Software Systems Hardware Integration Intern

[Insight] OFC 2026 - connecting the world. The Optical Fiber Communication Conference and Exposition (OFC) was hosted at the Los Angeles Convention Center from March 17-19, 2026. As the world's largest annual event in optical communications, the OFC not only celebrated its 50th anniversary in 2025 but also attracted interest at OFC 2026 due to the rise of generative AI technology. This year, over 706 industry leaders from 91 countries worldwide convened, along with 115 guest speakers and more than 17,800 attendees. Together, they addressed key global issues, including quantum networking, artificial intelligence (AI), space optics, and data center connectivity, to offer solutions. Topic One: Micro LED CPO ams OSRAM has accumulated nearly 15 years of experience in Micro LED technology through its Micro LED headlight module, EVIYOS. In addition, the company has been actively developing Micro LED solutions for optical communications together with end customers for more than three years. Building on this foundation, ams OSRAM is preparing for the introduction of its own Micro LED-based optical datacom products, targeting a market launch in 2027. These solutions are expected to combine Micro LED emitters, optics, and dedicated ASICs. Microsoft MOSAIC proposed a Micro LED CPO architecture, with MediaTek providing the AOC integration solution. Avicena showcased its LightBundle eKit demo at OFC, achieving a low bit error rate (BER) of <=10[−]9 and a transmission distance of 5 meters at 512 Gbps. Avicena indicated that its 512 Gbps Micro LED optical interconnect is ready for market, and its 896 Gbps solution will be launched in 2Q26. bEMC In response to the optical communication market, bEMC offers 4-inch semi-polar COW and 6-inch semi-polar COC. The company can also provide Micro LED CPO solutions (including coupling) through supply chain integration. Topic Two: Infrared Optical Communications Lumentum has actively ramped up its capacity for 100 / 200 Gbps EMLs and 70 / 100mW CW LDs, while launching new high-bandwidth EML products delivering 400 Gbps/Lane to meet the market demand for 3.2 Tbps connectivity. Meanwhile, the company successfully launched 400mW CW LDs in 2025, followed by the introduction of 800mW CW LDs at OFC. The latter offer >800mW optical power at 50°C, with <100 kHz linewidth and >40 dB side mode suppression ratio (SMSR), significantly improving signal quality in optical communications. In addition, the company has showcased 1,060nm VCSEL optical interconnection solutions. Coherent is ramping 6-inch InP wafer manufacturing to support high-volume production, while developing 400mW CW laser for silicon photonics based pluggable transceivers and co-packaged optics. To meet the emerging market demand for 3.2Tbps connectivity, the company demonstrated two solutions: one for 420Gbps/Lane EMLs and the other for 420Gbps silicon photonics PICs. Moreover, it partnered with three DSP industry leaders, Broadcom, NVIDIA, and Marvell, to develop 1.6Tbps FRO/TRO transceivers. LPO transceivers, in particular, remove the need for DSPs. Despite a higher bit error rate and a limited range of applications, the LPO approach can significantly reduce power consumption and address thermal issues, making it a particularly attractive solution alongside SiPh CPO designs. WIN Semiconductors is the world's largest 150mm GaAs foundry. Standing out from other GaAs suppliers, the company offers turnkey solutions including epi-wafer, chip fabrication, AOI inspection, and coating. WIN Semiconductors has developed Ridge Waveguide (RWG) and Buried Heterostructure (BH) technologies for CW LDs. Compared with RWG, BH delivers higher current density and output power. Comparatively, backside-emitting VCSELs feature flip-chips and etching directly into GaAs substrates, along with the combination of micro bumps and micro lenses to minimize parasitic effects. This approach effectively improves product characterization and enables a smaller package design, making it suitable for 100 Gbps or 100 m optical communications and 3D sensing solutions for automotive or consumer electronics. Dexerials acquired Kyoto Semiconductor and successfully launched 200 Gbps InGaAs photodiodes. These photodiodes feature a low dark current of only 10nA at 2V, a bandwidth of 50 GHz, and a responsivity of 0.7 A/W. Mitsubishi Electric has successfully launched a 100 Gbps uncooled EML and a 200 Gbps cooled EML. 200 Gbps uncooled EML is to be released in the next phase, aiming for short-range transmission around 100 meters. AOI With a portfolio spanning EMLs / CW LDs, photodiodes, and transceivers, the company recently secured a purchase order worth over USD 200 million for 1.6 Tbps transceivers. At the OFC, AOI demonstrated the high stability of its 800 Gbps / 1.6 Tbps transceivers and the testing results obtained from its 6.4 Tbps OBO optical engines. These devices are made with AOI's 400mW LDs and paired with SiPh PICs, achieving highly efficient optical communications using a 32 x 200 Gbps/Lane signaling technology. Optoway Specializing in EML / CW LD chips, package, and transceivers, offers 100 / 200 Gbps EMLs and 70 / 100mW CW LDs, alongside transceiver customization services. LuxNet is dedicated to EML / CW LD chips, package, and transceiver foundry services, and has developed a similar portfolio featuring 100 / 200 Gbps EMLs and 70 / 100mW CW LDs. NTT Innovative Devices showcased its 102.4 Tbps SiPh CPO, which integrates a Broadcom third-generation Ethernet switch, Tomahawk 6, and is compatible with ELSFPs from four suppliers, including CPT, Furukawa, FIT, and O-NET, achieving 102.4 Tbps with 16 units of 16.4 Tbps optical engines. Cisco showcased its 51.2 Tbps SiPh CPO, equipped with 64 units of 800 Gbps FR8 optical engines, a complete liquid cooling solution, and a monitoring system. Its product lifespan meets the requirements of cloud service providers. OFC 2026 Takeaways * Wide and Slow: Driven by the surge of generative AI, demand for high-speed optical communications is accelerating. Micro LEDs boast low power consumption of 1-2 pJ/bit, bandwidth density up to 20 Tbps/mm[2], and a low bit error rate (BER) of <=10[−15], making them well-positioned as a promising alternative to copper interconnects and the go-to solution for short-range, high-speed intra-rack connectivity in scale-up data center networking. In parallel, suppliers including Lumentum and Coherent are launching VCSEL NPO solutions to meet the short-reach transmission demand. * Investment and R&D: To meet the bandwidth requirements beyond 1.6 Tbps, EML and CW LD players are aggressively expanding capacity. In addition, Dexerials is scaling its photodiode production footprint to enhance product performance in terms of sensitivity and response time. * Short Term and Long Term: To address the escalating energy and thermal bottlenecks in data centers, linear pluggable optics (LPO) and SiPh CPO technology have emerged as new market spotlights. TrendForce 2026 Infrared Sensing Application Market and Branding Strategies Release: 01 January 2026 Format: PDF / EXCEL Language: Traditional Chinese / English Page: 168 TrendForce 2025 Micro LED Display and Non-Display Application Market Analysis Release: 29 May / 30 November 2025 Languages: Traditional Chinese / English Format: PDF Page: 119 | If you would like to know more details, please contact: | Global Contact: | / | ShenZhen: | | Grace Li E-mail: [email protected] Tel: +886-2-8978-6488 ext.916 | / | Perry Wang E-mail: [email protected] Tel: +86-755-82838931 ext.6800 Disclaimers of Warranties 1. The website does not warrant the following: 1.1 The services from the website meets your requirement; 1.2 The accuracy, completeness, or timeliness of the service; 1.3 The accuracy, reliability of conclusions drawn from using the service; 1.4 The accuracy, completeness, or timeliness, or security of any information that you download from the website 2. 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Avicena has launched the LightBundle eKit, the industry's first evaluation platform for microLED optical connectivity in AI infrastructure. The kit enables hyperscalers and AI system architects to test next-generation optical links designed to overcome bandwidth, reach and energy limitations of copper interconnects. The platform integrates 320 microLED data channels supporting up to 896 Gbps throughput with 5-metre and 10-metre optical fibre connectivity. It achieves raw bit error rates better than 10⁻¹² at 512 Gbps without forward error correction. MicroLED technology eliminates lasers entirely, enabling reliable low-energy operation at elevated temperatures whilst delivering terabit-per-millimetre bandwidth density. The LightBundle eKit will be available to select partners in March 2026, with broader availability planned for Q2 2026. Avicena is demonstrating the technology at OFC 2026 in booth 324.