I

Intel

Pioneers microprocessors, CPUs for PCs

Power Delivery Design Engineer

Full-TimePosted on 10/20/2026
No salary listed
Senior
Bachelor's, Master's
Toronto, ON, Canada+1 moreMore locations: Canada
In PersonOn-site presence required; willing to travel globally to meet internal teams and external customers.
Electrical EngineeringPower Systems Engineering

About the job

Requirements
  • A Bachelor's or Master's degree in Electrical Engineering or a related field is required.
  • At least 5 years of experience designing low-voltage, high-current, multi-phase DC-DC switching regulators, such as buck and boost regulators, to meet stringent targets and optimize transient response and conversion efficiency.
  • At least 5 years of experience using signal integrity, power integrity, and power delivery network simulation tools such as Cadence Sigrity PowerDC/PowerSI and Ansys SIwave to develop accurate circuit-design models.
  • At least 5 years of experience designing and optimizing power delivery simulation models using SPICE and time-based simulation tools such as LTSpice and SIMPLIS based on system-on-chip design power requirements.
  • At least 5 years of experience modeling power delivery networks across die, package, and PCB, including stackup, plane assignment, decoupling network design, and S-parameter extraction and correlation.
  • At least 5 years of experience using oscilloscopes and data acquisition equipment for hardware troubleshooting and debugging.
  • At least 5 years of experience interacting with signal integrity, layout, and mechanical engineers, with working knowledge of signal integrity, power integrity, PCB layout, and mechanical aspects of board designs.
Responsibilities
  • Develop hardware and platform solutions for Intel products, including IPs targeted at next-generation GPUs and AI accelerators.
  • Work on end-to-end power delivery design and development, from initial concept through implementation of power delivery requirements and ecosystem-enabling power integrated circuits.
  • Own power integrity simulation for the platform power delivery network: build and correlate voltage regulator module-to-die power delivery network models; run DC IR-drop and AC target-impedance analysis; perform transient droop and Ldi/dt studies across die, package, and PCB; and set decoupling and stackup strategy before layout is committed.
  • Apply knowledge of power conversion topologies, components, compensation circuits and stability analysis, drop/droop analysis, simulation tools and techniques, and PCB layout and design tools to characterize performance and validate correlation of simulation models and results.
  • Design and validate platform power conversion and management solutions, including energy management; simulate and optimize package and PCB design, including stackup, power/ground noise plane assignment, decoupling solutions, and power sequencing requirements.
  • Architect board observability for debugging, including per-rail voltage and current sense points, Kelvin-sense and probe landing points, telemetry and current-monitor access (SVID/PMBus/IMON), rail-level isolation and enable control, and voltage margining so power-on and post-silicon issues can be isolated without a board respin.
  • Build configurability into power delivery solutions so one board can support multiple SKUs and derivatives, using stuffing options for phase count and decoupling, pin-compatible dual-source regulator footprints, rail split/merge and current headroom for higher-power SKUs, and programmable load line, compensation, and VID range.
  • Create and execute test plans to validate and characterize power delivery solutions.
  • Correlate bench and voltage-regulator test-tool measurements with simulation results to improve simulation model accuracy and validate power integrity assumptions.
  • Conduct failure analysis and root-cause investigations for power delivery issues, and implement corrective actions to prevent recurrence.
  • Collaborate with silicon and platform architects to generate solutions and analyses and deliver content into platform design guides as solution collateral for end customers.
  • Collaborate with board design, software/firmware, and systems validation teams to ensure seamless integration of power delivery solutions.
Desired Qualifications
  • Experience designing power delivery hardware for debug and testability, including sense and telemetry instrumentation, voltage margining, and rail isolation for post-silicon bring-up.
  • Experience designing configurable power delivery solutions that support multiple SKUs and derivative products from a single board design.
  • Ability to identify new technologies and interfaces and develop board power delivery architecture.
  • Experience in project management, including leading projects and managing timelines and resources effectively.
  • Familiarity with emerging technologies such as gallium nitride power devices and switched-capacitor topologies.
  • Experience delivering products for high-volume production and cost optimization.
  • Knowledge of board and power management hardware, software, and firmware debugging.
  • Willingness to provide hardware technical support to original design manufacturer and original equipment manufacturer board vendors.
  • Willingness to travel globally to meet internal teams and external customers.

About the company

Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1999

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Simplify's Take

What believers are saying

  • July 23, 2026 Q2 revenue hit $16.1 billion, up 25% year over year.
  • Intel raised 2026 capex above $20 billion after stronger customer demand signals.
  • September 29, 2026 OpenShell expanded Intel's enterprise AI toolkit with policy enforcement.

What critics are saying

  • Intel's 10% government stake faces shareholder litigation in Delaware and Supreme Court filings.
  • Intel Foundry still depends on a few customers; external revenue remains only 5%.
  • AMD's 2026 data-center momentum and TSMC process lead pressure Intel's turnaround and margins.

What makes Intel unique

  • Intel's x86 installed base still anchors PC and server software compatibility in 2026.
  • Intel's 2026 Open Edge Platform bundles industrial AI software around Intel silicon.
  • Intel 18A tooling supports integrated design, manufacturing, and foundry control unmatched by fabless rivals.

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Benefits

  • We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.
  • Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.
  • Intel Fuels Career Acceleration: Curiosity drives us to change the world. We provide employees opportunities to expand their knowledge, leadership abilities, and skill set.
  • Vacation, Holidays, and More: We offer opportunities for employees to refresh and recharge—from paid vacation time and holidays to flexible time off programs.
  • Health Benefits for the Whole You: We provide multiple benefits and resources to help employees take care of themselves and their families.

Growth & Insights and Company News

Headcount

6 month growth

-1%

1 year growth

0%

2 year growth

-2%
Yahoo Finance
Oct 22nd, 2026
Intel falls 24.9% in a month despite 59% data centre growth to $6.3B

Intel shares fell 24.9% in the month to October 21, 2026, while the S&P 500 was about flat. The stock still gained 144% over the past year, and trades at 8.3 times trailing sales against 3.1 times for the index. Data center revenue reached $6.3 billion in fiscal Q2 2026, up 59% year on year. Operating margin was 12.2%, compared with an operating loss of 10.0% a year earlier. Intel Foundry lost $2.1 billion at the operating level in the quarter, on $293 million of outside revenue. Intel raised its 2026 capital spending outlook to more than $20 billion. On August 11, it upsized a stock offering to $20 billion, selling 210.5 million shares at $95 each. The stock closed at $92.96 on October 21. Fiscal Q3 results are expected in October 2026, against a revenue guide of $15.8 billion to $16.8 billion.

The Financial District
Oct 22nd, 2026
Intel reportedly lands Tesla for 14A chip process as $20B share offering funds foundry push

Intel has reportedly signed Tesla as a customer for its upcoming 14A manufacturing process, according to a Simply Wall St. report. If confirmed, it would be a significant external win for Intel's foundry business. Intel also reported progress in production output from its 18A process. In August, it priced a public offering of common stock that was increased to $20 billion, with proceeds intended for general corporate purposes, including potential capital expenditures and working capital. The offering adds capital but increases the number of shares outstanding, which could dilute existing shareholders. The key question is whether heavy spending on 18A, 14A and advanced packaging will bring sustained customer demand.

Yahoo Finance
Oct 21st, 2026
Intel installs first major truss at $28B Ohio fab, now due in 2030; Arizona fab targets 2028

Intel said Wednesday it has installed the first major structural truss at its Ohio chip factory, a construction milestone for a project years behind schedule. The Ohio project, with planned investments above $28 billion, was first expected to produce chips in late 2025. Intel now expects to finish the first Ohio factory in 2030, with operations starting between 2030 and 2031. The second factory should be complete in 2031, with operations starting in 2032. The company has slowed construction to match spending with customer demand. At its Fab 62 site in Arizona, construction and equipment installation are underway, with operations due by the end of 2028. Intel Foundry posted second-quarter revenue of $5.8 billion, up 31%, and an operating loss of about $2.1 billion. Most of that revenue came from within Intel.

Startup Fortune
Oct 20th, 2026
Two Intel workers die in gas explosion at Kiryat Gat fab in Israel.

Two Intel workers die in gas explosion at Kiryat Gat fab in Israel. Ilya Chechulin, 49, and Yakir Kosashvili, 35, died after an NF3 tank failed during unloading at Intel's Fab 28; a third worker remains on a ventilator as the company stays silent on output. A suspected tank failure during unloading at one of Intel's most important chip plants killed two workers days before the company has to explain its production numbers to Wall Street. Intel's Kiryat Gat facility in southern Israel was the backdrop for a visit by Prime Minister Benjamin Netanyahu on October 14 when an explosion tore through the site's gas delivery area. Police said a gas cylinder appeared to have malfunctioned during unloading, and Israel's Fire and Rescue Services later confirmed the incident involved nitrogen trifluoride, or NF3, a toxic but non-flammable compound used in semiconductor manufacturing. Two workers are dead. A third remains in critical condition. According to the Times of Israel, the first victim, Ilya Chechulin, 49, died of his wounds a day after the blast. Ynet identified the second man who died as Yakir Kosashvili, 35. Both suffered severe burns in the explosion and fire that followed. A third worker, a man in his 20s, remains sedated and on a ventilator in intensive care, according to Ynet's reporting. Calcalistech reported that preliminary findings point to a technical failure in the neck of a tank holding roughly 8 tons of NF3 at the time of the incident. Police said there was no indication the blast was an attack and that investigators suspected a technical malfunction during the transfer of material into the factory's tanks. The explosion happened on a day the country's prime minister was touring the city. Kiryat Gat isn't a minor node in Intel's network. Fab 28 there makes processors along with 5G and AI-related components, and it's one of the sites Intel has pointed to as it tries to rebuild manufacturing credibility after years of delays and cost overruns. Intel has also been expanding a second plant on the same campus, Fab 38, though construction was paused in 2024. A facility already carrying extra weight in Intel's turnaround story just became the site of a fatal industrial accident. Commerce Secretary Howard Lutnick has asked a Delaware court to dismiss a lawsuit alleging the US government's 9.9% stake in Intel amounted to an illegal seizure. He's defending the deal as vital to national security, and hinting defense contractors could be next. - how to dismiss lawsuit over government Intel stake - Commerce Secretary Lutnick fights Delaware corruption charges Intel Here's the uncomfortable part for investors: Intel hasn't said whether Kiryat Gat's output was affected, or for how long. On October 19, the company said its monitoring systems detected another NF3 leak during preparations to remove gas tanks from the site; no injuries were reported, but Intel still provided no production-impact figures. Gotrade reported that Intel shares fell 2.8% to $95.37 on October 15, one day after the explosion, amid concern about the blast and a broader chip selloff. The stock fell another 5.8% to $89.85 on October 16 before closing at $92.03 on October 19. Intel reports third-quarter results on October 29, according to the company's own investor relations announcement, with a call scheduled for 2 p.m. Pacific that day. That's fifteen days after the explosion and still no public word on whether wafer output, yield, or shipment timelines out of Kiryat Gat took a hit. Executives will have to address it on the call whether they want to or not, and investors will be listening for a number, not a sentiment. A single accident, a jittery sector. The timing is rough beyond Intel's own balance sheet. Chip stocks have been skittish for weeks on memory shortages and swings in AI infrastructure spending, and a fatal accident at a facility that makes both consumer processors and AI-adjacent components lands right in that nervousness. Everyone talks about the AI hardware buildout in abstractions, capacity, yield, roadmap. But it still runs through physical buildings where tanks of toxic gas are unloaded, and where a suspected tank failure can kill two people and rattle investors. Frankly, the most telling fact right now isn't the stock move. It's that a company sophisticated enough to run earnings calls down to the minute hasn't managed one sentence on whether its chips are still coming out of Kiryat Gat on schedule. Grief and operational disclosure aren't the same thing, and Intel owes its workforce one and its shareholders the other. On October 29, it runs out of room to give neither. Join the discussion. No replies yet. Start the discussion. Julian Lim is an entrepreneur, technology writer, and a researcher. He started JL Data Analysis after graduating from NUS in Intelligent Systems. Julian writes about technology innovations and entrepreneurship on Business Times, Asia Pacific Magazine and occasionally contributes to Startup Fortune.

Wccftech
Oct 20th, 2026
Intel XeSS could soon deliver better performance on Linux as Intel works to enable XMX acceleration through Valve's Proton.

Intel XeSS could soon deliver better performance on Linux as Intel works to enable XMX acceleration through Valve's Proton. Intel is working on improving XeSS (Xe Super Sampling) support on Linux, with a new series of patches aiming to enable hardware-accelerated XeSS upscaling through Valve's Proton compatibility layer. The proposed changes would allow supported Intel Arc GPUs to take advantage of their dedicated XMX (Xe Matrix eXtensions) engines when running Windows games on Linux, potentially delivering substantially better upscaling performance. As reported by Phoronix, Intel engineer Damian Tomczak has submitted four interconnected pull requests targeting Proton, Wine, VKD3D-Proton, and DXVK. Together, these changes address a longstanding limitation that has prevented XeSS from fully utilizing Intel's dedicated AI acceleration hardware in Windows games running through Proton. Currently, XeSS can operate through a slower fallback path under Proton, meaning Intel GPU owners may not benefit from the more efficient XMX-accelerated implementation available on Windows. The proposed solution introduces a built-in libxess.dll runtime within Wine that forwards Direct3D12 XeSS calls to the native Linux XeSS library (libxess.so), allowing workloads to execute through the accelerated path. The Wine pull request explains that Direct3D 12 objects are translated into Vulkan objects through VKD3D-Proton's interoperability interface, enabling the native XeSS implementation to operate within Proton's existing graphics translation infrastructure. Accompanying changes to VKD3D-Proton ensure that the necessary Vulkan extensions and device features are enabled, while DXVK receives adjustments to prevent Intel GPUs from being incorrectly hidden from games when Proton supplies its own XeSS library. Meanwhile, the Proton-specific implementation handles library selection and compatibility. Proton will search for a suitable native Linux XeSS library, including user-specified locations, and only use it when its version meets or exceeds the version required by the game. Otherwise, the game will continue using its existing Windows XeSS DLL. This approach should preserve compatibility while unlocking the faster hardware-accelerated XeSS implementation wherever the necessary Intel hardware and software support are available. It's worth emphasizing that this development concerns XeSS Super Resolution's XMX acceleration, rather than introducing the entire XeSS feature suite to Linux. It also primarily benefits compatible Intel Arc GPUs equipped with XMX engines, rather than GPUs from AMD or NVIDIA. The four pull requests remain under review and have not yet been merged, so there is currently no confirmed release date for the improvements. Nevertheless, this is a welcome development for Intel Arc owners gaming on Linux, particularly as Proton continues to narrow the compatibility and performance gaps between Windows and Linux gaming. If successfully implemented, the changes could finally allow Intel's dedicated XMX hardware to deliver its intended XeSS performance advantages in Windows games running through Proton. About the author: Sebastian Castellanos is a data scientist by education and training. He's also deeply passionate about PC gaming hardware and software. He has recently started writing technical articles and guides on Wccftech about PC hardware, games and mods. Follow Wccftech on Google to get more of its news coverage in your feeds.