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Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Planner 2 - Logistics

Operations & LogisticsConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • Strong organizational and time management skills.
  • Excellent communication and interpersonal skills to liaise with diverse teams and customers.
  • High attention to detail and accuracy in data entry and documentation.
  • Proficiency in administrative software, particularly Microsoft Excel and PowerPoint, for data management and reporting.
  • Ability to manage multiple tasks and priorities simultaneously in a dynamic environment.

Responsibilities

  • Review and process warranty claims promptly and accurately according to company guidelines, verifying that claims are valid warranty claims.
  • Handle customer returns and manage inquiries during the return and repair of defective parts.
  • Maintain detailed records of warranty data and claims, and provide regular status updates and monthly reports for analysis and tracking.
  • Understand the end-to-end warranty process and coordinate with Customer Service Engineers, the Quality team, repair centers, Parts Planners, and shipping teams to ensure parts readiness and shipment for timely customer service; serve as the central contact for claim status.
  • Act as the primary contact for customer and service-provider inquiries, resolve issues, and ensure clear communication throughout the process.
  • Understand differing customer requirements, ensure claims comply with applicable country regulations and customer requirements, and resolve delays or other issues in the warranty process.
  • Collaborate with other departments to improve product reliability, reduce warranty costs, and develop or implement new warranty programs.
  • Liaise with the Customer Service team to streamline warranty support for customers.

About the Company

Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Kulicke & Soffa designs, manufactures, and sells capital equipment and tools for assembling semiconductor devices. Its product line includes ball bonders that ultrasonically attach fine wires to a semiconductor die, thermo-compression bonding systems for high-density interconnects, and equipment for surface-mount technology and die attach. The company differentiates itself with a long history dating back to 1951, a broad portfolio across wire bonding, advanced packaging, and die attach, and a strong Asia-Pacific presence plus an active after-market parts and services business. Its goal is to enable mass production of semiconductors by providing reliable, high-precision packaging and assembly solutions that help customers scale manufacturing and keep equipment running smoothly.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Singapore, Singapore
Founded
1951

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