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Micron Technology

Makes memory and storage chips for AI and PCs

Front End Central Product Integration Senior Manager

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listed

About the Job

Requirements

  • Good logical thinking and knowledge of semiconductor fabrication process flows, interactions among different processes, and how changes affect yield, device performance, and reliability.
  • Understanding of DRAM and NAND operation and structure to decipher parametric, probe, and qualification data from both front-end and backend assembly processes.
  • Good model-based problem-solving, data-driven decision-making, and presentation skills.
  • Proven ability to troubleshoot and solve structure- and device-related issues and address root causes.
  • Good organizational capabilities and ability to work effectively.
  • Ability to be flexible with job responsibilities and take initiative to assume added responsibilities.
  • Ability to travel to Micron sites as necessary for face-to-face collaboration.
  • Strong interpersonal skills and ability to maintain customer and coworker relationships.
  • Demonstrated teamwork skills with a focus on developing good team dynamics.
  • Good multitasking, verbal, and written communication skills.
  • More than 7 years of relevant industry experience and knowledge.
  • A bachelor's, master's, or PhD in Electrical Engineering, Materials Engineering, Materials Science, Physics, or Chemical Engineering is optional for candidates with more than 10 years of experience in a semiconductor industry process-related role.

Responsibilities

  • Lead product integration loop structural uniformity and cross-loop integration projects for critical loops, such as capacitance loops, to address yield and quality challenges; collaborate with cross-module process and product-integration technical experts and suppliers to improve integration structures and achieve best-in-class yield performance.
  • Build model-based root-cause analysis and enhance critical inline defense for structures, including uniformity.
  • Maintain and enhance product-integration programs, loop-domain knowledge, and technical expertise; explore innovation opportunities through strategic thinking and a systematic approach.
  • Implement node-over-node shift-left uniformity, bevel, and backside best-known methods at early development stages to accelerate overall wafer and edge yield and quality ramping.
  • Promote worldwide synergy and improve benchmark performance and efficiency through global project management and execution, leveraging and enhancing network best-known methods, and creating and re-engineering business processes.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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