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Soitec

Engineered substrates for silicon-on-insulator wafers

Manufacturing Engineer

Manufacturing EngineeringUpdated on Nov 10
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A degree is required for fresh candidates; alternatively, a diploma with a minimum of six years of relevant experience is accepted.
  • Basic computer skills are required, preferably in Microsoft Office.
  • Basic cleanroom knowledge is advantageous.
  • Knowledge of SQL is advantageous.
  • Good communication and leadership skills are required.

Responsibilities

  • Develop and carry out production-improvement programs for the area of responsibility, including workflow and ergonomics improvements.
  • Improve equipment throughput and efficiency.
  • Investigate ways to reduce scrap, nonconformity, and manpower ineffectiveness.
  • Improve manufacturing operations cost-effectively to increase production efficiency and meet delivery schedules.
  • Compile and submit module performance reports.
  • Review documentation on module-related events and activities to keep records updated and maintained for future reference.
  • Compile and submit shift line performance reports to comply with policies, maintain documentation, and improve operational efficiency.
  • Analyze products, equipment condition, and process flow; identify problems, propose countermeasures, and implement and follow up on improvement activities to maintain quality standards and prevent nonconforming products.

Desired Qualifications

  • Basic cleanroom knowledge is advantageous.
  • Knowledge of SQL is advantageous.

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Bernin, France
Founded
1992

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