M

Micron Technology

Makes memory and storage chips for AI and PCs

Engineer – HIG-HBM Product System & Engineering - Media Health Manufacturing

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A bachelor's or master's degree in Electrical and Electronics Engineering or a related field.
  • Experience in semiconductor devices, circuit design, or product validation is a plus.
  • Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.
  • Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
  • Strong attention to detail and a commitment to quality.
  • Ability to work effectively in team-based projects, contributing to shared goals and outcomes.
  • Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.
  • Responsible and accountable, with a professional work ethic and ownership of assigned tasks.
  • Clear and effective communication skills, especially when articulating technical concepts and findings.

Responsibilities

  • Spearhead and develop a high-performing team driving Media Health Manufacturing activities for the latest HBM products across DRAM and Interface die and stacked products.
  • Lead a portfolio of next-generation HBM products focused on quality, cost, cycle time, and scale.
  • Lead manufacturing test flow development and validation.
  • Improve device and stacked yield through optimized extrinsic and intrinsic reliability, circuit debug, test coverage optimization, test strategy innovation, manufacturing-flow test-time improvement, and design-for-test strategy.
  • Ensure optimized test coverage for current and future HIG HBM design architectures and process nodes in high-volume manufacturing.
  • Develop, validate, characterize, and qualify next-generation HBM products to ensure reliability and market readiness.
  • Support design verification and in-depth circuit analysis of new products using computer-aided design tools and Verilog simulations.
  • Improve manufacturing test yields, reduce test time, and resolve yield-related issues involving device issues from DRAM, Interface, and stacked die yield.
  • Identify root causes and resolve manufacturing test flow issues, qualification issues, and return material authorization device issues.
  • Promote innovation and drive changes that provide a technical advantage.
  • Mentor and develop others.
  • Develop project management skills within the team to support efficient project execution and timely delivery of technological solutions.
  • Make final decisions on risk analysis and project prioritization.
  • Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams to develop and ship end products.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

Recently Posted Jobs

Explore more opportunities at Micron Technology

See more jobs