Senior Thermal Engineer

Salary Range: 140000 to 168000 (Currency: USD) (Pay period: per-year-salary)

JOB DUTIES AND RESPONSIBILITIES

Develop thermal architectures, heat transfer analyses, thermal models, and cooling solutions supporting complex products and customer requirements.
Evaluate thermal performance using analytical methods and simulation tools while resolving complex thermal design challenges and optimizing product performance.
Review engineering drawings, technical specifications, and design documentation to validate compliance with thermal and system requirements.
Lead thermal testing activities by coordinating test planning, instrumentation, thermal characterization, and performance evaluations.
Evaluate thermal test results, simulation data, and engineering measurements while identifying root causes and implementing corrective design solutions.
Validate thermal performance through design verification, qualification testing, engineering investigations, and design change activities.
Lead collaboration with mechanical, electrical, systems, manufacturing, test, quality, and program teams to integrate thermal solutions into product designs.
Develop engineering analyses, technical reports, design documentation, presentations, and test summaries supporting engineering decisions.
Participate in design reviews, technical discussions, product development activities, and customer meetings while providing thermal engineering expertise.
Manage thermal models, engineering calculations, analysis documentation, design records, and configuration-controlled technical data supporting product development.
Evaluate engineering processes, design methodologies, thermal analyses, and customer requirements while identifying opportunities to improve engineering execution.
Develop improvements that enhance thermal performance, engineering efficiency, product reliability, manufacturability, and overall design quality.

JOB REQUIREMENTS AND MINIMUM QUALIFICATIONS

• Bachelor's degree in a related technical field with 5–8 years of related experience, Master's degree in a related field with 3–6 years of related experience, or PhD in a related field with 0–3 years of related experience in aerospace or a similarly regulated industry, including thermal modeling, thermal analysis, engineering hand calculations, or a related engineering discipline.
• Experience performing thermal analysis and developing thermal models and engineering hand calculations for aerospace hardware or products in similarly regulated industries.
• Experience performing thermal analysis of electronic components, printed wiring board assemblies (PWBAs), and electronics assemblies.
• Experience using Computer-Aided Design (CAD) and Finite Element Analysis (FEA) software to support engineering design and thermal analysis. Experience with SolidWorks and Ansys products is preferred.
• Advanced knowledge of heat transfer, thermodynamics, fluid mechanics, thermal engineering principles, and aerospace thermal control requirements.
• Comprehensive understanding of thermal system architectures, spacecraft operating environments, environmental qualification requirements, and multidisciplinary product development processes.
• Exercises sound judgment when resolving complex thermal engineering challenges, evaluating technical tradeoffs, and guiding engineering decisions that strengthen product reliability and mission performance.
• Proficiency with Microsoft Office Suite including Outlook, Word, Excel, PowerPoint, and Teams. 

PREFERRED QUALIFICATIONS

Proficiency with finite-difference and thermal network modeling software, particularly Ansys Thermal Desktop, for satellite, spacecraft, and aerospace applications.

Familiarity with Root Cause and Corrective Action (RCCA) methodologies, including 5 Whys, Fishbone diagrams, or equivalent structured problem-solving techniques.

Proficiency with specialized thermal modeling and analysis tools and methodologies, including:

Finite Element Analysis (FEA) using Ansys Mechanical, Ansys Icepak, or equivalent applications.

Calculation of effective in-plane and through-plane thermal conductivity and conductance of printed wiring board assemblies (PWBAs).

JEDEC JESD15-3 two-resistor compact thermal modeling and JESD15-4 DELPHI thermal modeling methodologies.

Mesh convergence analysis to verify numerical accuracy and model reliability.

Experience evaluating and selecting Thermal Interface Materials (TIMs), including calculating thermal resistance and assessing interface performance.

Experience with heat pipe technologies and specialized passive and active cooling components used in aerospace thermal control systems.

Experience correlating analytical thermal models with hardware test data to validate modeling assumptions and improve simulation accuracy.