ASM International

Semiconductor deposition equipment and ALD tech

Senior Engineer 1 - Key Account Technology, Peald Mxnt

Implementation & Technical Account ManagementConfirmed live in the last 24 hours

Full-timeHwaseong-si, Gyeonggi-do, South KoreaNo salary listed

About the Job

Requirements

A Ph.D. or Master's degree in Chemical Engineering, Materials Science and Engineering, Chemistry, Applied Chemistry, Physics, Electrical Engineering, Semiconductor Engineering, or a closely related technical discipline is required.
A strong academic foundation in thin-film deposition, surface chemistry, plasma processing, semiconductor materials, vacuum technology, or semiconductor process integration is required.
A Ph.D. holder must have 4–8+ years of relevant industry experience, or a Master's degree holder must have 7–10+ years of relevant industry experience.
Hands-on experience in atomic layer deposition or plasma-enhanced atomic layer deposition thin-film deposition is required; experience with metal oxide and/or metal nitride films or related materials is preferred.
Experience in semiconductor device manufacturing, process development, integration, application engineering, or the capital equipment industry is required; customer support for logic, memory, foundry, CMOS image sensor, or advanced packaging customers is preferred.
Background in roles such as Process Engineer, Integration Engineer, Application Engineer, Key Account Technologist, Field Process Engineer, or Technical Customer Support is highly preferred.
A solid understanding of semiconductor process integration, plasma-surface interactions, thin-film characterization, and high-volume manufacturing requirements for advanced technology nodes is required.
Ability to solve complex technical problems through data-driven analysis, customer escalation management, structured root cause analysis, corrective action planning, and cross-functional execution is required.
Experience supporting new product introduction, process qualification, technology transfer, customer demonstrations, or high-volume manufacturing ramp activities at customer sites is required.
Strong analytical skills and experience interpreting process, metrology, and device-relevant data, including thickness, uniformity, conformality, composition, resistivity, stress, refractive index, roughness, particles, and throughput, are required.
Strong communication skills to engage effectively with customer research and development, manufacturing, and internal global teams are required.
Fluency in English and the primary language of the customer organization is required, with the ability to communicate complex technical topics clearly and effectively.

Responsibilities

Act as the primary technical interface for key customers, supporting plasma-enhanced atomic layer deposition metal oxide and metal nitride process development, evaluation, qualification, and production while building strong relationships with customer research and development, integration, and manufacturing teams.
Drive new product introduction, demonstrations, joint development projects, process technology optimization and readiness, and high-volume manufacturing support activities at customer sites; lead hands-on deployment and implement business-unit-developed best known methods, continuous improvement projects, and process improvements.
Execute and support customer-specific design of experiments, process optimization, demonstrations, and troubleshooting for current and emerging plasma-enhanced atomic layer deposition MXNT materials.
Diagnose and resolve complex process, film-property, integration, and equipment issues across development and production environments, including root cause analysis, corrective actions, particle reduction, thickness and uniformity improvement, and process stability enhancement.
Monitor tool and process performance against customer specifications, including film thickness, uniformity, conformality, stress, resistivity, optical properties, thermal properties, particles, throughput, and uptime.
Understand customer device roadmaps and integration challenges, and align ASM plasma-enhanced atomic layer deposition MXNT solutions with future node requirements in patterning, hard mask, spacer, liners, CMOS image sensor optics, thermal management, and emerging memory applications.
Collaborate with global research and development, Product Marketing, GPS/TPS, hardware engineering, service, and account teams to drive continuous product improvement and translate customer requirements into product and technology development inputs.
Support alignment between customer needs, ASM plasma-enhanced atomic layer deposition MXNT product strategy, and business-unit priorities while maintaining a customer-facing, solution-oriented approach.
Participate in approximately six months of training at research and development centers in Japan or Korea to build understanding of ASM plasma-enhanced atomic layer deposition technology, product platforms, process best known methods, and customer engagement practices.

Desired Qualifications

Experience working directly with key semiconductor accounts such as Samsung, SK hynix, TSMC, Intel, Micron, Sony, imec, Rapidus, or leading China-based customers.
Hands-on experience with plasma-enhanced atomic layer deposition metal oxide or metal nitride systems, especially DCM, QCM, QCM TiO XS, or related atomic layer deposition/plasma-enhanced atomic layer deposition platforms.
Experience leading customer technology evaluations for patterning spacer, hard mask, liners, optical materials, bonding layers, or emerging metal hard mask applications.
Ability to influence cross-functional teams and drive technical strategy across process development, product marketing, hardware engineering, service, GPS/TPS, and account teams.
Deep understanding of how plasma-enhanced atomic layer deposition enables low-temperature processing, high conformality, atomic-level thickness control, tunable film properties, and differentiated integration solutions compared with physical vapor deposition, plasma-enhanced chemical vapor deposition, or thermal atomic layer deposition approaches.

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's mission

As a Senior Engineer I, Key Account Technology (KAT) at ASM, you will serve as a key technical interface for strategic customers, driving new technology introduction and successful customer adoption of PEALD metal oxide and metal nitride processes, including TiO, TiN, and emerging MXNT materials for advanced logic, memory, CIS, and packaging applications.

This role combines deep thin-film process expertise, plasma process understanding, and strong customer engagement. You will support NPI, demos, JDP/PTOR/DTOR activities, process qualification, HVM ramp, and technical escalations while translating customer requirements and roadmap needs into actionable inputs for ASM product, process, and technology development.

Selected candidates will participate in approximately 6 months of training in the Japan or Korea research and development centers to build deep understanding of ASM PEALD technology, product platforms, process BKMs, and customer engagement practices.

What you will be working on

Act as the primary technical interface for key customers, supporting PEALD metal oxide and metal nitride process development, evaluation, qualification, and production while building strong relationships with customer R&D, integration, and manufacturing teams
Drive NPI, demo, JDP, PTOR/DTOR, and HVM support activities at customer sites, leading hands-on deployment and implementing BU-developed BKMs, CIPs, and process improvements
Execute and support customer-specific DOE, process optimization, demo, and trouble-shooting activities for current and other emerging PEALD MXNT materials
Diagnose and resolve complex processes, film-property, integration, and equipment issues across development and production environments, including root cause analysis, corrective actions, particle reduction, thickness/uniformity improvement, and process stability enhancement
Monitor tool and process performance against customer specifications, including film thickness, uniformity, conformality, stress, resistivity, optical properties, thermal properties, particles, throughput, and uptime
Understand customer device roadmaps and integration challenges, and align ASM PEALD MXNT solutions with future node requirements in patterning, hard mask, spacer, liners, CIS optical, thermal management, and emerging memory applications
Collaborate with global R&D, Product Marketing, GPS/TPS, hardware engineering, service, and account teams to drive continuous product improvement and translate customer requirements into product and technology development inputs
Support alignment between customer needs, ASM PEALD MXNT product strategy, and BU1 business priorities while maintaining a strong customer-facing and solution oriented mindset

What we are looking for

Required educational background: Ph.D. or Master’s degree in Chemical Engineering, Materials Science and Engineering, Chemistry, Applied Chemistry, Physics, Electrical Engineering, Semiconductor Engineering, or a closely related technical discipline
Strong academic foundation in thin-film deposition, surface chemistry, plasma processing, semiconductor materials, vacuum technology, or semiconductor process integration is required
Experience requirements: Ph.D. with 4-8+ years of relevant industry experience, or Master's degree with 7-10+ years of relevant industry experience
Hands-on experience in ALD or PEALD thin-film deposition, preferably with metal oxide and/or metal nitride films or related materials
Experience in semiconductor device manufacturing, process development, integration, application engineering, or capital equipment industry, preferably supporting logic, memory, foundry, CIS, or advanced packaging customers
Background in roles such as Process Engineer, Integration Engineer, Application Engineer, Key Account Technologist, Field Process Engineer, or Technical Customer Support is highly preferred
Solid understanding of semiconductor process integration, plasma-surface interactions, thin-film characterization, and high-volume manufacturing requirements for advanced technology nodes
Proven ability to solve complex technical problems through data-driven analysis, customer escalation management, structured root cause analysis, corrective action planning, and cross-functional execution
Experience supporting NPI, process qualification, technology transfer, customer demos, or HVM ramp activities at customer sites
Strong analytical skills with experience interpreting process, metrology, and device-relevant data such as thickness, uniformity, conformality, composition, resistivity, stress, refractive index, roughness, particles, and throughput
Strong communication skills to engage effectively with customer R&D, manufacturing, and internal global teams
Fluent in English and the primary language of the customer organization, with the ability to communicate complex technical topics clearly and effectively

What sets you apart

Experience working directly with key semiconductor accounts such as Samsung, SK hynix, TSMC, Intel, Micron, Sony, imec, Rapidus, or leading China-based customers
Hands-on experience with PEALD metal oxide or metal nitride systems, especially DCM, QCM, QCM TiO XS, or related ALD/PEALD platforms
Experience leading customer technology evaluations for patterning spacer, hard mask, liners, optical materials, bonding layers, or emerging metal hard mask applications
Ability to influence cross-functional teams and drive technical strategy across process development, product marketing, hardware engineering, service, GPS/TPS, and account teams
Deep understanding of how PEALD enables low-temperature processing, high conformality, atomic-level thickness control, tunable film properties, and differentiated Integration solutions versus PVD, PECVE, or thermal ALD approaches
Strong customer-facing mindset with the ability to build long-term trust

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Almere, Netherlands
Founded: 1968

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