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Micron Technology

Makes memory and storage chips for AI and PCs

Failure Analysis Engineer - MTB Product Quality Assurance Lab

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or master's degree in Materials Science and Engineering, Electrical Engineering, Electronics Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related technical discipline.
  • Strong analytical skills and hands-on laboratory experience.
  • Experience in wafer fabrication, assembly and packaging, product engineering, yield enhancement, a failure analysis laboratory, or advanced packaging technologies is preferred.
  • Experience with fault isolation, voltage contrast, delayering or deprocessing, cross-section analysis, die-level failure analysis, or root cause analysis is preferred.
  • Experience with focused ion beam, scanning electron microscopy and energy-dispersive spectroscopy, 3D X-ray or computed tomography, CSAM, optical microscopy, hot spot analysis, emission microscopy, OBIRCH, PHEMOS, or sample preparation equipment is preferred.
  • Strong problem-solving and analytical skills.
  • Ability to work independently and drive tasks to completion.
  • Ability to collaborate across global and cross-functional teams and manage multiple priorities in a dynamic environment.
  • Experience with Python, JMP, Power BI, or data analytics tools is a plus.
  • Knowledge of HBM, 2.5D/3D packaging, or advanced packaging technologies is a plus.
  • Experience supporting new technology node development and qualification is a plus.
  • Experience with Python, JMP, Power BI, SQL, machine learning, or AI-assisted engineering tools is a plus.
  • Ability to leverage AI-assisted tools and digital solutions to improve failure analysis efficiency, data interpretation, technical decision-making, reporting, knowledge management, and process optimization is preferred.
  • Ability to apply data analytics, automation, and AI-enabled workflows to accelerate root cause investigation and problem-solving is preferred.
  • A data-driven mindset and ability to identify workflow automation and productivity improvement opportunities is preferred.

Responsibilities

  • Perform electrical and physical failure analysis of semiconductor devices and packages.
  • Conduct root cause investigations and provide technical recommendations.
  • Develop and execute analytical plans to support engineering requests.
  • Interpret analytical results and communicate findings effectively.
  • Collaborate with Process, Product, Quality, Reliability, and Manufacturing teams.
  • Generate technical reports and present findings to stakeholders.
  • Support urgent customer- and production-related failure analysis activities.

Desired Qualifications

  • Experience with HBM failure analysis, advanced packaging technologies, TSV analysis, micro-bump inspection, hybrid bonding characterization, die crack analysis, delamination investigation, thermal failure analysis, or material characterization is highly desirable.
  • Experience in technical report writing and presentation in English is a plus.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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