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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

High-Speed 1/F Subsystem Design Leader

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeKodaira, Tokyo, JapanNo salary listed

About the Job

Requirements

  • Hands-on experience in at least one of PCIe, UCIe, USB, or UFS, including specification study, design, verification, or performance evaluation.
  • Ability to organize design directions and key discussion points based on requirements and share them with stakeholders.
  • Understanding of the logic design and verification flow, with experience actively participating in technical reviews and discussions.
  • Ability to communicate in English for technical meetings and specification reviews.

Responsibilities

  • Define specifications and study the architecture of the High-Speed I/F subsystem for automotive SoCs in the R-Car series.
  • Work on the High-Speed I/F subsystem, including PCIe, UCIe, USB, and UFS-related areas, and organize design directions from a subsystem-level optimization perspective while owning a primary technical area.
  • Identify and structure technical issues during logic design and verification, contribute to design decisions, and help drive development forward.
  • Make technical judgments that account for power, performance, reliability, and overall SoC requirements.
  • Communicate with third-party IP vendors to confirm specifications, clarify constraints and assumptions, and support issue resolution.
  • Collaborate in English with design teams in India and Vietnam and with IP vendors.

Desired Qualifications

  • Experience taking a technical lead role at subsystem or IP level, such as leading design reviews or guiding technical discussions.
  • Experience in SoC integration involving PCIe, UCIe, USB, or UFS-related components.
  • Knowledge of power domain separation and physical implementation considerations, such as place and route.
  • Experience in automotive SoC development or design and verification involving functional safety or reliability considerations.
  • Experience in technical communication and coordination with overseas sites or third-party IP vendors.
  • Conversational Japanese language proficiency.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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