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GlobalFoundries

Semiconductor foundry delivering specialized chips

Quantum Ion Trap Integration Engineer

Full-TimeUpdated on 10/23/2026
$118k - $210k
Expert
Bachelor's, Master's, PhD, Associate's
Malta, NY, USA+1 moreMore locations: Essex Junction, VT, USA
In Person
Manufacturing & Process EngineeringProcess Engineering
Company Does Not Provide H1B Sponsorship

About the job

Requirements
  • An associate degree, Bachelor of Science, Master of Science, or PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related technical discipline.
  • At least 15 years of semiconductor process integration, technology development, or advanced manufacturing experience.
  • Demonstrated expertise in semiconductor integration, process development, or technology commercialization.
  • Experience leading cross-functional technical programs or major development initiatives.
  • Strong analytical, experimental design, and problem-solving capabilities.
  • Ability to clearly communicate complex technical concepts to engineering and leadership audiences.
Responsibilities
  • Lead development of semiconductor integration architectures supporting quantum computing platforms.
  • Define integration strategies spanning front-end devices, back-end-of-line routing, photonic interfaces, advanced packaging, interconnect technologies, and quantum-specific process modules.
  • Develop and maintain technology roadmaps supporting long-term scalability, manufacturability, and qualification of quantum hardware.
  • Identify critical technology gaps and drive closure plans through internal development and external collaborations.
  • Lead definition and execution of integrated process flows, module interactions, process windows, and technology learning cycles.
  • Drive integration optimization using design of experiments methodologies, statistical analysis, and yield learning techniques.
  • Establish integration checkpoints, performance metrics, and technical success criteria.
  • Evaluate technology tradeoffs involving performance, manufacturability, reliability, yield, cost, and scalability.
  • Collaborate with device engineering, process module teams, manufacturing, reliability, modeling, design enablement, and packaging organizations.
  • Translate quantum system requirements into actionable semiconductor technology requirements and development plans.
  • Support customer and partner engagements through technical presentations, roadmap discussions, and program reviews.
  • Contribute to externally funded programs, strategic partnerships, and joint development agreements.
  • Analyze electrical, physical, reliability, and metrology data to identify integration challenges and improvement opportunities.
  • Lead root-cause investigations and corrective action planning for integration-related issues.
  • Develop predictive models and learning frameworks that accelerate technology maturation.
  • Mentor junior engineers and MTS-level contributors.
  • Provide technical guidance across integration disciplines.
  • Influence organizational technical direction through expert knowledge and demonstrated execution.
  • Contribute to invention disclosures, publications, patents, and technology strategy planning.
  • Perform activities safely and responsibly and support Environmental, Health, Safety and Security requirements and programs.
Desired Qualifications
  • Experience with advanced semiconductor integration, back-end-of-line technologies, photonics integration, advanced packaging, or heterogeneous integration.
  • Knowledge of quantum computing hardware architectures, ion trapping technologies, photonic systems, or cryogenic electronics.
  • Experience supporting advanced research and development programs funded through government, commercial, or academic partnerships.
  • Familiarity with manufacturing execution systems and foundry processing.
  • Experience transitioning emerging technologies from research into development or manufacturing environments.

About the company

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify's Take

What believers are saying

  • Marvell expanded SiGe capacity on September 17, 2026, signaling demand through 2027.
  • Commerce finalized a $375 million R&D award on September 8, 2026, plus a July $300 million framework.
  • SMART Photonics partnered with GF on September 21, 2026, widening its photonics platform and customer funnel.

What critics are saying

  • Smart mobile is 36% of revenue, and management expects low-teens decline in 2026.
  • Tower Semiconductor litigation in Texas and the ITC risks injunctions, distraction, and patent retaliation.
  • If AI photonics demand normalizes before 2027, GF's growth story reverts to commoditized mature-node fabs.

What makes GlobalFoundries unique

  • GlobalFoundries abandoned bleeding-edge nodes in 2018, specializing in feature-rich chips for autos and connectivity.
  • Its Malta, Burlington, Dresden, and Singapore footprint sells trusted regional supply to governments and enterprises.
  • GF owns uncommon SiGe, silicon photonics, and FDX process depth for optical and edge chips.

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Benefits

  • Professional Development Budget

Growth & Insights and Company News

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Yahoo Finance
Oct 15th, 2026
US doubles GlobalFoundries stake to about 8% in deal with up to $21B Japan-backed chip plants

The US government has doubled its equity stake in chipmaker GlobalFoundries to nearly 8%, President Donald Trump announced Wednesday. He said the stake is now "worth over 2 Billion Dollars" in a company with a market capitalisation of about $27.2 billion. The deal reallocates a $955 million award under the 2022 Chips and Science Act toward modernising the company's facilities. GlobalFoundries said the government is taking an additional stake of about 4%. A new vehicle co-owned by the US and Japanese governments will fund two fabrication plants, described as "up to $21 billion" in investment, with about $10 billion initially. GlobalFoundries will build and operate them, and expects about $3 billion in compensation over the next decade. The first plant is due online in 2029, the second in 2031.

Guggenheim Partners
Oct 14th, 2026
GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative | GlobalFoundries

GF has been selected as the technology provider and operator for two new fabs at its Malta, New York, site under a U.S.-Japan initiative.

Sohu
Oct 14th, 2026
GlobalFoundries to build two New York chip plants with up to $21B from Japan, US to take 4% stake

GlobalFoundries will build two new chip factories at its existing site in upstate New York, according to a deal announced on October 14. Japan's government will provide up to $21 billion in funding. The US government will buy about 4% of the company's shares. The two plants will be jointly held by the US and Japan. The new factories will make basic chips, reducing reliance on suppliers in East Asia.

Bloomberg
Oct 14th, 2026
GlobalFoundries to build two chip plants with up to $21B in Japanese backing

GlobalFoundries Inc. plans to build two new chip plants with backing of as much as $21 billion from the Japanese government. The arrangement is part of a US-Japan deal that also includes the US taking a 4% stake in the company.

Yahoo Finance
Oct 8th, 2026
TSMC signs $2B deal with GlobalFoundries for AI chip silicon interposers at New York plant

GlobalFoundries shares rose nearly 6% Thursday after announcing a $2 billion manufacturing deal with Taiwan Semiconductor Manufacturing Company to produce silicon interposers at its New York facility. The five-year agreement will support expanded manufacturing capacity, with volume production expected to begin in the first half of 2028. The facility is set to become the first US-based source of silicon interposers for advanced packaging technologies. These components are crucial for TSMC's Chip-on-Wafer-on-Substrate technology, which connects AI processors with high-bandwidth memory. The deal addresses constraints in TSMC's CoWoS packaging capacity, which has become a bottleneck for AI chip production. Counterpoint Research estimates the supply-demand gap could remain around 20% in 2026 before narrowing to roughly 10% in 2027.