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Micron Technology

Makes memory and storage chips for AI and PCs

Engineer – Process Integration (Package Development Engineering) - Package Development Engineering

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or master's degree in engineering or a related discipline.
  • Zero to two years of relevant experience in semiconductor manufacturing, process engineering, or product engineering.
  • A basic understanding of semiconductor process flows and process integration concepts.
  • Familiarity with data analysis and basic statistics; Excel experience is noted, while JMP or Python is preferred.
  • Ability to follow defined NPI procedures and phase-gate requirements.
  • Ability to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and business outcomes.
  • Ability to collaborate across organizational levels.

Responsibilities

  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled enhancements within the scope of work to contribute to continuous improvement.
  • Execute assigned HBM NPI process-integration tasks in accordance with defined procedures and phase-gate requirements.
  • Support NPI builds through lot tracking, data collection, and readiness activities.
  • Assist with NPI-to-HVM handoff activities and documentation.
  • Support and execute process characterization, Design of Experiments (DOEs), and window studies.
  • Perform yield, defect, and variability analysis using established methods.
  • Support root cause analysis and corrective-action implementation for scoped issues.
  • Work with Fab, Assembly, Test, Yield, and Quality teams on assigned integration scope.
  • Communicate status, risks, and issues to senior engineers and stakeholders; escalate issues appropriately and promptly.
  • Prepare and maintain technical documentation, trackers, and summaries.
  • Contribute clear data and analysis to NPI, Model of Record (MOR), and program reviews.
  • Build understanding of HBM technology, process flows, and process-integration methodologies.
  • Apply feedback to improve execution quality, technical depth, and ownership.

Desired Qualifications

  • Familiarity with JMP or Python.
  • Internship or experience in the semiconductor industry.
  • Demonstrated leadership and a track record of impact.
  • Interest in and knowledge of the semiconductor industry and Micron.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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