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Onto Innovation

Semiconductor process-control metrology and inspection equipment

Field Service Engineer 2 - Non-Exempt

Equipment Field ServiceConfirmed live in the last 24 hours
Full-timeTucson, AZ, USA

About the Job

Requirements

  • A BS degree or higher with 2 years of experience in optical engineering, mechanical engineering, or an equivalent combination of education and experience.
  • Experience in the application and integration of precision optical and optomechanical components.
  • Analytical capability for systematic troubleshooting.
  • Working knowledge of electronics, mechanics, computers, and common tools.
  • Must maintain a valid driver's license.
  • Customer focus, strong verbal and written communication skills, self-direction, reliability, interpersonal skills, and willingness to work in a team environment.

Responsibilities

  • Understand 4D products, including assembly, function, and performance.
  • Troubleshoot and repair 4D systems in the field or at the factory.
  • Provide customer email and phone support to address concerns and issues; if unsuccessful, gather information and escalate to other service staff.
  • Complete repair jobs following work instructions, and complete data sheets and associated reports.
  • Travel up to 30%, both in the United States and internationally.
  • Perform other duties as required.

About the Company

Onto Innovation

Semiconductor process-control metrology and inspection equipment

Onto Innovation provides semiconductor capital equipment and software for process control, metrology, and inspection. Its products include 3D metrology, macro defect inspection, unpatterned wafer quality assessment, and factory analytics software; these tools measure nanoscale transistor features and micron-level die interconnects, while software analyzes the data to give actionable manufacturing insights and customers buy equipment with ongoing service contracts and licenses. The company differentiates itself by offering an end-to-end process-control portfolio that spans front-end fabrication and back-end packaging, a result of the 2019 merger of Nanometrics and Rudolph Technologies, with integrated hardware and analytics that support complex architectures like chiplets. Its goal is to help semiconductor manufacturers increase device yield, boost productivity, and lower total production costs, aligning with capital spending cycles in AI workloads and advanced node technologies.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Wilmington, MA
Founded
2019

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