Foxconn Industrial Internet

Designs and manufactures intelligent manufacturing solutions

Test Engineer

Inspection & TestUpdated on Nov 13

Full-timeMt Pleasant, WI, USANo salary listedIn-person

About the Job

Requirements

A bachelor's degree is required; a bachelor's degree in Electrical Engineering or a related field is preferred.
Zero to two years of experience in printed circuit board assembly processes, methodologies, standards, and best practices.
Knowledge of surface-mount-technology test processes, including FVT, FT, and FBT at the board level.
Working knowledge of test engineering principles, electronic equipment, and mechanical and pneumatic test systems.
Ability to work independently with minimal supervision while meeting deadlines in a fast-paced production environment.

Responsibilities

Develop and implement plans for test processes and test capacity utilization across surface-mount-technology production lines.
Manage and maintain functional test programs for printed circuit board assembly testing.
Train and develop operators on proper use of test equipment and test procedures.
Provide technical support to surface-mount-technology operations related to testing and optimize test processes.
Support test engineering validation for new printed circuit board assembly products and prepare detailed new product introduction reports and recommendations for customers.
Track daily repairs and downtime of production test equipment, analyze data, and recommend corrective actions to improve test efficiency.
Review current test equipment and facilities against present and future requirements to ensure test readiness and customer satisfaction.
Coordinate with vendors and procurement teams to source fixtures, tooling, and equipment required for test setups.
Troubleshoot electronic printed circuit board assemblies and recommend process or design improvements.
Coordinate with Maintenance to drive preventative maintenance programs for test equipment.
Act as a technical escalation point for daily production test issues, responding to line requests and engaging external resources as needed.
Participate in process failure mode and effects analysis activities and new product introduction projects.

Desired Qualifications

A bachelor's degree in Electrical Engineering or a related field is preferred.

FII USA, Inc., a Foxconn Technology Group Company, is seeking a Test Engineer to develop and manage test processes and expand test capacity for printed circuit board assemblies. Once a part of the team, you will be responsible for a wide variety of tasks within the Testing Department in a production environment and have the opportunity to display critical thinking skills to expand your career in Smart Manufacturing.

The Test Engineer will develop plans for process optimization and test capacity utilization for Surface Mount Technology (SMT) lines, support new product introductions, and assist the Testing Department as needed.

Develop and implement plans for test processes and test capacity utilization across SMT production lines.
Manage and maintain functional test programs for PCBA testing.
Train and develop operators on proper use of test equipment and test procedures.
Provide technical support to SMT operations related to testing and drive optimization of test processes.
Support test engineering validation for new PCBA products and prepare detailed NPI reports and recommendations for customers.
Track daily repairs and downtime of production test equipment; analyze data and recommend corrective actions to improve test efficiency.
Review current test equipment and facilities against present and future requirements to ensure test readiness and customer satisfaction.
Coordinate with vendors and procurement teams to source fixtures, tooling, and equipment required for test setups.
Troubleshoot electronic PCBAs and assemblies and recommend process or design improvements.
Coordinate with Maintenance to drive preventative maintenance programs for test equipment.
Act as a technical escalation point for daily production test issues, responding to line requests and engaging external resources as needed.
Participate in PFMEA activities and New Product Introduction (NPI) projects.
Other Duties as assigned.

Bachelor’s degree required; Bachelor’s degree in Electrical Engineering or related field preferred.
0–2 years of experience in printed circuit board assembly processes, methodologies, standards, and best practices.
Knowledge of SMT test processes including FVT, FT, and FBT at the board level.
Working knowledge of test engineering principles, electronic equipment, and mechanical and pneumatic test systems.
Strong analytical, problem-solving, verbal, and written communication skills.
Ability to work independently with minimal supervision while meeting deadlines in a fast-paced production environment.

About the Company

Foxconn Industrial Internet

Designs and manufactures intelligent manufacturing solutions

Foxconn Industrial Internet designs and manufactures technology infrastructure for large tech firms, focusing on intelligent manufacturing and the industrial internet. It combines hardware design and production with software-enabled solutions, including AI and automation platforms like Lighthouse Factory, the FII Cloud (with Tencent Cloud), and Fog Cerebellum, to help clients digitize data and optimize production lines. It differentiates itself through large-scale integration as a design-to-manufacture partner, exclusive assembly of premium Nvidia GB200 AI servers, and a strong push into higher-margin cloud, networking, and industrial AI services backed by Foxconn. Its goal is to move from traditional contract manufacturing to high-value technology services, expanding its AI-server, data-center, EV, and semiconductor test automation businesses with scalable intelligent manufacturing solutions.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Shenzhen, China
Founded: 2015

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