M

Micron Technology

Makes memory and storage chips for AI and PCs

Director Technical Package Development - DRAM Packaging

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field.
  • At least 15 years of semiconductor packaging experience, including delivery of advanced packaging technologies from development through high-volume manufacturing.
  • At least 10 years of experience leading engineering teams, complex technology programs, or global engineering organizations.
  • Demonstrated expertise in advanced packaging technologies, including HBM, LPDRAM, DDR, 3D stacking, heterogeneous integration, or related platforms.
  • Proven experience driving business-critical technology decisions through technical analysis, risk assessment, and multifunctional collaboration.

Responsibilities

  • Define and execute long-term DRAM packaging strategies that support future product, technology, and business objectives.
  • Lead development and deployment of advanced packaging technologies, including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, and next-generation interconnect solutions.
  • Drive adoption of artificial intelligence, machine learning, advanced analytics, and digital engineering approaches to improve product development, manufacturing, and engineering productivity.
  • Build, develop, and lead a global packaging organization focused on innovation, technical excellence, accountability, and operational execution.
  • Partner with design, product engineering, manufacturing, quality, supply chain, and technology development teams to deliver successful products from concept through high-volume manufacturing.
  • Establish and maintain strategic relationships with customers, OSAT partners, foundries, suppliers, equipment vendors, and research institutions.
  • Lead technology investment decisions through benchmarking, cost analysis, risk assessment, and case development.
  • Drive organizational performance through scalable engineering processes, automation, knowledge management, and data-driven decision-making.

Desired Qualifications

  • A master's degree or PhD in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field.
  • Experience implementing artificial intelligence, machine learning, advanced analytics, or digital engineering solutions to improve engineering, manufacturing, or business outcomes.
  • Experience leading digital transformation initiatives involving automation, data science, and engineering productivity improvements.
  • Executive communication and customer engagement experience, including representing an organization at industry forums, customer meetings, or technical conferences.
  • A demonstrated record of innovation through patents, industry publications, conference presentations, or other recognized technical contributions.
  • Experience developing future technology roadmaps and influencing strategic direction across engineering and business organizations.
  • Proven success building high-performing teams, mentoring leaders, and driving a culture of continuous improvement and innovation.
  • Experience and/or interest in developing Agentic AI workflows into current or future processes.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

Recently Posted Jobs

Explore more opportunities at Micron Technology

See more jobs