Full-Time

Analog IC Design Engineer

Texas Instruments

Texas Instruments

10,001+ employees

Analog and embedded processing semiconductors

No salary listed

Bengaluru, Karnataka, India

In Person

Bachelor's

Category
Hardware Engineering (1)

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Requirements
  • Bachelor's degree in Electrical Engineering
  • 2 years of relevant experience
  • Candidate should have gone through 1 complete design cycle of an RF transceiver: namely Architecture, Schematic Design, Layout Design, Tape Out, Test & Validation and identifying design fixes for subsequent Tape Out.
Responsibilities
  • Lead level IC Design Engineer with demonstrated design cycle experience.
  • Role may include PLL & Clock System Design, IF filtering and VGA Design, Transmitter Design, and Analog-to-Digital Converter Design.
  • Candidate should have gone through 1 complete design cycle of an RF transceiver: Architecture, Schematic Design, Layout Design, Tape Out, Test & Validation and identifying design fixes for subsequent Tape Out.
Desired Qualifications
  • Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
  • Strong verbal and written communication skills
  • Ability to quickly ramp on new systems and processes
  • Demonstrated strong interpersonal, analytical and problem-solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Ability to take the initiative and drive for results
  • Strong time management skills that enable on-time project delivery

TI designs and manufactures semiconductors, focusing on analog and embedded processing chips used by OEMs in automotive, industrial, consumer electronics, communications, and enterprise systems. Analog chips convert real‑world signals into digital data, while embedded processing chips act as the device’s brains to run specific tasks. It differentiates itself through a broad, proven portfolio, long-standing OEM relationships, and a global manufacturing footprint, alongside CSR efforts and a strong focus on employees (TIers). Its goal is to provide reliable semiconductor solutions that help customers build efficient, capable products across industries while supporting sustainable practices and community initiatives.

Company Size

10,001+

Company Stage

IPO

Headquarters

Dallas, Texas

Founded

1951

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Simplify Jobs

Simplify's Take

What believers are saying

  • Q2 2026 revenue rose 23% to $5.46 billion, with industrial up 30%.
  • Data center revenue doubled, and TI guided Q3 2026 above seasonality.
  • CHIPS incentives covered first-half 2026 capex, preserving cash for Silicon Labs.

What critics are saying

  • Silicon Labs costs $7.5 billion, and integration starts under a $5 billion debt backstop.
  • China's mature-node expansion targets 45% global capacity by 2027, pressuring TI pricing.
  • If Sherman ramps slowly, TI's $60 billion buildout traps capital in underused capacity.

What makes Texas Instruments unique

  • Sherman SM1 began production in December 2025, anchoring TI's domestic 300mm analog moat.
  • TI's integrated analog, embedded, and manufacturing stack wins GE Appliances' 2027 supply.
  • CHIPS-funded Texas and Utah fabs give TI U.S. sourcing competitors lack.

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Benefits

Hybrid Work Options

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

-1%

2 year growth

-1%
Exponential Industry
Aug 7th, 2026
The silicon bottleneck: how mature nodes power the AI infrastructure boom.

The silicon bottleneck: how mature nodes power the AI infrastructure boom. Need to know. * The AI Backbone Runs on Legacy Silicon: While advanced nodes focus on digital compute, mature and specialty nodes (28 nm and above, on 200 mm/300 mm wafers) supply the indispensable power management ICs (PMICs), gate drivers, and isolators required to power AI systems. * BCD Technology Enables Single-Chip Power Systems: Bipolar-CMOS-DMOS (BCD) technology combines low-voltage digital control, high-voltage power switching (LDMOS), and precision analog functions onto a single die, enabling highly integrated power regulation. * Process Complexity Differs from Moore's Law: Analog manufacturing relies on precision matching, thick/thin gate oxide integration, and deep-trench isolation (DTI) rather than sub-nanometer extreme ultraviolet (EUV) lithography scaling. * Capacity Squeeze and Geopolitical Realignment: Foundry capacity reallocations to interposers and high-margin PMICs are driving fab utilization toward ~90%, while China expands its legacy footprint (target ~45% global mature capacity by 2027) alongside 300 mm expansions by US IDMs like Texas Instruments. Specialty and mature nodes, typically 28 nanometers (nm) and larger, often built on 200 millimeter (mm) and 300 mm silicon wafers, form the critical backbone of the AI buildout. Unlike advanced digital logic that scales to increase transistor density, analog and mixed-signal circuits prioritize signal precision, low noise, high-voltage control, and circuit isolation. The primary manufacturing technology is Bipolar-CMOS-DMOS (BCD). BCD combines low-voltage digital CMOS logic, high-voltage Lateral DMOS power switches, and precision analog components on one chip /ST/. This integration enables power-management integrated circuits (PMICs), voltage regulators, gate drivers, and isolators to convert and deliver stable power to AI accelerators. Process complexity comes from balancing thick gate oxides for high voltages with thin gate oxides for digital logic, creating deep-trench isolation to separate circuit domains, and integrating passive components. These requirements do not improve with traditional scaling and require stable, well-characterized process flows rather than extreme ultraviolet (EUV) lithography. AI data-center power density is now the main demand driver. As equipment racks scale toward hundreds of kilowatts and eventually megawatt-class systems, analog content per rack rises sharply to support multi-phase voltage regulation, intermediate bus converters, sensors, and circuit protection. Analysts project the market for analog semiconductors in AI data centers to grow from roughly $7.9 billion in 2025 to $27 billion by 2030 - a ~28% annual growth rate - outpacing the general analog market. This demand, combined with automotive, industrial, and edge-AI needs, creates severe supply constraints. Fab capacity is tightening rather than expanding smoothly. Leading foundries have reduced 200 mm wafer output and moved 300 mm mature capacity toward higher-margin AI products, such as PMICs, power discretes, and silicon interposers. This shift pushes fab utilization toward 90% and causes price increases expected to extend into 2027 /Taipei Times/. China is building a larger share of global mature-node capacity that is projected to approach 45% by 2027 through expansion at SMIC, Hua Hong, and other foundries, while taking overflow orders for high-voltage and lower-margin chips. Texas Instruments is countering this trend by expanding 300 mm analog capacity in Texas /EETimes/ and Utah to lower production costs and increase supply chain security. Wafer reclaim works at higher success rates on mature nodes than on advanced nodes /Mordor Intelligence/, and companies recycle limited power components, but neither practice solves core factory capacity limits. Key process and product companies include Texas Instruments, Analog Devices, Infineon, STMicroelectronics, and Onsemi on the integrated design and manufacturing side. Foundry capacity is concentrated at GlobalFoundries, UMC, TSMC's mature lines, SMIC, and Hua Hong. In South Korea, DB HiTek remains a vital pure-play 200 mm foundry, supplying specialized PMICs and high-voltage power components /PR Newswire/. Regional concentration remains a risk: Taiwan holds critical specialty process expertise even as it expands advanced nodes, while China's rapid mature-node expansion creates both additional supply and supply-chain division risks for international customers. The result is a supply squeeze in the hardware layer that keeps AI systems powered and operational.

The Star Media Group
Aug 6th, 2026
Infineon lifts outlook as AI demand powers revenue.

Infineon lifts outlook as AI demand powers revenue. Thursday, 06 Aug 2026 FRANKFURT: Infineon Technologies AG has issued an upbeat revenue outlook for the current quarter, beating analyst estimates on the back of firm data-centre chip demand and improved pricing. Revenue in the fourth fiscal quarter, which ends in September, is set to come in at around €4.7bil (US$5.4bil), Infineon said in a statement yesterday. That compares to an average analyst estimate of €4.6bil, according to data compiled by Bloomberg. "Our power supply solutions for artificial intelligence (AI) data centres remain in very high demand and continue to be our most important growth driver," chief executive officer Jochen Hanebeck said in the statement. The results may help alleviate concerns about the sustainability of the current AI spending blitz and intensifying competition from China. Investor fears about inflated chip stock valuations deepened a selloff in recent weeks, hitting shares in competitors, including Texas Instruments Inc, STMicro-electronics NV and NXP Semiconductors NV, even after they raised their earnings forecasts. Infineon's stock has risen 69% so far this year. Infineon said that several customers in the AI data centre sector are negotiating for or have reserved capacity over multiple years. These agreements have a cumulative revenue volume of a high single-digit billion euro amount, according to the company. "The company looks well-positioned to remain the leading player in AI power," JPMorgan analysts including Sandeep Deshpande wrote in a note before earnings. Demand has improved across all business segments, including moderate growth in the automotive sector, according to Infineon. The company confirmed its June guidance of adjusted gross margin for the fiscal year in the low-to-mid 40s percentage range. It expects full-year revenue of around €16.3bil. Third quarter revenue was €4.17bil, compared to an average analyst estimate of €4.13bil. The company increased prices for some chips in April and July. While the car industry has been traditionally the most important market for Infineon, long with its European peers STMicroelectronics and NXP, the companies are now increasingly benefitting from demand for AI infrastructure. - Bloomberg

Embedded Computing Design
Aug 5th, 2026
GE and TI team up to power new connected appliances.

GE and TI team up to power new connected appliances. Editor in Chief Embedded Computing Design August 05, 2026 GE Appliances has announced that it is set to begin integrating microcontrollers, Wi-Fi connectivity solutions, and analog components made by Texas Instruments (TI) into its next generation of connected appliances. GE Appliances reportedly will use TI semiconductor chips in one third of all the products manufaxtured in the company's new plant in Louisville, Kentucky. Production is expected to begin in 2027, according to the release. This investment almost doubles the financial relationship between the two companies. "Expanding our work with Texas Instruments gives us access to a differentiated semiconductor portfolio backed by domestic manufacturing," said Lee Lagomarcino, VP of Clothes Care, GE Appliances. "TI's broad portfolio of advanced embedded processing and analog technology will help our engineers design appliances that are smarter, more powerful, and more efficient than ever before. Moving forward, our domestic research and development teams can also save significant time on new solutions for U.S. consumers." GE Appliances will use the new semiconductors in three main ways. TI's latest Wi-Fi solutions with integrated BLE and enhanced security will allow GE to offer its promised robust, secure connected-appliance experience. Power conversion integrated circuits from TI will also help GE appliances deliver more efficiency, better integrated diagnostics, real-time protection, and advanced power management capabilities, the company said. This will lead to improved appliance performance, reliability, serviceability, and energy efficiency while supporting scalable next-generation product architectures. Finally, TI's motor drive technology enables advanced control of the drain pump system, delivering optimized washing performance and quieter operation. And the gallium nitride (GaN) motor drivers achieve better than 99% efficiency, eliminate heat sinks, and dramatically reduce solution size, boosting power density and overall system efficiency. Looking forward, GE Appliances also announced it is exploring future projects that will implement TI's intelligent microcontroller platform. "We're proud to support GE Appliances as they expand their U.S. manufacturing supply chain. By bringing together next-generation Wi-Fi connectivity, energy-efficient microcontrollers, edge AI capabilities, and breakthrough GaN-based motor drive technology, TI is giving GE Appliances the building blocks to design smarter, more efficient, and more connected appliances. And we are proud to have our U.S.-produced chips integrated into GE Appliance's U.S.-produced appliances," said Vinay Agarwal, VP and GM of MSP Microcontrollers, Texas Instruments. Ken Briodagh is a writer and editor with two decades of experience under his belt. He is in love with technology and if he had his druthers, he would beta test everything from shoe phones to flying cars. At Embedded Computing Design, he covers, AI, Edge Computing, Data Centers, Automotive, Industrial, Smart City, IoT and IIoT, Semiconductors, Healthcare, and lots more. He hosts weekly programs on YouTube, including the technology unboxing feature DevKit Weekly, and his news show ICYMI, and, along with Tiera Oliver, hosts the Embedded Insiders and Embedded Executive podcasts. In previous lives, he's been a short order cook, telemarketer, medical supply technician, mover of the bodies at a funeral home, pirate, poet, partial alliterist, parent, partner and pretender to various thrones. Most of his exploits are either exaggerated or blatantly false.

KTEN
Aug 4th, 2026
Sherman-made semiconductors to power new generation of appliances.

Sherman-made semiconductors to power new generation of appliances. * alexah montanes, KTEN news * aug 4, 2026 updated 1 hr ago. SHERMAN, Texas (KTEN) - On Tuesday, Texas Instruments announced a new partnership with GE Appliances, a move that further cements Sherman's role as a growing technology hub. TI said its US-made chips will help power future GE appliances, adding another major company to the roster of businesses relying on semiconductors made in Grayson County. Reporter/Producer

Shenzhen Mingjiada Electronics Co., Ltd.
Aug 4th, 2026
TI ADS4146IRGZR: 14-bit 160MSPS ultra-low-power pipelined ADC, empowering high-speed signal chains!

TI ADS4146IRGZR: 14-bit 160MSPS ultra-low-power pipelined ADC, empowering high-speed signal chains! The ADS4146 is a 14-bit, 160MSPS ultra-low-power pipelined ADC released by Texas Instruments (TI). In 5G communication base stations, software-defined radios (SDRs), medical ultrasound imaging, and high-end test and measurement equipment, the performance of high-speed, high-precision analog-to-digital converters (ADCs) directly determines the system's ability to capture analog signals and the quality of digital signal processing. The ADS4146 is a 14-bit, 160MSPS sampling rate ultra-low power pipeline architecture analog-to-digital converter launched by Texas Instruments (TI). I. ADS4146 Core Specifications: A Perfect Balance of 14-bit Accuracy and 160MSPS Sampling Rate The ADS4146IRGZR is a 14-bit analog-to-digital converter (ADC) launched by TI. It belongs to the ADS412x/4x series, which includes 12-bit and 14-bit products with a sampling rate of up to 250MSPS. The ADS4146 has a maximum sampling rate of 250MSPS, while the specific model ADS4146IRGZR has a rated sampling rate of 160MSPS. The total power consumption at 160MSPS is only 201mW - This power consumption level is highly competitive among high-speed ADCs of the same level. In terms of resolution and accuracy, the ADS4146IRGZR provides 14-bit data output, which can perform fine quantization on analog signals. At an input frequency of 170MHz, the device achieves a signal-to-noise ratio (SNR) of 70.6dBFS and a spurious-free dynamic range (SFDR) of 84dBc, ensuring accurate data conversion in complex signal environments. In terms of power supply and packaging, the ADS4146IRGZR uses a 1.8V single power supply, eliminating the need for a multi-way power supply design and greatly simplifying the system power architecture. The package uses a 48-pin VQFN (7mm x 7mm) and an industrial-grade operating temperature range of -40°C to +85°C. II. Analysis of the Five Core Technical Characteristics Feature 1: Ultra-low power consumption and dynamic power scaling technology The ADS4146IRGZR is designed for power-sensitive applications. At a sampling rate of 160 MSPS, the total power consumption is only 201mW, and when the sampling rate is increased to 250 MSPS, the total power consumption is also only 265mW. More notably, the chip integrates dynamic power scaling technology - when the sampling rate decreases, the ADC automatically operates at reduced power consumption without loss of performance. This characteristic makes it ideal for battery-powered devices or high-density multi-channel systems. Feature 2: Flexible dual-mode digital output interface The ADS4146IRGZR supports a variety of digital output interfaces, providing great flexibility for system design. It supports a double data rate (DDR) low voltage differential signal (LVDS) interface with programmable swing and drive strength - standard swing 350mV, low swing 200mV. The default drive strength corresponds to 100Ω termination, and 2 times the drive strength corresponds to 50Ω termination. In addition, the device also supports a 1.8V parallel CMOS interface, which designers can flexibly choose according to PCB layout and signal integrity requirements. Feature 3: Programmable Gain and SNR/SFDR Trade-off Optimization The ADS4146IRGZR offers programmable gain options up to 6dB. This feature allows users to trade off between signal-to-noise ratio (SNR) and spurious-free dynamic range (SFDR), making it particularly suitable for improving SFDR performance over a low full-scale input range, especially at high input frequencies. Feature 4: DC offset correction and low input clock amplitude support The device has a built-in DC offset correction loop, which can effectively eliminate DC offset errors inside the ADC. At the same time, ADS4146IRGZR supports low input clock amplitudes as low as 200mVpp, reducing the requirements for clock source amplitudes and simplifying clock chain design. Feature 5: Compact packaging and industrial-grade reliability The ADS4146IRGZR is packaged in a compact QFN-48 (7mm x 7mm) package, which is compact and has good heat dissipation performance. The product complies with RoHS standards, is lead-free, and meets global environmental regulations. The ECCN code is 3A991C3, which facilitates international trade compliance review. III. Typical Application Scenarios: Full Coverage from Communication Base Stations to Medical Imaging The ADS4146's high performance and flexibility enable it to be widely used in many high-end fields. Communication infrastructure is one of the core application scenarios of ADS4146IRGZR. This device is ideal for multi-carrier, broadband communication systems such as base station receivers and software-defined radio (SDR). Its high dynamic performance and low power consumption enable it to cope with the complex RF signal digitization requirements in 5G communications. Medical imaging equipment is also an important application area of this chip. In medical devices such as ultrasound scanning and CT scanning that require high-speed data acquisition and high signal-to-noise ratio, the ADS4146IRGZR's 14-bit resolution and 160MSPS sampling rate ensure high-quality digitization of medical images. In terms of testing and measuring instruments, this chip is widely used in high-end oscilloscopes, spectrum analyzers and automated testing equipment (ATE). Its superior dynamic performance and flexible interface configuration provide a reliable signal chain foundation for precision measuring instruments. In addition, the ADS4146IRGZR is also suitable for radar and sonar systems, as well as high-speed data acquisition and process control in industrial automation. IV. Mingjiada Electronics: ADS4146 Spot Supply and Professional Services Shenzhen Mingjiada Electronics Co., Ltd. was established in 1996 and is headquartered in Shenzhen. It has branches in Hong Kong, Japan, Russia, Taiwan and other places. It is a world-renowned electronic component distributor and recycling service provider with more than 20 years of industry experience. Supply advantages: Original and authentic guarantee: All TI ADC products are supplied directly through the original factory authorization channels, providing complete model traceability and quality inspection reports to eliminate the risk of refurbishment and counterfeiting from the source. Massive spot and ultra-fast delivery: The company has built its own constant temperature warehouse, and popular models such as ADS4146IRGZR are always in stock. It supports small-batch samples and bulk purchases, and can quickly respond to customer needs. Flexible transaction methods: supports domestic RMB including tax transactions and Hong Kong US dollar transactions, and provides BOM single-site order placement services. In addition, Mingjiada also provides high-priced recycling services for various electronic components and inventory. If you have any procurement needs for ADS4146IRGZR or idle inventory needs to be processed, please feel free to contact Mingjiada Electronics for professional supply solutions and immediate quotes. Telephone: +86 13410018555 (Mr. Chen) Email:[email protected] Inquire online: www.hkmjd.com