Senior Foundry and OSAT Manager

Your Job

Molex is seeking a Senior Foundry and Semiconductor Backend Manager to provide technical and operational leadership for outsourced semiconductor manufacturing, assembly, packaging, and test activities supporting ASIC and co-packaged product development.

This position will serve as a key technical interface among ASIC designers, semiconductor foundries, outsourced semiconductor assembly and test providers, system engineers, packaging and module designers, silicon photonics engineers, laser engineers, project managers, quality teams, and other internal and external stakeholders. The role will have primary responsibility for coordinating semiconductor foundry interfaces and backend processes, including bumping, redistribution layers, wafer preparation, assembly, packaging, qualification, and test.

The successful candidate will combine strong semiconductor process and packaging expertise with effective supplier management, structured problem-solving, and cross-functional leadership. Significant interaction with global suppliers is required, including meetings outside normal business hours and occasional travel to vendor locations.

Our Team

Molex is an industry leader in transforming optical network infrastructure with an unwavering commitment to speed, reliability, and performance. We proudly engineer high-performance systems for critical, fast-growing industries including data centers, telecom, medical, and industrial automation. Our team develops an advanced portfolio of optical solutions, ranging from cutting-edge optical connectivity products—such as expanded beam connectors, fiber management, adapters, and hybrid copper/fiber solutions for medical systems—to end-to-end optoelectronic solutions featuring cages, connectors, optical transceivers, and cable assemblies. Supporting extreme data rates from 100 Mbps to 1.6 Tbps across long-haul distances up to 80km+, we deliver complete wavelength management and turnkey OEM solutions. Come join Molex and help build the future of global connectivity.

What You Will Do

Foundry and Backend Supplier Management

• Serve as the primary technical point of contact for semiconductor foundries, bumping suppliers, OSAT partners, and other backend manufacturing vendors.
• Coordinate technical reviews, process readiness, manufacturing schedules, qualification activities, supplier change notifications, deviations, and issue resolution.
• Manage multiple outsourced manufacturing partners and align their deliverables with ASIC development, product introduction, and program milestones.
• Support supplier assessments, process transfers, second-source qualifications, and manufacturing risk mitigation.
• Track supplier yield, quality, qualification, and technical performance, escalating critical issues when necessary.

Semiconductor Process and Packaging Ownership

• Provide technical ownership of outsourced semiconductor backend processes, including wafer bumping, redistribution layers, wafer thinning and dicing, die attach, flip-chip assembly, wire bonding, BGA or CSP assembly, underfill, multi-chip integration, wafer sort, and final test.
• Define, review, and maintain package and assembly specifications, drawings, process requirements, and quality criteria.
• Review and approve supplier process flows, design-for-manufacturing reports, process change notifications, qualification plans, and manufacturing deviations.
• Work with package, substrate, PCB, and SMT engineers to align package-side and board-side requirements, including ball maps, pitch, coplanarity, land and stencil design, reflow, underfill, standoff, escape routing, and rework requirements.
• Provide subject-matter expertise to system, module, silicon photonics, laser, ASIC, and related development teams.

Product Introduction and Qualification

• Support ASIC product introduction from design-rule review and tapeout through wafer fabrication, backend assembly, qualification, product bring-up, and production release.
• Define inspection, test, and qualification criteria for semiconductor packages and assembled products.
• Coordinate qualification activities involving X-ray, acoustic imaging, cross-section analysis, SEM, shear and pull testing, warpage measurement, known-good-die test coverage, and applicable reliability testing.
• Establish wafer and product acceptance criteria in collaboration with design, test, manufacturing, supplier, and quality teams.
• Review qualification and reliability data, identify technical risks, and lead closure of qualification gaps or failures.

Yield, Quality, and Failure Resolution

• Monitor wafer, assembly, and final-test performance to identify yield excursions, process shifts, parameter drift, and systemic manufacturing issues.
• Lead structured problem-solving and failure analysis for fabrication, package, reliability, test, and customer-return issues.
• Coordinate root-cause investigations with suppliers and internal engineering teams, including definition of containment and corrective actions.
• Analyze inline, wafer acceptance, wafer-sort, assembly, and final-test data to support technical decisions and process improvements.
• Review supplier process controls, capability data, quality trends, and corrective-action effectiveness.

Cross-Functional Program Support

• Coordinate backend and foundry activities with ASIC design, CAD, product, test, quality, reliability, system, packaging, supply-chain, and project-management teams.
• Translate product and system requirements into actionable foundry, assembly, package, and test requirements.
• Communicate technical risks, alternatives, recommendations, and decisions clearly to engineering teams and program leadership.
• Support semiconductor and packaging activities that span multiple Molex divisions or product groups.
• Maintain clear engineering reports, qualification records, process documentation, decision logs, and internal technical knowledge.

Who You Are (Basic Qualifications)

• Master’s degree in Electrical Engineering, Materials Science and Engineering, Physics, Semiconductor Physics, Process Engineering, Mechanical Engineering, or a closely related technical discipline.
• Extensive professional experience in semiconductor foundry engineering, process engineering, product engineering, assembly, packaging, test, or backend manufacturing.
• Demonstrated experience managing technical activities with semiconductor foundries, OSAT providers, bumping houses, or other outsourced semiconductor manufacturing partners.
• Strong working knowledge of semiconductor backend operations, such as wafer sort, wafer preparation, bumping, RDL, dicing, flip-chip, wire bonding, BGA or CSP assembly, underfill, and final test.
• Experience with semiconductor or package qualification, reliability testing, failure analysis, yield improvement, and manufacturing issue resolution.
• Ability to review and interpret semiconductor design rules, package drawings, process flows, qualification data, and PCB or substrate layouts.
• Strong analytical and problem-solving skills, including the ability to use manufacturing, wafer, yield, and test data to guide decisions.
• Demonstrated ability to lead cross-functional technical discussions involving internal engineering teams and external suppliers.
• Excellent written and verbal communication skills in English.
• Ability to work effectively across global time zones, participate in occasional meetings outside standard business hours, and travel to supplier sites as needed.

What Will Put You Ahead

• Ten or more years of relevant semiconductor-industry experience, with substantial responsibility for foundry, backend, packaging, product, yield, reliability, or OSAT management.
• Experience supporting advanced semiconductor process nodes and complex ASIC product introductions.
• Experience with multi-project wafer runs, new-product introduction, tapeout readiness, design-rule review, second-source qualification, and production transfer.
• Familiarity with JEDEC and IPC qualification or assembly standards.
• Experience with multi-chip modules, co-packaged devices, fan-out or RDL-based packaging, organic or ceramic substrates, or HTCC/LTCC technologies.
• Experience supporting mixed-signal, high-voltage, MEMS, optical-module, silicon-photonics, or laser-related products.
• Working proficiency in Mandarin Chinese or experience managing suppliers in Taiwan and China.
• Experience creating technical knowledge bases, engineering decision records, and executive-level technical reports.