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Broadcom

Designs chips and software for data centers

ASIC Package Design Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-time

About the Job

Requirements

  • A Bachelor of Science in Electrical Engineering or a similar field and 12+ years of experience in flip-chip-BGA package design, including high-speed SerDes, or a Master of Science in Electrical Engineering or a similar field and 10+ years of work experience.
  • Knowledge of package-level signal integrity and power integrity for application to package designs.
  • Ability to cooperate with a worldwide team across multiple time zones, including co-design with internal team members and external vendor designers.
  • Self-management and organization skills.

Responsibilities

  • Own overall design responsibility for ASIC package designs, including signal integrity, power integrity, manufacturability, reliability, and thermal aspects, in partnership with the package engineering team.
  • Design critical package structures for SerDes, ADC/DAC, DDR, and HBM.
  • Schedule, prioritize, and track work across two or more projects simultaneously.
  • Perform general flip-chip BGA package design and engineering.
  • Manage projects and serve as the customer interface for design projects.
  • Contribute to design-team efficiency improvements through process development and improvement, automation, and documentation.
  • Perform physical design (layout) as a foundational responsibility.

Desired Qualifications

  • Experience with Cadence APD (Allegro Package Designer); an equivalent tool is acceptable.
  • One or more years of experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest.

About the Company

Broadcom

Designs chips and software for data centers

Broadcom designs chips and sells infrastructure software for the companies that run large data centers, telecom networks and corporate IT. Its custom AI processors, built with cloud companies, and its Ethernet switch chips move and process data inside the computer clusters that train AI models. The chip business also makes parts for broadband, wireless, storage and industrial equipment, sold to device makers and cloud operators, while VMware software lets businesses run private clouds and is sold by subscription. Broadcom took its current form in 2016, when Avago Technologies, formed in 2005 from Agilent's chip unit, bought Broadcom Corporation, and it is based in Palo Alto, California.

Company size
10,001+
Company stage
IPO
Headquarters
Palo Alto, CA
Founded
2005

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