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Invisix Measuring Systems

Non-destructive 3D nanoscale chip imaging

Application Engineer

Data ScienceUpdated on Nov 15
Full-timeEindhoven, NetherlandsIn-person

About the Job

Requirements

  • PhD, or a Master's degree plus comparable experience, in physics, mathematics, computer science, engineering, or a related quantitative field.
  • Experience turning real, noisy data into reliable results, such as through physical modelling or computer vision, and the intuition to assess whether a model matches reality.
  • Current hands-on Python experience, including writing code that runs efficiently on high-performance computing resources through parallelization.
  • Fluency in English and willingness to travel internationally occasionally.
  • Active daily use of artificial intelligence tooling for coding, data analysis, prototyping, or documentation.

Responsibilities

  • Analyze measurement data to extract meaningful insights for customers' applications.
  • Run the analysis workflow end to end, applying and adapting existing algorithm and software components to new customer applications.
  • Use high-performance computing resources to process large datasets efficiently, and write code that runs well on those resources when needed.
  • Assess whether results are physically sensible and feed findings back to the algorithm and software teams to help guide new methods.
  • Prototype solutions quickly under tight deadlines when existing methods fall short.
  • Contribute technical input to customer-facing application work and customer meetings.
  • Travel internationally to customer sites occasionally, roughly once a quarter.

Desired Qualifications

  • Background in semiconductor metrology, semiconductor processes, or another measurement-heavy field such as scientific instruments or medical imaging.
  • Experience with machine learning, numerical methods, or advanced data analysis.

About the Company

Invisix Measuring Systems

Non-destructive 3D nanoscale chip imaging

Invisix Measuring Systems builds a soft X-ray metrology platform for non-destructive 3D imaging of buried nanoscale chip structures, designed for high-volume semiconductor manufacturing. It uses High Harmonic Generation to produce soft X-ray signals and applies proprietary reconstruction algorithms and machine learning to turn that data into 3D images. This enables viewing buried features that optical tools can’t resolve, with a focus on throughput suitable for complex 3D devices. The company has validated its approach with Intel and imec and recently closed a €20 million seed round with strategic investors to accelerate commercial systems and scale customer demonstrations.

Company size
11-50
Company stage
Seed
Total funding
$22M
Headquarters
Veldhoven, Netherlands
Founded
2025

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