Nexperia

Manufactures discrete semiconductors, logic devices, MOSFETs

Wire Bond Maintenance Manager

Equipment MaintenanceConfirmed live in the last 24 hours

Full-timeSeremban, Negeri Sembilan, MalaysiaNo salary listedIn-person

About the Job

Requirements

A bachelor's degree in Mechanical, Electrical, Mechatronics, or a related Engineering discipline.
At least 10 years of experience in semiconductor manufacturing, with strong exposure to equipment maintenance.
At least 5 years of leadership experience managing Engineering or Maintenance teams.
Strong knowledge of Wire Bond equipment and semiconductor assembly manufacturing processes.
Experience in equipment reliability, preventive maintenance, troubleshooting, and continuous improvement initiatives.
Familiarity with Total Productive Maintenance (TPM), Lean Manufacturing, Statistical Process Control (SPC), and root cause analysis methodologies.
Strong leadership, communication, problem-solving, and project management skills.

Responsibilities

Lead and develop a team of Maintenance Engineers and Technicians.
Develop and implement preventive and predictive maintenance strategies for Wire Bond equipment.
Drive Overall Equipment Effectiveness (OEE) improvement initiatives.
Minimize equipment downtime and improve Mean Time to Repair (MTTR) and Mean Time Between Failures (MTBF).
Lead equipment reliability and continuous improvement projects to enhance manufacturing performance.
Manage spare parts inventory, maintenance resources, and budget effectively.
Support new equipment installation, qualification, buy-off, and production ramp activities.
Ensure preventive maintenance (PM) compliance and maintenance effectiveness across all Wire Bond equipment.
Lead root cause analysis and corrective actions for major equipment failures and recurring issues.
Collaborate with Process Engineering, Production, and Quality teams to improve equipment performance, yield, and product quality.
Drive cost reduction and maintenance optimization initiatives.
Ensure compliance with Safety, electrostatic discharge (ESD), ISO, and Quality Management System requirements.

Wire Bond Maintenance Manager

Job Summary

Lead the maintenance organization to maximize equipment uptime, reliability, and manufacturing productivity for Wire Bond operations. Drive preventive maintenance strategies, equipment reliability improvement, cost optimization, and team development to support production and business objectives.

What You Need to Do

Lead and develop a team of Maintenance Engineers and Technicians.
Develop and implement preventive and predictive maintenance strategies for Wire Bond equipment.
Drive Overall Equipment Effectiveness (OEE) improvement initiatives.
Minimize equipment downtime and improve Mean Time to Repair (MTTR) and Mean Time Between Failures (MTBF).
Lead equipment reliability and continuous improvement projects to enhance manufacturing performance.
Manage spare parts inventory, maintenance resources, and budget effectively.
Support new equipment installation, qualification, buy-off, and production ramp activities.
Ensure preventive maintenance (PM) compliance and maintenance effectiveness across all Wire Bond equipment.
Lead root cause analysis and corrective actions for major equipment failures and recurring issues.
Collaborate with Process Engineering, Production, and Quality teams to improve equipment performance, yield, and product quality.
Drive cost reduction and maintenance optimization initiatives.
Ensure compliance with Safety, ESD, ISO, and Quality Management System requirements.

What You Need to Have

Bachelor's Degree in Mechanical, Electrical, Mechatronics, or a related Engineering discipline.
Minimum 10 years of experience in semiconductor manufacturing with strong exposure to equipment maintenance.
Minimum 5 years of leadership experience managing Engineering or Maintenance teams.
Strong knowledge of Wire Bond equipment and semiconductor assembly manufacturing processes.
Experience in equipment reliability, preventive maintenance, troubleshooting, and continuous improvement initiatives.
Familiarity with TPM, Lean Manufacturing, SPC, and root cause analysis methodologies.
Strong leadership, communication, problem-solving, and project management skills.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

About the Company

Nexperia

Manufactures discrete semiconductors, logic devices, MOSFETs

Nexperia operates as a global supplier of semiconductor components, focusing on discrete semiconductors, logic devices, and MOSFETs. It serves automotive and industrial customers, providing parts that help electronic systems manage power, process signals, and protect data. The company designs, manufactures, and distributes these high-performance components, which are used in applications such as power management, autonomous driving, and data protection. Compared with competitors, Nexperia emphasizes reliability, quality, and targeted expertise in automotive and industrial markets, supported by ongoing improvement and product development. Its goal is to maintain leadership in supplying essential semiconductor parts that enable safer, more efficient, and more capable electronic systems.

Company size: 1,001-5,000
Company stage: Acquired
Total funding: $880M
Headquarters: Nijmegen, Netherlands
Founded: 1953

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