HBM Logic Architect
About the job
- A bachelor's degree or higher in Electrical Engineering or a related discipline is required; a master's degree is preferred.
- At least 5 years of relevant experience in semiconductor, ASIC/SoC, digital IP, memory, or PHY design.
- Experience with high-speed digital PHY or high-speed IP design and analysis.
- Experience with DRAM memory controller design and analysis.
- Experience with DRAM DFT/DFD architecture, design, or analysis.
- Experience with PHY/TSV bit macro design, TSV PHY hard macro design, or 3D PHY design.
- Define, design, and validate digital IP for ASIC/SoC products.
- Perform RTL design and implementation based on approved specifications.
- Collaborate with cross-functional teams to define IP functionality, behavior, and architecture.
- Review digital IP requirements and evaluate architecture options based on PPA targets.
- Determine or contribute to architecture decisions for digital IP implementation.
- Develop and verify RTL designs using industry-standard design methodologies.
- Provide design guidance and support for physical design implementation.
- Strengthen digital IP design capabilities for HBM and next-generation DRAM development by securing personnel for real-time support near customer sites.
- Drive system-level co-optimization beyond standalone DRAM design.
- Build deep technical partnerships with U.S.-based customers.
- Improve competitiveness through close engagement with customers in the U.S.
- Experience in PPA (Power, Performance, Area) optimization.
About the company
Summary of SK hynix: 1) What does the company do? It is a global producer of semiconductor memory, specializing in DRAM and NAND Flash that power IT devices like computers, phones, and servers. 2) How do its products work? DRAM stores data using tiny capacitors and requires periodic refreshing to keep data, providing fast volatile memory. NAND Flash stores data in non-volatile memory cells and preserves data without power, serving as durable storage. Both chips are mounted in devices to enable fast processing and data retention. 3) How is the company different from competitors? It ranks as the second-largest memory chip maker with a broad product portfolio and strong technology, backed by the SK Group, giving it scale, resources, and global reach. 4) What is the company's goal? To become the world’s best semiconductor company by meeting diverse customer needs and leading in memory technology.
Company Size
5,001-10,000
Company Stage
IPO
Headquarters
Seoul, South Korea
Founded
1983
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Simplify's Take
What believers are saying
- 2Q26 revenue reached 79.3 trillion won, up 257%, with 76% operating margin.
- SK hynix won TSMC's 2026 Partner of the Year again, reinforcing ecosystem leadership.
- OpenAI, Nvidia, and Microsoft deals locked HBM demand through 2030, sustaining utilization.
What critics are saying
- Samsung raised HBM share to 33% by 2Q26, attacking SK hynix's lead aggressively.
- Indiana packaging starts October 2028, leaving U.S. customers dependent on Korea through 2029.
- Nvidia allocation drives HBM pricing and share, making SK hynix vulnerable to customer concentration.
What makes SK hynix unique
- SK hynix shipped HBM4 in 2Q26 and supplies Nvidia's Vera Rubin platform.
- TSMC awarded SK hynix Partner of the Year for HBM5-CoWoS collaboration in September 2026.
- Indiana's $4 billion HBM packaging fab creates first U.S. back-end base by 2029.
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Benefits
- Health Insurance
- Paid Vacation
- Paid Holidays
- Paid Parental Leave
- 401(k) Company Match
- Educational reimbursement
- Donation Matching and volunteering opportunities
- Corporate discount programs
- Health Insurance
- Paid day offs: PTO + Company Holidays + Happy Fridays