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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Engineer - Frontend Organizations Central Team, Dry Etch Process

Process EngineeringConfirmed live in the last 24 hours
Full-timeHiroshima, JapanNo salary listedIn-person

About the Job

Requirements

  • Proven experience in plasma process and hardware improvement and development within the semiconductor industry, specifically in Dry Etch.
  • Skill in developing and implementing hardware continuous improvement program roadmaps and start-up acceptance criteria for dry etch chambers and consumable parts.
  • Analytical skills for evaluating, promoting, and planning new etch platforms, chemistries, and chamber kits, such as new electrode materials, edge rings, focus rings, and showerheads.
  • Tangible results in boosting tool performance, establishing process parameters, and streamlining process management projects.
  • Ability to adhere to safety, quality, and sustainability standards while driving innovative solutions.
  • Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials), Physics, Materials Science, or a related field, or equivalent experience.
  • Extensive experience in semiconductor equipment and process management in Dry Etch, using LAM Kiyo, Flex, Vantex, Versys, TEL Tactras, RK, AMAT Sym3, Centura, or equivalent platforms.
  • Proven track record in maturing tool performance and establishing plasma process parameters for dry etch equipment.
  • Experience in abnormal analysis, including FDC, statistical process control excursions, and chamber-matching deviations, and improvement, with a successful project implementation history across DRAM and/or NAND flows.

Responsibilities

  • Strategize and lead productivity, yield, quality, and cost improvement engagements with global sites and the network team through plasma process optimization, new or first-of-a-kind chemistry and hardware qualification, and continuous improvement program development with dry etch suppliers.
  • Collaborate with cross-functional teams to drive defect reduction, particle and residue control, critical-dimension uniformity, profile control, and chamber matching across the global fleet.
  • Develop the process and hardware continuous improvement program roadmap for Dry Etch, covering chamber parts, radio-frequency and match networks, gas delivery, electrostatic chuck, endpoint, and plasma source upgrades.
  • Drive process and hardware improvement focused on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules, including Conductor Etch, Dielectric Etch, Poly/Gate Etch, Metal Etch, High-Aspect-Ratio Etch, Spacer/ALE, and others.
  • Partner with suppliers to establish equipment start-up acceptance criteria, chamber qualification flows, and tool service requirements; work with global facilities on new tool installation requirements, including abatement, exhaust, radio-frequency compliance, and gas and chemical infrastructure.
  • Improve tool efficiency, wafers per day, and utilization across Micron Dry Etch fleets through benchmarking, MAXOUT-style productivity programs, and pathfinding solutions.
  • Set up Internet of Things/Factory Data Collection sensors and advanced chamber telemetry for defense-line strengthening in Dry Etch tools, and develop solutions for excursion prevention and chamber-health monitoring.
  • Establish and improve process windows and recipe robustness, upgrade process capability for critical dimension, profile, selectivity, aspect-ratio-dependent etching, and line-edge/line-width roughness control, and reduce production costs through consumable lifetime extension and gas usage optimization.
  • Enable solutions for energy savings through radio-frequency power optimization and eco-mode, perfluorocarbon and fluorinated-gas abatement, and waste reduction aligned with sustainability targets.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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