Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Principal Associate Engineer - Multiple Teams

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

A diploma in Engineering, specializing in Materials Science, Electrical Engineering, Mechanical Engineering, or an equivalent field.
Typically, at least 3 years of related experience.
A strong interest in statistical analysis and demonstrated ability to conduct design of experiments.
Systematic problem-solving ability in containment and countermeasures.
Ability to work first, second, and third shifts, and normal shifts during new-process training.

Responsibilities

Perform machine-performance validation on semiconductor packaging equipment through machine calibration, setup, and testing based on defined work procedures.
Provide level 1 support to identify, diagnose, and resolve assembly-process problems to achieve defined first-pass yield and manufacturing cycle time.
Support Process Engineers in developing and qualifying manufacturing inspection protocols, including metrology-equipment qualification or integrity-test definition, to ascertain machine performance and integrity.
Support Process Engineers in developing and enhancing process recipes, process tooling, or manufacturing processes, including updating and enhancing work procedures.
Ensure and validate that all necessary fixtures, jigs, drawings, and work instructions are available for manufacturing processes.
Ensure timely input of manufacturing test data and support report output on machine quality.
Perform other duties as assigned.

Desired Qualifications

Proficiency in JMP or Minitab.
Experience handling semiconductor capital-equipment graphical user interfaces and hands-on experience developing advanced packaging processes, such as die attach, thermocompression bonding, fan-out wafer-level packaging, or flip chip.
Aptitude in handling data analyzers, data-processing tools such as Excel, and word-processing tools.

As a Final Test Principal Associate Engineer in Operation Engineeringn, you are responsible for performing machine performance validation on semiconductor packaging equipment through machine calibration, setup and testing based on defined work procedures

Diploma in Engineering (Materials Science, Electrical, Mechanical or equivalent).
Typically 3 or more years of related experience.
Possess strong interest in statistical analysis skillset with demonstrated ability to conduct design-of-experiment. Proficient in JMP or Minitab would be a plus
Excellent systematic problem solving in areas of containment and counter-measures
Experience in handling semiconductor capital equipment GUI and hands-on experience in process development of advanced packaging processes (die attach, TCB, FOWL or FC) will be advantageous
Demonstrate flair in handling data analyzer, data processing tool (excel etc.) and words processing tools will be advantageous
Ability to work on shift timing (1st, 2nd and 3rd).
Ability to work on normal shift timing (for new process training).

To perform machine performance validation on semiconductor packaging equipment through machine calibration, setup and testing based on defined work procedures.
To provide level 1 support to identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time.
To support Process Engineer to develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) to ascertain machine performance and integrity.
To support Process Engineer in development and enhancement of process recipes, process tooling or manufacturing processes; inclusive of updating and enhancing of work procedures.
To ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes.
To ensure timely input of manufacturing test data and support report output on machine quality.
Perform other duties as assigned.

About the Company

Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Kulicke & Soffa designs, manufactures, and sells capital equipment and tools for assembling semiconductor devices. Its product line includes ball bonders that ultrasonically attach fine wires to a semiconductor die, thermo-compression bonding systems for high-density interconnects, and equipment for surface-mount technology and die attach. The company differentiates itself with a long history dating back to 1951, a broad portfolio across wire bonding, advanced packaging, and die attach, and a strong Asia-Pacific presence plus an active after-market parts and services business. Its goal is to enable mass production of semiconductors by providing reliable, high-precision packaging and assembly solutions that help customers scale manufacturing and keep equipment running smoothly.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Singapore, Singapore
Founded: 1951

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