PCB Quality Engineer
About the job
- A BS or MS in Electrical, Materials, Mechanical, or Manufacturing Engineering and at least 5 years of experience in advanced PCB/substrate technology development, design for manufacturability, or manufacturing/supplier quality for complex electronics.
- Hands-on experience developing and qualifying advanced substrate/PCB technologies, including embedded passives/actives, inorganic and organic core substrates, ABF build-up, and flip-chip BGA, including materials, structures, and process development with vendors.
- Strong understanding of advanced PCB and substrate fabrication processes, including lamination, drilling/laser via, plating, ABF build-up, and flip-chip BGA, and their failure modes.
- Experience partnering cross-functionally with packaging, signal integrity/power integrity, thermal, mechanical, and systems teams to enable new product architectures, including embedded components and novel thermal solutions.
- Supplier quality experience including qualification, PPAP/first-article, process capability, and driving corrective action with fab/substrate partners.
- Fluency in IPC standards (e.g., IPC-6012 / IPC-A-600 or substrate equivalents) and quality acceptance criteria.
- Failure-analysis skills using cross-section, metrology, and electrical debug to root-cause defects.
- Drive the advanced substrate and PCB technology roadmap, including embedded passive/active integration and inorganic core substrates, aligned to AI accelerator product needs.
- Develop and qualify new materials, structures, and processes with substrate and PCB vendors, taking them from evaluation through production readiness.
- Collaborate with packaging, signal integrity/power integrity, thermal, mechanical, and systems teams to enable new product architectures, focusing on passive/active embedding, novel thermal solutions, and improved signal integrity/power integrity and mechanical behavior for assembly and reliability.
- Lead design-for-manufacturability/design-for-excellence reviews for high-layer-count PCBs and organic package substrates (flip-chip BGA / ABF), identifying manufacturability, yield, and reliability risks before tape-out to the fab.
- Own substrate and PCB supplier quality by qualifying suppliers, driving PPAP/first-article and process capability, and holding partners to specification through new product introduction and volume ramp.
- Define quality standards and acceptance criteria (IPC and internal) that gate builds, and drive defect and failure analysis (cross-section, metrology, electrical) to root cause with corrective actions at the supplier.
- Support reliability qualification (thermal cycling, HAST, etc.) and use statistical methods (SPC/DOE) to monitor and improve process quality across suppliers.
- Build design-for-manufacturability guidelines, checklists, and quality processes that scale from prototype through production.
About the company
DensityAI designs high-density, full-stack AI infrastructure for data centers, with custom chips, hardware, and software tightly integrated. Its products are aimed at automotive and robotics applications, delivering end-to-end AI workflows from perception and decision-making to control. The platform leverages hardware-software co-design to achieve higher performance, better power efficiency, and lower costs, addressing scalability and sustainability in AI computing. Unlike typical vendors, DensityAI combines a strong ex-Tesla leadership with a team of Dojo alumni and other industry veterans to offer a plug-and-play solution for OEMs and operators, simplifying the deployment of AI infrastructure. The company plans to raise substantial funding to speed development, validate deployments in its core markets, and broaden into general AI data center use and a comprehensive developer ecosystem.
Company Size
51-200
Company Stage
Acquired
Total Funding
N/A
Headquarters
Mountain View, California
Founded
2024
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Simplify's Take
What believers are saying
- Andreessen Horowitz is reportedly leading hundreds of millions at a $10 billion valuation.
- AWS signed a conditional purchase agreement for chips meeting performance targets.
- Tesla senior hardware executive Shishuang Sun joined DensityAI in July 2026.
What critics are saying
- DensityAI still lacks a shipped chip; the AWS contract stays conditional on benchmarks.
- 3D DRAM packaging faces heat and yield problems that kill schedules.
- A failed round or benchmark miss destroys the $10 billion valuation overnight.
What makes DensityAI unique
- Ganesh Venkataramanan, Bill Chang, and Ben Floering bring Tesla Dojo system experience.
- DensityAI combines custom chips, hardware, and software for AI data centers.
- Its 3D DRAM stacking bet targets bandwidth, capacity, and energy efficiency.
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Benefits
- Health Insurance
- Dental Insurance
- Vision Insurance
- Paid Vacation
- Company Equity