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Qnity

Publicly-traded provider of semiconductor materials

Research Scientist

Thermal & Fluids EngineeringPosted on Nov 13
Full-timeKingston, ON, CanadaNo salary listedIn-person

About the Job

Requirements

  • Ph.D. in Mechanical Engineering, Materials Engineering, Chemical Engineering, or a closely related discipline.
  • 3–7 years of research and development experience in thermal materials or thermal management technologies.
  • Strong fundamentals in heat transfer, including conduction, convection, and phase change.
  • Experience with thermal modeling and simulation using finite element method or computational fluid dynamics tools such as ANSYS, COMSOL, or equivalent.
  • Experience with thermal characterization techniques such as laser flash, differential scanning calorimetry, thermogravimetric analysis, and infrared thermography.
  • Demonstrated expertise in thermal interface materials, gap fillers, phase-change materials, dielectric materials, or thermally conductive composites for electronics applications.
  • Knowledge of structure–property relationships in thermally conductive materials, including particle-filled systems, hybrid materials, and anisotropic heat conduction designs.
  • Experience with materials processing and manufacturing techniques such as mixing, dispersion, coating, curing, and interface engineering.
  • Excellent project management, planning, and prioritization skills.
  • Strong interpersonal, communication, and presentation skills, with the ability to engage technical and non-technical stakeholders.
  • Advanced analytical and technical problem-solving skills, including data interpretation and modeling.
  • Ability to work independently and within interdisciplinary teams, with a commitment to safety and engineering excellence.

Responsibilities

  • Provide technical leadership in planning and executing a comprehensive research and development program, including scale-up, focused on thermal materials engineering, heat transfer, and mechanical design for advanced electronics and semiconductor applications.
  • Contribute to developing next-generation thermal management solutions, including thermal interface materials, heat spreaders, encapsulants, and advanced composite systems aligned with business objectives.
  • Identify and create commercial value in thermally functional materials and systems by applying expertise in heat transfer, thermal conductivity enhancement, and structure–property–performance relationships in engineered materials.
  • Develop and analyze intellectual property and patent landscapes related to thermal solutions for semiconductor packaging, power electronics, and high-density electronic assemblies, identifying opportunities for innovation and protection of novel technologies.
  • Ensure objectives, milestones, and deliverables are achieved on time and within budget through project management.
  • Foster a positive and collaborative work environment by providing technical leadership and mentorship to team members.
  • Work independently and drive complex thermal engineering challenges under minimal supervision.

Desired Qualifications

  • Post-doctoral experience in thermal sciences, electronics cooling, or advanced materials.
  • Experience with semiconductor packaging, power electronics cooling, or high-performance computing thermal challenges.
  • Demonstrated mentorship or team leadership experience.
  • Familiarity with product development and business processes.

About the Company

Qnity

Publicly-traded provider of semiconductor materials

Qnity will be an independent, publicly traded electronics materials company spun off from DuPont, serving the semiconductor and electronics industries. It offers materials and solutions for chip manufacturing and high-speed data transmission, with brands such as Pyralux laminates for flexible circuits, Laird thermal interface materials, Kalrez sealants, and Circuposit copper for interconnects. As a standalone company, it aims to differentiate itself through focused strategies, scale (about 10,000 employees, roughly 40 manufacturing sites, and 20 labs) and a broad global reach to support AI, high-performance computing, and advanced connectivity. Its goal is to become a leading global provider of electronic materials across sectors like data centers, automotive, aerospace, consumer electronics, and healthcare.

Company size
11-50
Company stage
IPO
Headquarters
Wilmington, DE
Founded
2024

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