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Soitec

Engineered substrates for silicon-on-insulator wafers

Metrology/Backend - Mtbe, Equipment Technical Specialist

Equipment MaintenancePosted on Nov 12
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • Possess a Diploma or Professional Certificate/NiTEC in Mechanical, Electrical & Electronic Engineering or Microelectronics, or equivalent.
  • Have experience with metrology wafer inspection, flatness and thickness measurement equipment, FOUP/carrier cleaning machines, wafer sorting tools, automated packaging systems, and ICP-MS analysis tools. Experience with AMHS equipment such as stockers and Overhead Hoist Transport (OHT) systems is an advantage.
  • Possess knowledge of electrical, mechanical, pneumatic, and automation systems.
  • Comply with EHS requirements for work risks and safety precautions, including chemical hazards and working at heights, and maintain a safe working environment.
  • Work a monthly rotating 12-hour day/night shift to support production activities and respond promptly to equipment-related issues.

Responsibilities

  • Maintain, repair, and troubleshoot semiconductor manufacturing equipment to ensure high equipment availability, reliability, and operational efficiency.
  • Perform preventive and corrective maintenance, maintain accurate records and documentation, and follow established standard operating procedures, quality standards, safety requirements, and housekeeping practices.
  • Support equipment engineers in tool improvement initiatives to reduce downtime, improve performance, and enhance cost efficiency while complying with departmental guidelines and corporate policies.
  • Participate in continuous improvement projects, equipment upgrades, process improvements, and reliability enhancement projects.

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Bernin, France
Founded
1992

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