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ASML

Manufactures photolithography systems for semiconductors

Factory Quality Engineer

Full-TimePosted on 10/16/2026
$81.4k - $119k/yr
Mid
Bachelor's, Master's
Wilton, CT, USA
In Person
Manufacturing Quality & TestQuality Engineering
Company Does Not Provide H1B Sponsorship

About the job

Requirements
  • A Bachelor’s or Master’s of Science degree in a technical domain, such as mechanical, electrical, optical, chemical, or industrial engineering, mechatronics, physics, or a related field, and at least two years of relevant work experience with a Bachelor’s degree or relevant work experience with a Master’s degree.
  • Hands-on technical experience related to manufacturing quality is preferred.
  • Demonstrated ability to independently lead root-cause analysis and corrective and preventive action activities.
  • Strong statistical and analytical capabilities.
  • Proficiency in SAP/QMS tools, statistical process control, failure mode and effects analysis, and structured problem solving.
  • Six Sigma Green Belt certification is preferred, or willingness to achieve it.
  • Ability to influence cross-functional teams and drive actions to closure.
  • Ability to work in a cleanroom and feel comfortable wearing full personal protective equipment for periods throughout the day.
  • Ability to access controlled technology under the United States Export Administration Regulations prior to beginning work.
  • Ability to interpret engineering data, specifications, and inspection criteria accurately.
  • Strong understanding of module-level factory processes and risk points.
  • Ability to communicate complex technical issues clearly to technical and non-technical audiences.
  • Ability to prioritize tasks and manage multiple projects under tight deadlines.
  • Potential exposure to strong magnetic fields, high voltage, and currents.
Responsibilities
  • Own module-level quality execution for an assigned module or work center, including root-cause analysis, quality reporting, and structural improvements.
  • Lead Design Review Board and Material Review Board sessions for assigned areas; validate root causes and drive structural implementation of corrective actions.
  • Own statistical process control performance reviews, including control-limit adjustments, capability analysis, and communication of required process improvements.
  • Lead factory discussions to assign critical-to-design, critical-to-quality, and critical-to-control definitions.
  • Lead process failure mode and effects analysis updates in response to systemic issues, new learnings, or high-impact events.
  • Execute and analyze measurement system analysis and Gage repeatability and reproducibility studies, driving cross-functional improvements when measurement systems underperform.
  • Represent assigned work centers during Quality Management Methodology and 6P quality assessments, ensuring evidence of readiness, process compliance, and gap closure.
  • Analyze First Pass Yield data to understand and improve process stability.
  • Develop dashboards and tracking methodologies for quality activities.
  • Drive adoption and enforcement of Quality Gates across upstream and downstream partners, ensuring handoffs include complete and accurate inputs.
  • Participate in, facilitate, or co-lead 4-Eye reviews and Quality Circles to strengthen quality fundamentals and prevent recurrence of known issues.
  • Lead Workcenter Handshakes for structural readiness, ensuring clear, validated acceptance criteria and completed prerequisite checks.
  • Maintain and communicate inspection criteria requirements in alignment with Production Engineering, First Line Support, and Central Quality.
  • Lead First Time Through and customer Manufacturing Notification investigations end-to-end, providing analysis, aligning stakeholders, and updating lifecycle tracking systems, including documenting 8D reports as structural solutions.
  • Provide integrated reporting on Manufacturing Notification trends, systemic bottlenecks, and mitigation plans to Factory Quality, Production Engineering, and Design and Engineering leadership.
  • Represent the factory’s technical authority for quality process execution in daily collaboration with Production Engineering, First Line Support, Manufacturing, Supplier Quality, Central Quality, and other cross-sector partners.
  • Own work-center quality performance, including statistical process control effectiveness, Manufacturing Notification and Disturbance Notification closure, and process risk mitigation.
  • Lead Lean and Six Sigma activities aimed at structural quality improvement.
  • Translate disturbance trends into process failure mode and effects analysis updates, governance improvements, and training needs.
  • Anticipate future risks and drive preventive actions across multiple teams.
  • Mentor lower JG engineers and reinforce disciplined quality culture behaviors.
  • Demonstrate situational leadership during escalations and cross-sector reviews.
Desired Qualifications
  • Six Sigma Green Belt certification, or willingness to achieve it.
  • Hands-on technical experience related to manufacturing quality.

About the company

ASML designs and manufactures photolithography systems for semiconductor manufacturing. Its main products are deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography machines that print circuit patterns on silicon wafers, with EUV enabling smaller features. The company sells these systems to leading chipmakers and earns substantial revenue from installation, maintenance, and upgrades over the machines’ lifetimes. Its goal is to help continue scaling semiconductors by leading in high-end lithography and maintaining strong relationships with customers like TSMC, Samsung, and Intel.

Company Size

10,001+

Company Stage

IPO

Headquarters

Veldhoven, Netherlands

Founded

1984

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Simplify's Take

What believers are saying

  • Q2 2026 sales hit €9.3 billion, and full-year guidance rose to €43-45 billion.
  • Management said 2028 EUV output could exceed 110 tools, unlocking AI wafer capacity.
  • India launched ASML operations with Tata Electronics support, opening a new customer frontier.

What critics are saying

  • Europe bought zero ASML lithography tools in 2026, exposing a dead domestic demand base.
  • Chinese DUV entrants in Shanghai threaten ASML's 29% 2025 China revenue by 2027.
  • ASML cut 1,700 jobs in 2026; continued restructuring signals execution strain and morale damage.

What makes ASML unique

  • ASML alone ships EUV systems; no advanced chip node exists without Veldhoven tools.
  • High-NA EUV expands into Nvidia-scale data-center chips, extending ASML's moat through 2033.
  • Installed Base Management generated €2.8 billion in Q2 2026, deepening recurring revenue.

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Benefits

  • Flexible Work Hours
  • Remote Work Options

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

0%
Yahoo Finance
Oct 20th, 2026
Apple vs ASML: $416.2B revenue against 15.6% growth and a 29.4% margin

Apple and ASML offer two ways to bet on tech: one sells devices to billions of users, the other makes the lithography machines that chipmakers need to produce advanced semiconductors. In fiscal 2025, Apple's revenue reached nearly $416.2 billion, up about 6.4%. Net income was close to $112 billion, a 26.9% margin, and free cash flow was roughly $98.8 billion. Its debt-to-equity ratio was about 1.5. ASML reported revenue of nearly $36.8 billion, up 15.6%. Net income was $10.8 billion, a margin of about 29.4%, with free cash flow of roughly $12.5 billion. ASML's debt-to-equity ratio was about 0.2, and its current ratio was nearly 1.3, against Apple's 0.9.

Neoteo
Oct 16th, 2026
SemiAnalysis says ASML may be developing a hybrid-bonding tool.

SemiAnalysis says ASML may be developing a hybrid-bonding tool. A patent-based analysis describes a possible die-to-wafer process; ASML had not announced a tool as of October 15, 2026. October 16, 2026 Key points * 01 SemiAnalysis inferred that ASML may be developing a die-to-wafer hybrid-bonding tool; ASML had not announced it as of October 15, 2026. * 02 SemiAnalysis counted 27 ASML bonding patent families filed from December 2022 through November 2024, mostly related to D2W bonding. * 03 The proposed track-based process and its potential technical advantages are SemiAnalysis's interpretation, not measured tool results. * 04 SemiAnalysis expects advanced logic could be the first application; it forecasts D2W adoption in HBM no earlier than 2029, if it happens at all. SemiAnalysis says ASML may be developing a die-to-wafer hybrid-bonding tool. Its proposed process and potential impact on Besi remain unconfirmed. SemiAnalysis said on October 15, 2026, that ASML may be developing a die-to-wafer (D2W) hybrid-bonding tool, drawing that inference from patent filings, roadmap material and earlier reporting. ASML had not announced the tool as of the analysis. Read SemiAnalysis's analysis. Reuters reported on October 16 that ASML did not confirm the development and declined to comment on the report. Read the Reuters report. What the reporting says about ASML. SemiAnalysis counted 27 ASML bonding patent families filed between December 2022 and November 2024, most related to D2W bonding. It also cited The Elec reporting that ASML had begun architecture design with Prodrive Technologies and VDL ETG. These reports inform SemiAnalysis's inference; they do not amount to an ASML product announcement. The proposed tool is specifically a die-to-wafer bonder: individual semiconductor dies would be bonded to a wafer. The central claim in the coverage traces to SemiAnalysis's analysis. Investing.com summarized that analysis, while Reuters reported on it; those accounts do not constitute separate technical confirmation. How SemiAnalysis describes the proposed process. In SemiAnalysis's interpretation of patent material, each die would travel on an individual holder along a track, passing through inspection, cleaning, plasma activation, metrology and alignment before bonding to a wafer. The analysis suggests that independent shuttles could let stations work concurrently, that adding stations could increase capacity, and that recipes could accommodate different die types. Those are proposed design possibilities, not measured results. SemiAnalysis identifies alignment accuracy and particle control as potential advantages, while also pointing to engineering challenges involving feed-forward metrology, die-to-wafer contact, adapting non-bonding tools to the track and keeping the process loop clean. Why a possible tool could matter to Besi. SemiAnalysis describes Besi as the only supplier with D2W tools in volume production and says its logic-bonding business is concentrated at TSMC and Intel. If ASML develops a competing tool, Besi could face a new rival in that segment. SemiAnalysis expects advanced logic to be the likeliest first application for a prospective ASML tool. Its forecast for D2W bonding in high-bandwidth memory (HBM) is no earlier than 2029, if adoption happens at all. Other Languages Read this article in another available language.

MarketScreener
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. Published on 10/16/2026 at 06:54 am EDT - Modified on 10/16/2026 at 06:55 am EDT AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3% at EUR158.50, while ASML was up 1.1% at EUR1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation." (Reporting by Toby Sterling; Editing by Susan Fenton) (C) Reuters - 2026

Channel NewsAsia
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. 16 Oct 2026 06:51PM (Updated: 16 Oct 2026 06:54PM) Add CNA as a trusted source to help Google better understand and surface our content in search results. AMSTERDAM, Oct 16: Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3 per cent on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3 per cent at €158.50, while ASML was up 1.1 per cent at €1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation."

WZUU
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. By Thomson Reuters Oct 16, 2026 | 6:51 AM AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3% at €158.50, while ASML was up 1.1% at €1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation." (Reporting by Toby Sterling; Editing by Susan Fenton) Now Playing WZUU 92.5 - Kalamazoo's Music Authority Fri Oct 16 Kalamazoo, MI, USA Wind/Dir: 30 MPH-NW Humidity: 94%