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ASM International

Semiconductor deposition equipment and ALD tech

Process Engineer Intern

Process EngineeringPosted on Nov 6
InternshipPhoenix, AZ, USANo salary listedIn-person

About the Job

Requirements

  • Currently pursuing a Master's or PhD in Chemical Engineering, Materials Science or Materials Engineering, Electrical Engineering, Chemistry, Physics, or a closely related technical field.
  • An interest in semiconductor manufacturing, thin-film deposition, materials science, or process engineering.
  • Academic, laboratory, research, or project experience related to semiconductor processing, materials, chemistry, or engineering.
  • A basic understanding of experimental design, data analysis, and scientific problem-solving.
  • The ability to work collaboratively within a technical team.
  • Strong written and verbal communication skills.
  • Active enrollment in an accredited degree program during the internship period, or meeting ASM's applicable internship eligibility requirements.
  • The ability to follow applicable safety and operational requirements when working in laboratory, cleanroom, and semiconductor processing environments.

Responsibilities

  • Support process engineers in researching, developing, and optimizing semiconductor processes, including ALD, PEALD, epitaxy, PECVD, oxidation, annealing, and curing.
  • Assist with designing and executing experiments to evaluate process performance, materials properties, and equipment capabilities.
  • Collect, analyze, and interpret experimental data with guidance from experienced engineers.
  • Gain exposure to Design of Experiments and other structured problem-solving methodologies used in semiconductor process development.
  • Support thin-film development and characterization for emerging semiconductor applications.
  • Work hands-on with semiconductor processing and analytical equipment in a laboratory or cleanroom environment.
  • Assist with troubleshooting process- and equipment-related challenges using scientific problem-solving methods.
  • Gain experience with materials characterization techniques such as XPS, SIMS, AFM, XRR, XRD, TEM, SEM, and ellipsometry, depending on project needs and equipment availability.
  • Collaborate with process engineering, equipment engineering, applications, and other technical teams.
  • Document experimental procedures, results, observations, and conclusions.
  • Participate in technical discussions and learn how process results are translated into solutions for semiconductor applications.
  • Complete a defined internship project aligned with ASM's process development or technology objectives.
  • Prepare and deliver a final technical presentation summarizing the project, results, key learnings, and recommendations.

Desired Qualifications

  • Coursework, research, or laboratory experience involving ALD, CVD, PECVD, epitaxy, oxidation, annealing, thin films, plasma processing, or related semiconductor processes.
  • Familiarity with materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, or ellipsometry.
  • Exposure to Design of Experiments, statistical analysis, or experimental data analysis.
  • A basic understanding of semiconductor devices, CMOS technology, or semiconductor fabrication processes.
  • Experience working in a university laboratory, research group, cleanroom, or similar technical environment.
  • Exposure to computational modeling, data analysis, or Computational Fluid Dynamics.
  • An interest in developing a career in the semiconductor equipment or advanced manufacturing industry.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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