Cloud DevOps Engineer - Multiple Teams
About the job
- At least 6 years of hands-on DevOps or cloud infrastructure experience.
- Strong AWS experience, including EC2, EKS, ECS, RDS, S3, Route 53, and VPC networking.
- Strong Terraform experience.
- Strong knowledge of Kubernetes fundamentals, including networking, workloads, ingress, scaling, and troubleshooting.
- Experience with CI/CD systems such as Jenkins or GitLab CI, or equivalent systems.
- Solid Linux skills.
- Ability to write and maintain automation scripts and tools using Python, Go, Bash, or PowerShell.
- Understanding of software development life cycle and microservices deployment patterns.
- Build and maintain AWS infrastructure for production and non-production environments.
- Develop and own infrastructure as code using Terraform.
- Operate and support Kubernetes workloads on EKS, including deployments, scaling, upgrades, and troubleshooting.
- Improve CI/CD pipelines and release automation using Jenkins or GitLab CI.
- Implement automation and tooling in Python, Go, Bash, or PowerShell to reduce manual work.
- Improve monitoring and alerting for AWS and Kubernetes using Prometheus or New Relic.
- Participate in an on-call rotation and drive operational improvements after incidents.
- Windows experience.
- AWS CDK using TypeScript or Python, or CloudFormation.
- Jenkins experience.
- Experience with Lambda, OpenSearch, Redis, AMQ, MySQL, or FSx.
- Strong AWS networking and security experience, including Transit Gateway, VPC peering, routing, and security groups or network access control lists.
- Active Directory, DNS, and domain fundamentals.
About the company
Renesas Electronics designs and manufactures semiconductor components, including microcontrollers, system-on-a-chip solutions, and analog and power devices for automotive, industrial, infrastructure, and IoT markets. Its chips serve as building blocks inside customers’ electronic products, and it offers Winning Combinations—pre-tested system architectures that combine Renesas parts with technologies from its acquisitions to speed development. The company differentiates itself through a broad, integrated portfolio built via acquisitions and a planned unified digital design platform that streamlines integration with hardware and software. Its goal is to be a leading supplier of MCUs, SoCs, and analog/power devices while providing a single, connected design ecosystem that shortens customers’ development cycles.
Company Size
10,001+
Company Stage
IPO
Headquarters
Tokyo, Japan
Founded
2002
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Simplify's Take
What believers are saying
- Renesas launched 650V dual-side-cooled GaN on September 30, 2026 for megawatt AI data centers.
- Renesas completed Altium on May 29, 2026 and Pictorus on June 18, 2026.
- TIER IV collaboration on August 20, 2026 expands Renesas into open autonomous-driving platforms.
What critics are saying
- Renesas sued Navitas on July 22, 2026, and Navitas countersued August 10, 2026.
- Takasaki factory production ends within two to three years, signaling legacy manufacturing strain.
- GaN and autonomous-driving bets face execution risk if AI-data-center and SDV wins slip.
What makes Renesas Electronics unique
- Altium plus Pictorus unify Renesas 365, spanning design, simulation, and deployment.
- R-Car Gen 5 anchors open Autoware partnerships across Level 2+ to Level 4 autonomy.
- Renesas leads automotive MCU, analog, and power silicon for high-reliability embedded systems.
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Benefits
Health Insurance
Life Insurance
Mental Health Support
Professional Development Budget
Meal Benefits
Growth & Insights and Company News
6 month growth
↓ -21%1 year growth
↓ -30%2 year growth
↓ -30%Renesas Electronics has launched the industry's first 650V gallium nitride device with dual-side cooling for AI data centres. The TP65H020G4PLSGBD delivers 20 milliohms on-resistance in an 8x8mm package, 57% smaller than existing alternatives. The device targets 800V DC/DC intermediate bus converters in megawatt-scale data centres, addressing space and thermal constraints as rack power approaches megawatt levels. Dual-side cooling reduces top-side thermal impedance by 10% whilst maintaining compatibility with standard silicon gate drivers. Renesas is currently sampling the device to major data centre manufacturers. A 6kW reference design achieved 2.6 kW/in³ power density with 0.21% higher efficiency than equivalent alternatives. Mass production is planned for mid-2027. The device will be showcased at OCP Global Summit in San Jose, California, from 12-15 October.
The Autoware Foundation has partnered with Renesas Electronics to deliver open-source AI software for advanced driver assistance systems and autonomous driving. Renesas has joined the foundation at its highest membership tier. The collaboration integrates Autoware's end-to-end AI stack with Renesas R-Car system-on-chip platforms. This enables automotive manufacturers and Tier-1 suppliers to develop scalable solutions ranging from entry-level L2 driver assistance to L2++ hands-free autopilot and L4 robotaxis. The partnership allows OEMs to customise the Apache 2.0-licensed software for specific vehicles and use cases, offering a flexible alternative to in-house development or commercial solutions. The companies describe this as a watershed moment for the industry, comparing it to Linux's impact on computing. "This is the Linux moment for the ADAS and autonomous driving industry," said Christian John, board director at the Autoware Foundation.
Renesas Electronics has opened a Physical AI & Robotics Lab in Beijing to help customers develop and validate next-generation robotic systems. The facility will support the company's physical AI strategy, focusing on systems that perceive, decide and act in real time in physical environments. Physical AI represents AI's evolution beyond digital applications into robotics and other real-world systems. The lab will integrate hardware, software, AI modelling, control, power supply and sensing to support complete solution development. Renesas currently addresses roughly 30% of the humanoid robot bill of materials and aims to expand that to 70%. The company established a Physical AI Division on 1 July 2026 to focus on this growth area. The Beijing lab will serve as a platform connecting customers, ecosystem partners, universities and startups to accelerate robotics innovation in China's thriving robotics market.
TOKYO, Japan, March 30, 2019 JST | San Jose, California, U.S.A., March 29, 2019 PST― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
TIER IV is collaborating with Renesas Electronics to build an open AI-native computing platform for software-defined vehicles. The partnership combines TIER IV's Autoware autonomous driving software and reference AI models with Renesas' R-Car Gen 5 automotive system-on-chips. The collaboration aims to deliver scalable solutions spanning Level 2+ advanced driver assistance through Level 4 autonomous driving. TIER IV will port and optimise Autoware on R-Car Gen 5 SoCs and deploy its end-to-end autonomous driving AI models on the platform. The companies will jointly promote this integrated hardware and software platform to automakers and Tier 1 suppliers worldwide. TIER IV plans to demonstrate Autoware and its reference AI models running on Renesas' R-Car X5H at Automotive World 2026 in September at Makuhari Messe near Tokyo.