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Micron Technology

Makes memory and storage chips for AI and PCs

Engineer – PDE APACT MRDA

Inspection & TestPosted on Nov 10
Full-timeGeorge Town, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree or higher degree, or equivalent experience, in Engineering, including Electrical, Mechanical, Mechatronics, Materials, Chemical Engineering, or a related field.
  • Strong communication, problem-solving, and executive presentation skills.
  • Strong analytical, logical, and critical thinking skills.
  • Ability to apply baseline digital fluency and role-appropriate artificial intelligence literacy to use artificial-intelligence-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and business outcomes.

Responsibilities

  • Develop, qualify, deploy, and sustain advanced defect inspection and metrology solutions that support New Product Introduction and High Volume Manufacturing.
  • Manage advanced inspection and metrology platforms throughout package development and manufacturing.
  • Develop technology roadmaps and capability strategies to meet future packaging requirements.
  • Drive equipment lifecycle management, capacity planning, and technology insertion activities.
  • Lead tool installation, qualification, release, and production readiness activities.
  • Establish equipment acceptance criteria, qualification methodologies, and deployment plans.
  • Drive tool-to-tool matching and network standardization initiatives.
  • Develop inspection solutions to detect, monitor, and reduce critical defect mechanisms.
  • Set up defect metrics, observation methods, and continuous advancement plans.
  • Manage and improve manufacturing and research data analytics data systems and engineering applications related to Advanced Packaging and Conventional Packaging technologies.
  • Enable integration of inspection, metrology, manufacturing, and quality data for defect traceability and analysis.
  • Drive development of dashboards, analytics platforms, and automated workflows to support operational and engineering excellence.
  • Establish data governance, standards, and guidelines to ensure scalable and reliable manufacturing and research data analytics solutions across the network.
  • Apply artificial intelligence and advanced analytics to improve defect detection, prediction, and process control efficiency.
  • Support technology development programs in Advanced Packaging and Conventional Packaging.
  • Ensure inspection and metrology tool readiness for New Product Introduction, pilot builds, and manufacturing ramps.
  • Collaborate with equipment suppliers to resolve technical issues and improve tool performance.
  • Evaluate and introduce next-generation inspection technologies and solutions.
  • Lead technical reviews, address blocking issues, and manage ongoing improvement initiatives with suppliers.
  • Partner with Process, Equipment, Manufacturing, Quality, Automation, and Global Engineering teams.
  • Lead project execution, risk management, and achievement delivery for central initiatives.
  • Influence collaborators and drive alignment across sites and organizations.
  • Integrate artificial-intelligence-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.
  • Contribute to continuous improvement by identifying, testing, and sharing artificial-intelligence-enabled enhancements within the role's scope.

Desired Qualifications

  • Interest in and knowledge of the semiconductor industry and Micron.
  • Knowledge and experience driving equipment qualifications, technology transfers, and manufacturing ramp readiness.
  • Ability to influence technical strategy across multiple organizations and sites.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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