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Mesh Optical Technologies

Designs and mass-produces high-speed optical transceivers

Process Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeGardena, CA, USA

About the Job

Requirements

  • A B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field.
  • Strong troubleshooting skills and experience maintaining high-uptime operation of precision manufacturing tools.
  • Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments.
  • Familiarity with flip-chip bonding, wafer processing, plasma cleaning, and wire bonding equipment and processes.
  • Ability to interpret process documentation, equipment specifications, and production data to drive consistent output.
  • Comfort working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams.
  • Willingness to work extended hours and weekends as needed.

Responsibilities

  • Own day-to-day operation and uptime of production tools, including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders.
  • Design production processes from the lab bench through proof of concept and production ramp.
  • Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specifications.
  • Troubleshoot tool and process issues in real time, minimizing downtime and driving fast root-cause resolution.
  • Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging.
  • Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction.
  • Push process yields above 99.9% and thermal-cycle reliability beyond 1,000 cycles.
  • Support factory scaling efforts by qualifying new tools and recipes that enhance unit throughput and yield.

Desired Qualifications

  • Direct experience qualifying or operating production equipment in a high-volume production environment.
  • Knowledge of sub-micrometer die-bonding, wafer preparation, and materials used in advanced packaging.
  • Familiarity with statistical process control and root cause analysis methods.
  • At least 2 years of experience in process development or yield improvement for optical, photonic, or microelectronic devices.

About the Company

Mesh Optical Technologies

Designs and mass-produces high-speed optical transceivers

Mesh Optical Technologies designs and mass-produces high-performance optical transceivers in the United States for data centers and AI infrastructure. Its flagship product, the Alpha C1, is an optical transceiver that converts electrical signals to light at 1.6 terabits per second. The device uses flip-chip die bonding in its optical engine and removes a power-hungry component to boost energy efficiency by about 3–5%, delivering lower latency and higher reliability for GPU clusters. Production is geared toward scalable manufacturing in the U.S. to reduce reliance on Chinese suppliers, with a plan to reach 1,000 units per day by the end of 2026 and begin bulk orders in 2027. The company aims to scale production, expand its integrated optical manufacturing capabilities, and become a key supplier for hyperscale computing and AI data centers.

Company size
11-50
Company stage
Early VC
Total funding
$50M
Headquarters
Los Angeles, CA
Founded
2025

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