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TAP Engineering

TAP Engineering

Mechanical Engineer 2

Full-TimeUpdated on 9/15/2026
$115k - $160k/yr

+ Performance bonuses + Referral bonuses

Mid, Senior
Bachelor's
Columbia, MD, USA
In Person
No H1B Sponsorship
US Top Secret Clearance Required

About the job

Requirements
  • A Bachelor's degree in Mechanical Engineering or a related discipline.
  • 5–10 years of relevant mechanical engineering experience.
  • Hands-on experience with thermal engineering for electronic systems.
  • A strong background in mechanical design and product development.
  • Proficiency with SolidWorks or equivalent 3D computer-aided design software.
  • A solid understanding of heat transfer principles, including conduction, convection, and radiation.
  • Strong analytical, troubleshooting, and documentation skills.
  • Effective written and verbal communication skills.
  • Ability to work effectively in a collaborative, team-based engineering environment.
  • An active Secret security clearance.
Responsibilities
  • Design mechanical parts, enclosures, and assemblies for electronic systems using SolidWorks or similar computer-aided design tools.
  • Lead and support thermal analysis efforts for electronic hardware, including heat dissipation and airflow considerations.
  • Perform and interpret thermal and structural evaluations through simulation and testing.
  • Apply principles of conduction, convection, and radiation to improve system performance and reliability.
  • Collaborate with electrical engineers to ensure proper printed circuit board integration, mechanical fit, and thermal performance.
  • Support prototype builds, design verification testing, and design reviews.
  • Develop and maintain three-dimensional models, two-dimensional drawings, and bills of materials.
  • Provide technical input on materials selection, manufacturability, and design trade-offs.
  • Contribute to system-level design decisions and mentor junior engineers as needed.
Desired Qualifications
  • Experience using ANSYS or similar analysis tools.
  • A background in Computational Fluid Dynamics.
  • Experience analyzing convection and radiation effects in electronic systems.
  • Familiarity with electronics packaging and printed circuit board mechanical integration.
  • Experience supporting prototyping, lab testing, and environmental testing.

About the company

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