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Micron Technology

Makes memory and storage chips for AI and PCs

Uniformity Staff/Principal Engineer - Multiple Teams

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listed

About the Job

Requirements

  • Knowledge of semiconductor fabrication process flows and how interactions between processes and process changes affect yield, device performance, and reliability.
  • Understanding of DRAM and NAND operation and structure, and the ability to interpret parametric, probe, and qualification data from front-end and backend assembly processes.
  • Model-based problem-solving ability, data-driven decision-making, and presentation skills.
  • Proven ability to troubleshoot and solve structure- and device-related issues and address root causes.
  • Organizational ability and flexibility to assume added responsibilities as needed.
  • Ability to travel to Micron sites for face-to-face collaboration as necessary.
  • Ability to work effectively, build strong customer and coworker relationships, and contribute to team dynamics.
  • Ability to multitask and communicate verbally and in writing.
  • More than five years of relevant industry experience and knowledge.
  • A bachelor's, master's, or PhD degree in electrical engineering, materials engineering, materials science, physics, or chemical engineering is optional if the candidate has more than eight years of experience in a semiconductor-industry process-related role.

Responsibilities

  • Lead process integration structural uniformity and cross-loop integration for critical modules, including capacitance loops, and own end-to-end integration strategies to resolve yield, quality, and reliability gaps.
  • Drive physics- and process-based integration solutions with cross-module process owners, process integration subject-matter experts, and key suppliers to optimize integration structures and achieve best-in-class yield and quality targets.
  • Develop and apply model-based root-cause analysis frameworks covering transport, reaction kinetics, pattern density, and geometry-dependent effects to diagnose structural non-uniformity.
  • Define, implement, and continually strengthen critical inline monitoring and defense lines for critical dimensions, film loss, mass delta, defectivity, and edge and periphery metrics to ensure robust structural-uniformity control.
  • Own and advance product integration programs and loop-level domain expertise, maintaining technical knowledge across node transitions.
  • Drive node-over-node shift-left integration, including early implementation of uniformity, bevel, and backside best-known methods during development phases to accelerate whole-wafer center-to-edge yield and quality ramp.
  • Lead global projects, standardize and leverage network best-known methods, and scale proven solutions across sites to drive worldwide technical alignment and execution.
  • Identify efficiency and performance gaps and lead business-process creation, optimization, and re-engineering to improve benchmark performance, cycle time, and development productivity.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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