GlobalFoundries

Semiconductor foundry delivering specialized chips

Director of Advanced Packaging Development

Engineering LeadershipConfirmed live in the last 24 hours

Full-time$166.5k - $290kIn-person

About the Job

Requirements

A BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline is required.
At least 15 years of experience in semiconductor packaging, advanced packaging, photonics packaging, or related technologies is required.
Demonstrated experience leading complex technology development organizations and multidisciplinary engineering teams is required.
Strong knowledge of advanced packaging technologies, including flip-chip assembly, wafer-level packaging, optical packaging, high-density interconnects, thermal management, and reliability qualification is required.
Experience working directly with outsourced semiconductor assembly and test providers (OSATs), outsourced manufacturing partners, and semiconductor supply chains is required.
Proven ability to lead strategic customer engagements and external partnerships is required.
Excellent communication, leadership, and executive presentation skills are required.

Responsibilities

Lead the advanced packaging development organization responsible for package architecture, assembly processes, qualification strategy, manufacturing readiness, and product industrialization.
Build and develop a high-performing team focused on technical excellence, innovation, and execution.
Drive technology decisions related to package design, materials, thermal management, reliability, manufacturability, and cost optimization.
Establish development methodologies, design guidelines, and qualification strategies to support product scale-up and commercialization.
Define and maintain the advanced packaging technology roadmap supporting silicon photonics, optical interconnect, co-packaged optics, AI networking, and future platform developments.
Align packaging investments and development priorities with product roadmaps, customer requirements, and business objectives.
Evaluate emerging technologies, market trends, and supplier capabilities to maintain the company’s competitive position.
Drive strategic decisions on technology selection, capability development, and manufacturing approaches.
Partner with Product Management and Business Development to shape future product and technology strategies.
Engage directly with customers to understand technology requirements, packaging challenges, and long-term roadmap needs.
Represent the company during customer technical reviews, roadmap discussions, executive briefings, and development engagements.
Support customer acquisition and growth initiatives by translating customer requirements into differentiated packaging solutions.
Build trusted relationships with customers, OSATs, suppliers, and ecosystem partners to accelerate business growth and technology adoption.
Serve as the primary technical and business interface to OSATs, assembly partners, material suppliers, and strategic ecosystem collaborators.
Lead joint development activities with external partners to enable future product platforms.
Drive alignment on development schedules, technical milestones, qualification plans, and manufacturing readiness.
Develop scalable manufacturing and sourcing strategies supporting both development and high-volume production.
Lead cross-functional execution across design, process integration, reliability, product engineering, manufacturing, quality, procurement, and supply chain teams.
Identify and mitigate technical, schedule, cost, supply chain, and manufacturing risks.
Communicate program status, investment recommendations, and strategic priorities to senior leadership.
Ensure successful transition of packaging technologies from development into production.
Perform activities safely and responsibly and support Environmental, Health, Safety & Security requirements and programs.

Desired Qualifications

Experience with silicon photonics, optical engines, optical interconnects, or co-packaged optics is preferred.
Experience supporting hyperscale, networking, telecommunications, AI, or datacenter applications is preferred.
A track record of building and scaling high-performing engineering organizations is preferred.
Experience managing technology roadmaps, strategic investments, and customer-facing development programs is preferred.

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries is seeking a Director of Advanced Packaging Development to lead the development and industrialization of advanced packaging solutions for next-generation silicon photonics and optical interconnect products. This leader will be responsible for driving internal packaging development activities while serving as the primary interface to external OSATs, suppliers, ecosystem partners, and key customers.

The successful candidate will partner closely with Product Line Management, Business Development, and engineering organizations to define packaging technology roadmaps, develop differentiated solutions, and enable commercialization of future products. This role requires a unique combination of technical leadership, team development, customer engagement, business partnership, and external ecosystem management.

Essential Responsibilities:

Technical and Organizational Leadership

Lead the advanced packaging development organization responsible for package architecture, assembly processes, qualification strategy, manufacturing readiness, and product industrialization.
Build and develop a high-performing team focused on technical excellence, innovation, and execution.
Drive technology decisions related to package design, materials, thermal management, reliability, manufacturability, and cost optimization.
Establish development methodologies, design guidelines, and qualification strategies to support product scale-up and commercialization.

Roadmap and Strategy

Define and maintain the advanced packaging technology roadmap supporting silicon photonics, optical interconnect, co-packaged optics, AI networking, and future platform developments.
Align packaging investments and development priorities with product roadmaps, customer requirements, and business objectives.
Evaluate emerging technologies, market trends, and supplier capabilities to maintain GlobalFoundries' competitive position.
Drive strategic decisions on technology selection, capability development, and manufacturing approaches.

Customer and Business Engagement

Partner with Product Management and Business Development to shape future product and technology strategies.
Engage directly with customers to understand technology requirements, packaging challenges, and long-term roadmap needs.
Represent GlobalFoundries during customer technical reviews, roadmap discussions, executive briefings, and development engagements.
Support customer acquisition and growth initiatives by translating customer requirements into differentiated packaging solutions.
Build trusted relationships with customers, OSATs, suppliers, and ecosystem partners to accelerate business growth and technology adoption.

External Partner Management

Serve as the primary technical and business interface to OSATs, assembly partners, material suppliers, and strategic ecosystem collaborators.
Lead joint development activities with external partners to enable future product platforms.
Drive alignment on development schedules, technical milestones, qualification plans, and manufacturing readiness.
Develop scalable manufacturing and sourcing strategies supporting both development and high-volume production.

Program Execution

Lead cross-functional execution across design, process integration, reliability, product engineering, manufacturing, quality, procurement, and supply chain teams.
Identify and mitigate technical, schedule, cost, supply chain, and manufacturing risks.
Communicate program status, investment recommendations, and strategic priorities to senior leadership.
Ensure successful transition of packaging technologies from development into production.

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related discipline.
15+ years of experience in semiconductor packaging, advanced packaging, photonics packaging, or related technologies.
Demonstrated experience leading complex technology development organizations and multidisciplinary engineering teams.
Strong knowledge of advanced packaging technologies including flip-chip assembly, wafer-level packaging, optical packaging, high-density interconnects, thermal management, and reliability qualification.
Experience working directly with OSATs, outsourced manufacturing partners, and semiconductor supply chains.
Proven ability to lead strategic customer engagements and external partnerships.
Excellent communication, leadership, and executive presentation skills.

Preferred Qualifications

Experience with silicon photonics, optical engines, optical interconnects, or co-packaged optics.
Experience supporting hyperscale, networking, telecommunications, AI, or datacenter applications.
Track record of building and scaling high-performing engineering organizations.
Experience managing technology roadmaps, strategic investments, and customer-facing development programs.

Role Impact

This position will provide end-to-end leadership for advanced packaging technology development, external manufacturing partnerships, customer engagement, and roadmap execution. The Director will play a critical role in enabling future silicon photonics products, strengthening strategic customer relationships, and positioning GlobalFoundries as a leader in advanced photonics packaging solutions.

Expected Salary Range

$166,500.00 - $290,000.00

The exact Salary will be determined based on qualifications, experience and location.

The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that GlobalFoundries can only nominate and submit an application for a Security Clearance. The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

About the Company

GlobalFoundries

Semiconductor foundry delivering specialized chips

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company size: 10,001+
Company stage: IPO
Headquarters: Town of Malta, New York
Founded: 2009

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