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ASM International

Semiconductor deposition equipment and ALD tech

Field Process Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timePhoenix, AZ, USANo salary listed

About the Job

Requirements

  • A Bachelor's or Master's degree in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, Physics, or a closely related technical discipline.
  • Zero to three years of relevant experience; new college graduates are welcome to apply.
  • Academic, research, internship, or industry exposure to thermal atomic layer deposition, thin-film deposition, semiconductor processing, surface chemistry, reaction kinetics, vacuum systems, gases, pressure, flow, or related technologies.
  • Ability to analyze experimental and process data using tools such as JMP, Python, MATLAB, Excel, or similar analytical tools.
  • Strong technical fundamentals and ability to learn complex semiconductor processes and equipment.
  • Strong English communication skills and ability to communicate effectively with customers and cross-functional teams.
  • Ability to work on-site in a customer semiconductor fab and cleanroom environment in North Phoenix.
  • Ability to support extended hours or weekends when required for qualifications, escalations, or critical customer needs.
  • Ability to travel as needed for training or technical support.

Responsibilities

  • Support ASM Synergis and Pulsar thermal atomic layer deposition systems through installation, start-up, qualification, high-volume manufacturing ramp, and production-support activities.
  • Monitor process performance, tool-to-tool matching, process stability, and customer specifications through structured data review and follow-up.
  • Support troubleshooting and resolution of process- and equipment-related issues in partnership with Field Service Engineers, customer engineers, and global technical teams.
  • Assist with experiments and data analysis for process qualification, troubleshooting, continuous improvement, and process-window optimization.
  • Collect and analyze process, metrology, tool-state, and chamber-performance data to support technical decision-making.
  • Apply structured problem-solving techniques, design of experiments, statistical process control, baseline comparisons, and statistical analysis to understand process behavior.
  • Support analysis of thin-film characteristics, including thickness, uniformity, particles and defects, composition, and other relevant process outputs.
  • Communicate technical findings, actions, risks, and next steps to customers and internal stakeholders.
  • Document issue timelines, experimental results, troubleshooting activities, action plans, and lessons learned.
  • Support critical customer needs and escalations while maintaining discipline around safety, controlled changes, confidentiality, and customer and company intellectual property.

Desired Qualifications

  • Hands-on academic, internship, research, or industry experience with thermal atomic layer deposition or thin-film deposition.
  • Familiarity with atomic layer deposition fundamentals, including precursor chemistry, surface reactions, temperature effects, film growth, uniformity, and process optimization.
  • Experience with semiconductor equipment manufacturers, original equipment manufacturer suppliers, or semiconductor manufacturing environments.
  • Experience with design of experiments, statistical process control, statistical analysis, metrology, or characterization of thin films.
  • Previous cleanroom, fab, laboratory, or semiconductor equipment experience.
  • Mandarin proficiency is a plus, but not required.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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