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GlobalFoundries

Semiconductor foundry delivering specialized chips

Principal Failure Analysis Technician

Full-TimeUpdated on 10/23/2026
$58.4k - $100.8k
Expert
Associate's
Malta, NY, USA
In Person
Manufacturing Quality & TestInspection & Test
Company Does Not Provide H1B Sponsorship

About the job

Requirements
  • A two-year technical or associate degree in science, math, engineering, electrical engineering, semiconductor manufacturing, or a related discipline, or equivalent military training or experience.
  • Significant experience in semiconductor failure analysis or an analytical laboratory environment.
  • Strong experience with TEM and SEM sample preparation and analysis.
  • Strong experience operating and troubleshooting analytical tools.
  • Demonstrated ability to execute complex tasks independently.
  • Fluency in written and spoken English.
  • Ability to perform shift work on a 12-hour-per-day schedule.
  • Ability to follow laboratory work and safety procedures.
Responsibilities
  • Perform advanced failure analysis techniques, including TEM sample preparation and imaging, SEM analysis, FIB cross-sectioning and related techniques, top-down deprocessing, and chemical operation.
  • Execute complex analytical tasks independently while ensuring high-quality, accurate, and repeatable results.
  • Troubleshoot challenging samples, processes, or tool issues using advanced problem-solving.
  • Provide flexible cross-functional support and adapt to changing business priorities, urgent customer requests, and workload shifts.
  • Support multiple technologies, products, and sample types to maintain throughput and efficiency.
  • Serve as a subject matter expert on one or more analytical techniques.
  • Troubleshoot tool issues and improve existing processes and procedures.
  • Perform basic preventive maintenance of analytical equipment as needed to minimize standby and idle time.
  • Contribute to developing and refining standard operating procedures and best-known methods.
  • Work with lab engineers and managers to define analytical methods, meet analysis expectations, and interpret results.
  • Communicate job status, technical challenges, and results effectively.
  • Support cross-functional teams in resolving complex failure modes.
  • Provide technical guidance and mentorship to junior technicians.
  • Support training across TEM, SEM, and FIB disciplines.
  • Lead or contribute to technical problem-solving initiatives and team improvements.
  • Train new team members as needed and perform other assigned duties.
  • Identify and implement opportunities to improve quality, productivity, and throughput.
  • Participate in continuous improvement initiatives and laboratory optimization.
  • Understand and follow health, safety, and environmental procedures and requirements.
  • Conduct routine analytical work using defined and documented procedures while meeting or exceeding cycle-time and quality standards.
Desired Qualifications
  • Strong understanding of semiconductor device structures and processes.
  • Experience supporting high-volume manufacturing environments.
  • Ability to manage multiple priorities with high attention to detail.
  • Semiconductor process knowledge.
  • Advanced experience using SEM, FIB, finger polishing, chemical etching, and TEM sample preparation.
  • Ability to follow detailed instructions and procedures, complete required documentation, and work accurately and punctually in a detail-oriented environment.
  • Direct experience in an analytical laboratory, preferably related to failure analysis, materials science, inorganic chemistry, or semiconductor manufacturing.
  • Direct knowledge of one or more failure-analysis methodologies used in state-of-the-art semiconductor manufacturing.

About the company

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify's Take

What believers are saying

  • Marvell expanded SiGe capacity on September 17, 2026, signaling demand through 2027.
  • Commerce finalized a $375 million R&D award on September 8, 2026, plus a July $300 million framework.
  • SMART Photonics partnered with GF on September 21, 2026, widening its photonics platform and customer funnel.

What critics are saying

  • Smart mobile is 36% of revenue, and management expects low-teens decline in 2026.
  • Tower Semiconductor litigation in Texas and the ITC risks injunctions, distraction, and patent retaliation.
  • If AI photonics demand normalizes before 2027, GF's growth story reverts to commoditized mature-node fabs.

What makes GlobalFoundries unique

  • GlobalFoundries abandoned bleeding-edge nodes in 2018, specializing in feature-rich chips for autos and connectivity.
  • Its Malta, Burlington, Dresden, and Singapore footprint sells trusted regional supply to governments and enterprises.
  • GF owns uncommon SiGe, silicon photonics, and FDX process depth for optical and edge chips.

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Benefits

  • Professional Development Budget

Growth & Insights and Company News

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Yahoo Finance
Oct 15th, 2026
US doubles GlobalFoundries stake to about 8% in deal with up to $21B Japan-backed chip plants

The US government has doubled its equity stake in chipmaker GlobalFoundries to nearly 8%, President Donald Trump announced Wednesday. He said the stake is now "worth over 2 Billion Dollars" in a company with a market capitalisation of about $27.2 billion. The deal reallocates a $955 million award under the 2022 Chips and Science Act toward modernising the company's facilities. GlobalFoundries said the government is taking an additional stake of about 4%. A new vehicle co-owned by the US and Japanese governments will fund two fabrication plants, described as "up to $21 billion" in investment, with about $10 billion initially. GlobalFoundries will build and operate them, and expects about $3 billion in compensation over the next decade. The first plant is due online in 2029, the second in 2031.

Guggenheim Partners
Oct 14th, 2026
GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative | GlobalFoundries

GF has been selected as the technology provider and operator for two new fabs at its Malta, New York, site under a U.S.-Japan initiative.

Sohu
Oct 14th, 2026
GlobalFoundries to build two New York chip plants with up to $21B from Japan, US to take 4% stake

GlobalFoundries will build two new chip factories at its existing site in upstate New York, according to a deal announced on October 14. Japan's government will provide up to $21 billion in funding. The US government will buy about 4% of the company's shares. The two plants will be jointly held by the US and Japan. The new factories will make basic chips, reducing reliance on suppliers in East Asia.

Bloomberg
Oct 14th, 2026
GlobalFoundries to build two chip plants with up to $21B in Japanese backing

GlobalFoundries Inc. plans to build two new chip plants with backing of as much as $21 billion from the Japanese government. The arrangement is part of a US-Japan deal that also includes the US taking a 4% stake in the company.

Yahoo Finance
Oct 8th, 2026
TSMC signs $2B deal with GlobalFoundries for AI chip silicon interposers at New York plant

GlobalFoundries shares rose nearly 6% Thursday after announcing a $2 billion manufacturing deal with Taiwan Semiconductor Manufacturing Company to produce silicon interposers at its New York facility. The five-year agreement will support expanded manufacturing capacity, with volume production expected to begin in the first half of 2028. The facility is set to become the first US-based source of silicon interposers for advanced packaging technologies. These components are crucial for TSMC's Chip-on-Wafer-on-Substrate technology, which connects AI processors with high-bandwidth memory. The deal addresses constraints in TSMC's CoWoS packaging capacity, which has become a bottleneck for AI chip production. Counterpoint Research estimates the supply-demand gap could remain around 20% in 2026 before narrowing to roughly 10% in 2027.