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Micron Technology

Makes memory and storage chips for AI and PCs

Front End Central Product Integration - Front End, MTS

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listed

About the Job

Requirements

  • Knowledge of semiconductor fabrication process flows and how interactions or changes across processes affect yield, device performance, and reliability.
  • Understanding of DRAM and NAND operation and structure, and ability to interpret parametric, probe, and qualification data from front-end and backend assembly processes.
  • Model-based problem-solving and data-driven decision-making skills, including presentation skills.
  • Demonstrated ability to troubleshoot and resolve structure- and device-related issues and determine root causes.
  • Ability to work effectively, manage multiple tasks, and take initiative in assuming added responsibilities.
  • More than 7 years of relevant industry experience or knowledge.
  • A degree is optional for candidates with more than 10 years of experience in a semiconductor-industry process-related role; the listed degree fields are preferred.

Responsibilities

  • Lead process integration structural uniformity and cross-loop integration for critical modules, including capacitance loops, and own end-to-end integration strategies to resolve yield, quality, and reliability gaps.
  • Develop physics- and process-based integration solutions in collaboration with cross-module process owners, subject-matter experts, and suppliers to optimize integration structures and meet yield and quality targets.
  • Develop and apply model-based root-cause analysis frameworks using transport, reaction kinetics, pattern density, and geometry-dependent effects to diagnose structural non-uniformity.
  • Define, implement, and strengthen critical inline monitoring and defense lines for critical dimension, film loss, mass delta, defectivity, and edge/periphery metrics.
  • Own and advance product integration programs and loop-level domain expertise, maintaining technical knowledge across node transitions.
  • Drive node-over-node shift-left integration, including early implementation of uniformity, bevel, and backside best-known methods during development to accelerate whole-wafer center-to-edge yield and quality ramp.
  • Lead global projects, standardize and leverage network best-known methods, and scale proven solutions across sites.
  • Identify efficiency and performance gaps and lead business-process creation, optimization, and re-engineering to improve benchmark performance, cycle time, and development productivity.
  • Travel to Micron sites as necessary for face-to-face collaboration.

Desired Qualifications

  • Bachelor's, Master's, or PhD degree in Electrical Engineering, Materials Engineering, Materials Science, Physics, or Chemical Engineering.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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