Full-Time
Wireless Systems Applications Engineer 2
Applications
Microchip Technology
10,001+ employees
Provides embedded hardware, software, tools
No salary listed
Chennai, Tamil Nadu, India
In Person
Bachelor's, Master's
 Solution Engineering |
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- A Bachelor's degree in Electrical Engineering, Computer Engineering, or Computer Systems Engineering, or a Master's degree in Electrical Engineering, Computer Engineering, or Computer Systems Engineering.
- Experience developing embedded software, including bare-metal and framework-based development.
- Hands-on experience programming in C and C++.
- Understanding of wireless technologies and experience integrating and debugging protocol stacks.
- Knowledge of protocol stacks and the OSI networking model, particularly Wi-Fi, Bluetooth/Bluetooth Low Energy, and IEEE 802.15.4.
- Experience with a real-time operating system such as FreeRTOS, Zephyr, or Linux-based systems.
- Experience with 8-, 16-, or 32-bit microcontrollers and peripherals such as analog-to-digital converters, digital-to-analog converters, pulse-width modulation, real-time clocks, watchdog timers, and timers/counters.
- Knowledge of communication interfaces including I2C, SPI, UART, CAN, and USB.
- Proficiency using digital oscilloscopes, logic analyzers, and protocol sniffers.
- Ability to debug complex system-level embedded issues.
- Strong written and spoken English communication skills.
- Strong customer support, presentation, and interpersonal skills.
- Ability to work effectively in a dynamic, global, and virtual team environment.
- Strong analytical and problem-solving skills.
- Good organizational and project management skills, including schedule and status reporting.
- Develop innovative solutions to address design challenges and issues reported by global clients.
- Collaborate with internal engineering teams and fellow applications engineers to implement new features and optimize solutions.
- Create technical resources, including knowledge base articles, application notes, training presentations, and instructional videos, for customers and internal teams.
- Design and develop demo applications and sample projects showcasing real-world use cases of wireless products in embedded systems.
- Validate, test, and release software development kits and software framework packages.
- Execute reference designs, customer projects, and application notes to drive design-ins and design-wins.
- Assist customers in designing, developing, integrating, and troubleshooting embedded applications.
- Provide creative solutions and workarounds to resolve customer design and implementation issues.
- Collaborate with customers and internal teams to resolve open issues and meet design requirements.
- Develop and deliver technical training for customers and field engineers.
- Exposure to hardware design concepts, including schematics and printed circuit board layout.
- Familiarity with Microchip microcontrollers and processors, wireless solutions, touch technology, and field-programmable gate array documentation.
Microchip Technology provides embedded system solutions by selling hardware components like microcontrollers, FPGAs, silicon carbide devices, and analog parts, along with software and development tools. Its products work as configurable silicon paired with software and toolchains that engineers use to design and implement embedded systems in domains such as automotive, industrial, consumer electronics, aerospace, and telecom. The company differentiates itself through a broad product portfolio, a strong education and support ecosystem (including Microchip University), and direct B2B sales and services that help customers develop and deploy solutions. Its goal is to be a leading provider of end-to-end embedded system solutions, generating revenue from hardware, software licenses, development tools, and related services.
Company Size
10,001+
Company Stage
IPO
Headquarters
Chandler, Arizona
Founded
1989
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Simplify's Take
What believers are saying
- May 7, 2026 FY2026 net sales reached $4.713 billion, showing stabilization after downturn.
- September 2026 data-center and edge-AI launches target NVIDIA Holoscan, PCIe Gen 6, and Hailo.
- September 2026 automotive and timing launches expand design wins across software-defined vehicles and FPGAs.
What critics are saying
- March 2025 layoffs cut 2,000 jobs, exposing demand weakness and ongoing restructuring through 2026.
- May 7, 2026 FY2026 results still carried restructuring charges, signaling lingering fab-closure drag.
- FY2026 disclosures show 18% of sales in China, facing tariff and export-control exposure.
What makes Microchip Technology unique
- Microchip’s broadline portfolio spans MCUs, FPGAs, analog, timing, and power devices.
- September 3, 2026 ASA-ML partnership with Marelli deepens automotive display connectivity credibility.
- September 9, 2026 SY757xx clock buffers target 1.2V FinFET platforms with ultra-low jitter.
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Benefits
Health Insurance
401(k) Retirement Plan
Stock Options
Performance Bonus
Employee Stock Purchase Plan
Company News
AI Server Applications | Supplier of Infineon OptiMOS(TM), CoolMOS(TM), CoolSiC(TM) and ROHM SiC MOSFETs. With the explosive growth in demand for AI computing power, server power supply systems are rapidly evolving towards an 800V HVDC architecture. Mingjiada Electronics supplies Infineon's OptiMOS(TM), CoolMOS(TM) and CoolSiC(TM), as well as ROHM's SiC MOSFE... With the explosive growth in demand for AI computing power, server power supply systems are rapidly evolving towards an 800V HVDC architecture. Mingjiada Electronics supplies Infineon's OptiMOS(TM), CoolMOS(TM) and CoolSiC(TM), as well as ROHM's SiC MOSFETs and Microchip's mSiC(TM) series, providing comprehensive power semiconductor solutions for AI server power supply design. I. Evolution of AI Server Power Architecture and Power Device Requirements The power consumption of generative AI model training and inference clusters has now exceeded the megawatt level, with power per cabinet rapidly increasing from the traditional 10 kW to 100 kW or even higher. This transformation places unprecedented demands on power MOSFETs: lower on-state losses, greater surge withstand capability, higher thermal stability and superior switching characteristics. Current AI server power supply architectures are evolving along three distinct technological pathways: step-up with current reduction (shifting from 12V/48V to 400V/800V high-voltage DC), reduction in the number of conversion stages (simplifying from multi-stage conversion to 800V | 48V | 12V | Core), and power delivery close to the chip. These changes have made silicon carbide (SiC) and silicon-based super-junction MOSFETs critical components. II. Mingjiada Electronics: A Specialist Power MOSFET Supplier Established in 1996, Shenzhen Mingjiada Electronics Co., Ltd. is a globally renowned authorised independent distributor of electronic components. Headquartered in Shenzhen, the company has established branches in Hong Kong, Japan, Russia and other locations. The company has obtained ISO 9001:2014 international quality management system certification and ISO 14001:2014 environmental management system certification, and specialises in distributing products from over 500 renowned manufacturers. In the field of power devices, Mingjiada Electronics has established long-term, stable partnerships with leading international semiconductor manufacturers such as Infineon, ROHM and Microchip, ensuring product quality and supply reliability. III. Detailed Overview of the Infineon Power MOSFET Series 1. OptiMOS(TM) 7 Series - Designed for Cloud Computing The Infineon OptiMOS(TM) 7 series adopts an 'application-oriented' design philosophy, tailored to specific application requirements. The switching-optimised products in this series are specifically designed for future data centres, servers and telecommunications equipment, offering a Form of Performance (FOM) improvement of up to 25 per cent and significantly enhanced thermal management capabilities through the use of Source Down packaging. The OptiMOS(TM) 7 25V MOSFETs are primarily aimed at intermediate bus converter (IBC) applications and are suitable for 48V voltage conversion to support AI core power supplies. The product portfolio is divided into two main technical categories: hard-switching and soft-switching, with a rated temperature of up to 175°C. 2. OptiMOS(TM) 6 Series - Setting a New Standard for DC-DC Conversion Efficiency Infineon's OptiMOS(TM) 6 80V MOSFETs, housed in a compact 5x6 mm^2 dual-sided heat-dissipating package, have been integrated into the IBC tier of AI server platforms from leading processor manufacturers. Application testing shows that their efficiency is approximately 0.4 per cent higher than previous solutions, equating to a saving of around 4.3 W per kW of load. Rolling out this solution across a hyperscale data centre with 2,000 racks could save over 1.2 MWh of energy per hour. The product delivers superior switching performance in hard-switching topologies, enhancing energy efficiency by reducing conduction losses, whilst the dual-sided heat-dissipating package helps improve thermal management and increase power density. 3. CoolMOS(TM) 8 Series - The Benchmark for Super-Junction MOSFET Technology Infineon's CoolMOS(TM) 8 super-junction MOSFETs have enabled Mimi Electric's 5.5 kW AI server power supply to achieve Titanium Plus efficiency certification. Compared to the CFD7 series, the CoolMOS(TM) 8 features an 18 per cent reduction in gate charge; compared to the P7 series, this figure rises to 33 per cent. The product boasts the fastest turn-off time on the market, with thermal performance improved by 14 per cent to 42 per cent compared to the previous generation. The CoolMOS(TM) 8 integrates a fast body diode, enabling its widespread use across various applications ranging from low-power switching power supplies to high-power systems such as servers, telecommunications equipment and solid-state circuit breakers. 4. CoolSiC(TM) MOSFET G2 Series - Leader in Silicon Carbide Technology Infineon's second-generation 650V CoolSiC(TM) MOSFET is a core component in high-voltage power supplies for AI servers. In a 24kW battery backup unit (BBU) reference design, the DC-DC conversion stage, built around the CoolSiC MOSFET IMT65R033M2H, achieves a conversion efficiency exceeding 99 per cent. Featuring a 650V breakdown voltage, a stable body diode, a junction temperature rating of 175°C and .XT packaging technology, this product demonstrates exceptional reliability under demanding operating conditions such as voltage spikes, high dv/dt transients and sustained thermal cycling. IV. ROHM SiC MOSFET Series ROHM's 750V SiC MOSFET, the "SCT4013DLL", has been adopted in AI server power supply BBUs, where it is configured within power supply units operating under a +/-400V supply architecture. This product offers excellent high-temperature resistance with a maximum junction temperature of 175°C, enabling stable operation even within BBUs where heat generation is increasing due to rising voltage and power density. In next-generation 800 V DC power supply architectures, where the supply voltage to the internal battery pack of the BBU is approximately 560 V, ROHM's 750 V SiC MOSFETs can also be utilised. ROHM has published the white paper "ROHM's 800 V DC Architecture Solutions for AI Servers", providing a comprehensive solution for AI server power supply design. V. Microchip mSiC(TM) Series Microchip's 3.3 kV HV-D3 mSiC power module is specifically designed for solid-state transformer (SST) applications in AI data centres. The module integrates a 3.3 kV silicon carbide MOSFET and a Schottky diode within an industry-standard 62 mm package, enabling highly efficient power delivery directly from the medium-voltage grid to the server rack. Microchip's mSiC MOSFET technology maintains highly competitive RDS(on) stability across a wide temperature range. Compared to low-voltage SiC solutions, the number of series components required is significantly reduced - by approximately half - when connected to 13.8 kV or 34.5 kV grids. The module supports applications ranging from 100 to 300 A and is suitable for solid-state transformers, medium-voltage motor drives and industrial power systems. VI. Typical Application Scenarios for AI Server Power Supplies IBC Intermediate Bus Conversion: OptiMOS(TM) 7/6 High-efficiency DC-DC conversion, enhanced power density PFC/LLC Primary Side: CoolMOS(TM) 8 Titanium-level efficiency, fast switching High-Voltage BBU: CoolSiC(TM) G2 99%+ efficiency, high reliability 800V HVDC: ROHM SiC MOSFETs High-temperature resistance, low losses Solid-state transformers: Microchip mSiC(TM) Medium-voltage direct conversion, reduced number of conversion stages Conclusion With the rapid expansion of AI computing infrastructure, server power supplies face extremely stringent requirements in terms of power density, conversion efficiency and high-temperature reliability. The Infineon OptiMOS(TM), CoolMOS(TM) and CoolSiC(TM), as well as the ROHM SiC MOSFETs and Microchip mSiC(TM) series supplied by Mingjiada Electronics, have become key choices for building highly energy-efficient AI server power supplies, thanks to their leading technical performance and stable supply capabilities. For further product information or to request a quotation, please visit the Mingjiada Electronics website (www.hkmjd.com) or contact its sales team. Contact Us Mobile: +86 13410018555 Email: [email protected] Address: Rooms 1239-1241, Guoli Building, Zhenzhong Road, Futian District, Shenzhen News recommendation.
Microchip's 1.2V clock buffers link latest SoCs and FPGAs with higher voltage components. September 9, 2026 The demand for low-voltage clock drivers continues to grow with the rapid adoption of advanced FinFET process nodes used in high-performance FPGAs, SoCs, AI accelerators and next-generation CPUs. Printed circuit board designers face increasing challenges due to the limited availability of standard 1.2V LVCMOS clock buffers and level-translating buffers capable of converting higher-voltage clock signals to the lower-voltage levels required by these advanced devices. Conventional approaches that rely on discrete components and voltage-divider techniques can compromise signal integrity and clock duty-cycle accuracy while increasing board complexity and component count. Microchip Technology has introduced the SY757xx family, a comprehensive portfolio of 1.2V-output LVCMOS clock buffers, designed to address these challenges. The new devices simplify system design by eliminating the need for traditional discrete-component implementations while delivering ultra-low additive jitter performance. To provide flexibility for supporting legacy board power supplies and different clock-source voltage levels, the devices support a broad range of supply voltage (VDD) and a wide operating frequency range. The SY757xx family enables ultra-low additive jitter clock distribution while maintaining the high clock resolution and signal integrity required for today's high-speed FPGA, SoC and CPU platforms. "Our SY757xx family of clock buffers helps customers overcome the growing clock distribution challenges associated with next-generation high-performance FPGA, SoC and CPU platforms," said Maamoun Abou Seido, appointed vice president of Microchip's timing and communications business unit. "By combining ultra-low additive jitter performance with broad VDD and wide frequency support in a single-chip solution, the SY757xx devices simplify board design, reduce component count and help customers maintain the signal integrity and timing accuracy required in today's high-performance computing applications." Microchip's SY757xx family strengthens the clock buffer's role as a critically important SoC and FPGA interface for clock distribution and clock fanout functionality in application platforms where signal integrity is paramount. These platforms demand high-speed parallel processing, hardware reconfigurability, low latency and efficient real-time computing. These capabilities are required for applications ranging from embedded vision and video processing to AI/ML acceleration, industrial control and IoT, networking and communications, and signal processing and embedded systems. Launching three products in production and eight that are sampling in limited volumes, the family spans a wide array of configurations in three space-saving packaging options. The devices protect against clock distortion across a 0 Hz to 250 MHz frequency spectrum while also offering a broad range of power supply input and output options across the 1.2V to 3.3V voltage-translation input range. This includes a single-chip option that reliably interconnects 3.3V components to FPGAs and SoCs with a 1.2V clock signal requirement. Additive jitter is as low as 26 femtoseconds (fs). Compared to traditional discrete component solutions for these FPGA and SoC applications, the Microchip buffers simplify design and reduce bill-of-materials costs while helping to optimize AC coupling and biasing and maintain signal integrity. Voltage dividers using discrete components may not provide adequate design margin and can degrade signal integrity by causing duty-cycle distortion. Microchip clock buffers complement the company's comprehensive range of flash-based FPGAs and SoC FPGAs spanning ultra-low density to mid-range density devices. These and other Microchip products that range from microcontrollers and analog components to power management, timing, connectivity and memory devices are pre-engineered and validated to enable a simplified, lower-risk and more holistic approach to system design.
Microchip launches 1.2V clock buffers for SoCs and FPGAs. Single-chip solutions perform voltage translation across a broad operating range while simplifying interconnection with the latest processors' highly precise internal clock networks September 9, 2026 As advanced FinFET technologies become more common in high-performance FPGAs, SoCs, AI accelerators, and next-generation processors, the need for low-voltage clock drivers is increasing. PCB designers are finding it difficult to source standard 1.2V LVCMOS clock buffers and level-translating solutions that can convert higher-voltage clock signals to the lower voltages required by these modern devices. Using separate components or voltage-divider circuits as an alternative can add board complexity and increase component count, while potentially reducing signal quality and affecting clock duty-cycle accuracy. Microchip Technology has introduced the SY757xx family, a comprehensive portfolio of 1.2V-output LVCMOS clock buffers, designed to address these challenges. The new devices simplify system design by eliminating the need for traditional discrete-component implementations while delivering ultra-low additive jitter performance. To provide flexibility for supporting legacy board power supplies and different clock-source voltage levels, the devices support a broad range of supply voltage (VDD) and a wide operating frequency range. The SY757xx family enables ultra-low additive jitter clock distribution while maintaining the high clock resolution and signal integrity required for today's high-speed FPGA, SoC and CPU platforms. "Our SY757xx family of clock buffers helps customers overcome the growing clock distribution challenges associated with next-generation high-performance FPGA, SoC and CPU platforms," said Maamoun Abou Seido, appointed vice president of Microchip's timing and communications business unit. "By combining ultra-low additive jitter performance with broad VDD and wide frequency support in a single-chip solution, the SY757xx devices simplify board design, reduce component count and help customers maintain the signal integrity and timing accuracy required in today's high-performance computing applications." Microchip's SY757xx family strengthens the clock buffer's role as a critically important SoC and FPGA interface for clock distribution and clock fanout functionality in application platforms where signal integrity is paramount. These platforms demand high-speed parallel processing, hardware reconfigurability, low latency and efficient real-time computing. These capabilities are required for applications ranging from embedded vision and video processing to AI/ML acceleration, industrial control and IoT, networking and communications, and signal processing and embedded systems. Launching three products in production and eight that are sampling in limited volumes, the family spans a wide array of configurations in three space-saving packaging options. The devices protect against clock distortion across a 0 Hz to 250 MHz frequency spectrum while also offering a broad range of power supply input and output options across the 1.2V to 3.3V voltage-translation input range. This includes a single-chip option that reliably interconnects 3.3V components to FPGAs and SoCs with a 1.2V clock signal requirement. Additive jitter is as low as 26 femtoseconds (fs). Compared to traditional discrete component solutions for these FPGA and SoC applications, the Microchip buffers simplify design and reduce bill-of-materials costs while helping to optimize AC coupling and biasing and maintain signal integrity. Voltage dividers using discrete components may not provide adequate design margin and can degrade signal integrity by causing duty-cycle distortion. Microchip clock buffers complement the company's comprehensive range of flash-based FPGAs and SoC FPGAs spanning ultra-low density to mid-range density devices. These and other Microchip products that range from microcontrollers and analog components to power management, timing, connectivity and memory devices are pre-engineered and validated to enable a simplified, lower-risk and more holistic approach to system design. Pricing and availability. The low-power LVCMOS clock buffer family's SY75707TWL-TR, SY75712TWL-TR and SY75714TWL-TR devices are in volume production. The SY75707TWL-TR supports differential input to two LVCMOS output and is housed in an 8-pin Very-thin Dual Flat No-lead (VDFN) package. The SY75712TWL-TR and SY75714TWL-TR devices enable either 2 or 4 LVCMOS outputs operating at 1.2V to 1.8V rail, respectively, and are housed in 8-pin Thin Dual Flat No-lead (TDFN) packages. They are priced from $0.50 to $0.83 per unit depending on configuration, in volumes of 10,000. The other eight SY757xx family members bridge to 1.2V-to-1.8V LVCMOS outputs from a choice of single-ended 1.2V to 3.3V LVCMOS inputs, single-ended 1.2V to 1.8V LVCMOS inputs, or differential 1.8V to 3.3V inputs. There are also options for an output-enabled (OE) fanout buffer. All the sampling devices are housed in 8-pin VDFN packages.
Asahi Kasei Microdevices (AKM) announced that its CZ39 and CZ3K coreless current sensors have been integrated into Microchip Technology's machine learning-based arc fault detection reference design. The system uses Microchip's dsPIC33A Digital Signal Controller to detect arc faults, a leading cause of electrical fires in solar PV systems, energy storage, EV charging, and power distribution. Traditional threshold-based detection struggles to distinguish real arc events from normal system activity, resulting in false positives or missed faults. The new design runs edge machine learning models directly on the controller, enabling local decision-making without external processing. AKM's sensors feature 100-nanosecond response time and low-noise signal quality, critical for capturing arc signatures. The reference design targets applications including solar PV, energy storage, EV chargers, and industrial safety switches. Asahi Kasei has positioned electronics as a growth priority, with current sensors targeting AI and data centre applications.
Asahi Kasei current sensors featured in Microchip Arc Fault Detection design. September 8, 2026 Asahi Kasei Microdevices Corporation (AKM), part of the global Asahi Kasei Group, has announced that its CZ39 and CZ3K series coreless current sensors have been selected for Microchip Technology's machine-learning and AI-based Arc Fault Detection (AFD) reference design. The design uses Microchip's dsPIC33A Digital Signal Controller (DSC) to enable real-time arc fault detection. The solution combines AKM's current-sensing technology with the dsPIC33A's real-time signal processing and edge machine-learning capabilities, helping deliver dependable and precise arc fault detection. Because the dsPIC33A processes signals and runs the machine-learning inference algorithms directly on the controller, the system can make detection decisions locally without relying on external processing hardware. Arc faults are a leading cause of electrical fires in solar PV systems, energy storage systems, EV charging infrastructure, and industrial and residential power distribution. Conventional threshold-based detection struggles to distinguish real arc events from normal system activity. In residential and commercial AC circuits, everyday loads such as vacuum cleaners, power drills, and light dimmers produce arcing at switch contacts and motor brushes that closely resembles a dangerous arc fault. In DC systems such as solar PV, EV charging, and energy storage, switching transients from relay contact bounce, inverter operation, and capacitor inrush generate broadband noise in the same frequency bands as actual arc faults. In both cases, the result is either false positives that cause unnecessary shutdowns, or relaxed thresholds that miss real faults. Machine learning can close that gap. Microchip's AFD reference design runs an edge ML model directly on its dsPIC33A DSC, leveraging an integrated DSP engine and advanced analog peripherals to enable low latency ML inference. This intelligent approach helps reduce false triggers and improve arc fault detection performance compared with traditional threshold-based approach. Detection performance depends on multiple factors, including sensor bandwidth and noise performance, signal processing, feature extraction, and machine-learning model training. High-quality current sensing is an important contributor to overall system performance. For high-accuracy detection, the sensor needs to be fast and have little data pollution to capture an arc's signature. A slow or noisy sensor blurs or buries that signature, which precludes effective training of the model. AKM's CZ39 series and CZ3K series coreless current sensors feature a 100 ns response time. Their speed and low-noise signal quality are central to the signal chain behind Microchip's reference design. The engineering team in San Jose at AKM Semiconductor, Inc. (AKMS), AKM's U.S. subsidiary, worked closely with Microchip on the current-sensing configuration during the development and validation stage. Chris Baltar, Vice President of Business Development at AKMS, stated, "Electronics Buzz were glad to support Microchip as they built out and validated this reference design using the AKM CZ39 and CZ3K families. Its collaboration demonstrates how high-performance current sensing combined with intelligent edge processing can help designers implement advanced protection functions across a variety of power applications. Electronics Buzz is excited to explore how this design could be adopted for data center applications as AI workloads drive the need for higher-power-density and emerging high-voltage power architectures." The AFD demonstration, available through Microchip's reference design program, is currently applicable across solar PV, energy storage systems, EV chargers, smart ignition systems, e-Fuse designs, and residential and industrial safety switches. Asahi Kasei has positioned Electronics as a First Priority business expected to drive earnings growth. The business is expanding its portfolio of materials and components for advanced semiconductors and electronic devices. Within AKM, current sensors are positioned as a future growth pillar, building on their use in EVs while targeting AI and data center applications.