, architecture, or integration.
  • Experience with schematics, netlists, connectivity definition, and verification.
  • Understanding of ASIC/package and system-in-package integration.
  • Knowledge of signal integrity, power integrity, and package electrical design.
  • Familiarity with memory and high-speed interfaces such as DDR/LPDDR, ONFI, UFS, and PCIe.
  • Experience with electronic design automation tools for schematic capture, package design, or connectivity verification.
  • Familiarity with advanced packaging, substrate technologies, and assembly processes.
  • Cross-functional technical leadership and problem-solving skills.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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