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ASML

Manufactures photolithography systems for semiconductors

HR Data Analyst

Full-TimePosted on 10/15/2026
No salary listed
Mid
Bachelor's
Berlin, Germany
In Person
Data & AnalyticsBusiness Intelligence

About the job

Requirements
  • A university degree in business administration, economics, sociology, psychology, data science, or another field with a strong analytical or research component is required.
  • Professional experience in HR analytics, HR controlling, data analytics, or a comparable field is required; relevant hands-on experience from internships or working-student roles is also valued.
  • Experience using modern analytics technologies to prepare, connect, analyze, and visualize data is required; technologies may include Excel, Power BI, Databricks, Python, SQL, data preparation tools, and generative artificial intelligence tools for analysis and troubleshooting.
  • Experience working with complex datasets and understanding data preparation, data quality, reporting, and dashboard development are required.
  • Fluent German and English are required.
  • A structured and analytical approach is needed for complex questions, multiple data sources, and changing requirements.
  • A problem-solving mindset and curiosity are needed, including persistence in testing different approaches and resolving technical or data-related challenges.
  • Ownership and initiative are needed to think end-to-end and stay engaged until a practical solution is found.
  • Clear communication is needed to explain complex data and analytical results to stakeholders with different levels of technical expertise.
  • A collaborative and reliable working style is needed to work across functions and prioritize multiple requirements.
  • Awareness of data privacy and responsible data use is needed, including careful handling of employee data and application of relevant data protection requirements such as the General Data Protection Regulation.
Responsibilities
  • Manage the end-to-end HR data analytics process, from understanding stakeholder needs and identifying relevant data sources to preparing, analyzing, and visualizing data.
  • Analyze HR data on workforce capacity, talent acquisition, absences, compensation, and diversity, and translate trends and patterns into clear insights, visualizations, and reports for internal stakeholders.
  • Develop and maintain reports, dashboards, forecasts, and ad hoc analyses for HR and other internal stakeholders.
  • Identify and implement suitable technical solutions for data preparation, analytics, reporting, and visualization, including improving data flows and reporting structures.
  • Improve the standardization, simplification, automation, and efficiency of HR reporting and analytics.
  • Enable internal stakeholders to understand dashboards and analytical results and use available insights effectively to address their business questions.
Desired Qualifications
  • Relevant hands-on experience gained through internships or working-student roles is valued.

About the company

ASML designs and manufactures photolithography systems for semiconductor manufacturing. Its main products are deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography machines that print circuit patterns on silicon wafers, with EUV enabling smaller features. The company sells these systems to leading chipmakers and earns substantial revenue from installation, maintenance, and upgrades over the machines’ lifetimes. Its goal is to help continue scaling semiconductors by leading in high-end lithography and maintaining strong relationships with customers like TSMC, Samsung, and Intel.

Company Size

10,001+

Company Stage

IPO

Headquarters

Veldhoven, Netherlands

Founded

1984

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Simplify's Take

What believers are saying

  • Q2 2026 sales hit €9.3 billion, and full-year guidance rose to €43-45 billion.
  • Management said 2028 EUV output could exceed 110 tools, unlocking AI wafer capacity.
  • India launched ASML operations with Tata Electronics support, opening a new customer frontier.

What critics are saying

  • Europe bought zero ASML lithography tools in 2026, exposing a dead domestic demand base.
  • Chinese DUV entrants in Shanghai threaten ASML's 29% 2025 China revenue by 2027.
  • ASML cut 1,700 jobs in 2026; continued restructuring signals execution strain and morale damage.

What makes ASML unique

  • ASML alone ships EUV systems; no advanced chip node exists without Veldhoven tools.
  • High-NA EUV expands into Nvidia-scale data-center chips, extending ASML's moat through 2033.
  • Installed Base Management generated €2.8 billion in Q2 2026, deepening recurring revenue.

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Benefits

  • Flexible Work Hours
  • Remote Work Options

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

0%
Yahoo Finance
Oct 20th, 2026
Apple vs ASML: $416.2B revenue against 15.6% growth and a 29.4% margin

Apple and ASML offer two ways to bet on tech: one sells devices to billions of users, the other makes the lithography machines that chipmakers need to produce advanced semiconductors. In fiscal 2025, Apple's revenue reached nearly $416.2 billion, up about 6.4%. Net income was close to $112 billion, a 26.9% margin, and free cash flow was roughly $98.8 billion. Its debt-to-equity ratio was about 1.5. ASML reported revenue of nearly $36.8 billion, up 15.6%. Net income was $10.8 billion, a margin of about 29.4%, with free cash flow of roughly $12.5 billion. ASML's debt-to-equity ratio was about 0.2, and its current ratio was nearly 1.3, against Apple's 0.9.

Neoteo
Oct 16th, 2026
SemiAnalysis says ASML may be developing a hybrid-bonding tool.

SemiAnalysis says ASML may be developing a hybrid-bonding tool. A patent-based analysis describes a possible die-to-wafer process; ASML had not announced a tool as of October 15, 2026. October 16, 2026 Key points * 01 SemiAnalysis inferred that ASML may be developing a die-to-wafer hybrid-bonding tool; ASML had not announced it as of October 15, 2026. * 02 SemiAnalysis counted 27 ASML bonding patent families filed from December 2022 through November 2024, mostly related to D2W bonding. * 03 The proposed track-based process and its potential technical advantages are SemiAnalysis's interpretation, not measured tool results. * 04 SemiAnalysis expects advanced logic could be the first application; it forecasts D2W adoption in HBM no earlier than 2029, if it happens at all. SemiAnalysis says ASML may be developing a die-to-wafer hybrid-bonding tool. Its proposed process and potential impact on Besi remain unconfirmed. SemiAnalysis said on October 15, 2026, that ASML may be developing a die-to-wafer (D2W) hybrid-bonding tool, drawing that inference from patent filings, roadmap material and earlier reporting. ASML had not announced the tool as of the analysis. Read SemiAnalysis's analysis. Reuters reported on October 16 that ASML did not confirm the development and declined to comment on the report. Read the Reuters report. What the reporting says about ASML. SemiAnalysis counted 27 ASML bonding patent families filed between December 2022 and November 2024, most related to D2W bonding. It also cited The Elec reporting that ASML had begun architecture design with Prodrive Technologies and VDL ETG. These reports inform SemiAnalysis's inference; they do not amount to an ASML product announcement. The proposed tool is specifically a die-to-wafer bonder: individual semiconductor dies would be bonded to a wafer. The central claim in the coverage traces to SemiAnalysis's analysis. Investing.com summarized that analysis, while Reuters reported on it; those accounts do not constitute separate technical confirmation. How SemiAnalysis describes the proposed process. In SemiAnalysis's interpretation of patent material, each die would travel on an individual holder along a track, passing through inspection, cleaning, plasma activation, metrology and alignment before bonding to a wafer. The analysis suggests that independent shuttles could let stations work concurrently, that adding stations could increase capacity, and that recipes could accommodate different die types. Those are proposed design possibilities, not measured results. SemiAnalysis identifies alignment accuracy and particle control as potential advantages, while also pointing to engineering challenges involving feed-forward metrology, die-to-wafer contact, adapting non-bonding tools to the track and keeping the process loop clean. Why a possible tool could matter to Besi. SemiAnalysis describes Besi as the only supplier with D2W tools in volume production and says its logic-bonding business is concentrated at TSMC and Intel. If ASML develops a competing tool, Besi could face a new rival in that segment. SemiAnalysis expects advanced logic to be the likeliest first application for a prospective ASML tool. Its forecast for D2W bonding in high-bandwidth memory (HBM) is no earlier than 2029, if adoption happens at all. Other Languages Read this article in another available language.

MarketScreener
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. Published on 10/16/2026 at 06:54 am EDT - Modified on 10/16/2026 at 06:55 am EDT AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3% at EUR158.50, while ASML was up 1.1% at EUR1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation." (Reporting by Toby Sterling; Editing by Susan Fenton) (C) Reuters - 2026

Channel NewsAsia
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. 16 Oct 2026 06:51PM (Updated: 16 Oct 2026 06:54PM) Add CNA as a trusted source to help Google better understand and surface our content in search results. AMSTERDAM, Oct 16: Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3 per cent on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3 per cent at €158.50, while ASML was up 1.1 per cent at €1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation."

WZUU
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. By Thomson Reuters Oct 16, 2026 | 6:51 AM AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3% at €158.50, while ASML was up 1.1% at €1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation." (Reporting by Toby Sterling; Editing by Susan Fenton) Now Playing WZUU 92.5 - Kalamazoo's Music Authority Fri Oct 16 Kalamazoo, MI, USA Wind/Dir: 30 MPH-NW Humidity: 94%