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Micron Technology

Makes memory and storage chips for AI and PCs

DRAM Memory Design Engineer Principal - Mts, Smts

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listed

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering or a related field, plus an MSEE with 10 or more years of experience, a BSEE with 12 or more years of experience, or equivalent relevant semiconductor design experience.
  • SMTS candidates typically have 15 or more years of experience with demonstrated technical leadership.
  • Extensive knowledge of CMOS circuit design, device physics, state machine logic, and design verification methodologies.
  • Experience with Verilog modeling, simulation tools, and power delivery network analysis.
  • Proficiency in scripting languages such as Python, Tcl, or Perl.
  • Strong analytical, problem-solving, communication, and multifunctional collaboration skills.

Responsibilities

  • Design and optimize digital and analog circuits for next-generation DRAM products, including memory arrays, control logic, datapaths, address decoding, and I/O circuitry.
  • Lead circuit development, simulation, verification, and silicon validation to achieve performance, power, area, and quality targets.
  • Drive floor-planning, layout optimization, parasitic analysis, and tape-out activities.
  • Advance AI-assisted design, automation, and design-space exploration through collaboration with internal and external partners.
  • Provide technical leadership through innovation, multifunctional collaboration, and mentorship of other engineers.

Desired Qualifications

  • A master's degree or PhD in Electrical Engineering or a related field.
  • Experience with DDR5, LPDDR5/LPDDR6, GDDR6/7, or HBM3/HBM4 memory technologies.
  • Experience with FINESIM, HSPICE, or similar schematic-entry and simulation tools.
  • Experience leading complex circuit design projects and mentoring engineers.
  • Exposure to AI/ML-assisted design flows, agentic AI, or advanced design-automation frameworks.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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