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AttoTude

Photonic interconnects powering AI data centers

EDA and CAD Lead Engineer / Manager

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-time

About the Job

Requirements

  • At least 5 years of hands-on experience in CMOS (bulk and advanced FinFET) IC implementation across multiple process technologies.
  • Strong experience with Cadence and other electronic design automation tools, including Virtuoso, Calibre, and Voltus.
  • Experience providing dedicated tapeout support across multiple tapeouts.
  • Experience with Tcl, Python, Perl, Makefile, and shell scripting.
  • Formal Cadence digital layout training or certification is required.

Responsibilities

  • Perform floor planning and IP integration.
  • Create pad rings.
  • Work with analog and mixed-signal designers on high-performance layout integration.
  • Work with digital designers on DFT, ATPG, and scan logic integration.
  • Perform LVS and DRC checks and resolve issues.
  • Integrate digital, RF, and mmWave blocks into the IC top level.
  • Collaborate with cross-functional teams to support timely project execution and design tape-outs.
  • Stay current with trends and technologies in wideband high-speed IC design and apply them to improve project outcomes.
  • Travel occasionally to the Bay Area (<20%).

Desired Qualifications

  • Experience with CMOS and/or SiGe process development kits.
  • Experience working on a multidisciplinary team with RF/mixed-signal, hardware, firmware, and software engineers.
  • Experience delivering high-quality designs on time in fast-paced environments.

About the Company

AttoTude

Photonic interconnects powering AI data centers

AttoTude designs and sells advanced interconnect technology for data centers, focusing on AI workloads. Its main products are photonic interconnect solutions built on photonic integrated circuits and optical communications that move data at very high speeds with low bottlenecks. These interconnects connect servers, switches, and storage to enable high-speed parallel processing and supercomputing, reducing latency and increasing bandwidth in large-scale deployments. The company differentiates itself by concentrating on photonics-based networking to address AI-specific data center bottlenecks, serving large operators and enterprises through direct sales and licensing. Its goal is to help data centers scale AI capabilities efficiently by providing reliable, high-performance interconnects that support demanding workloads and future growth.

Company size
51-200
Company stage
Series C
Total funding
$131M
Headquarters
Menlo Park, CA
Founded
2024

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