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Micron Technology

Makes memory and storage chips for AI and PCs

Design Manager - Global Facilities

Construction ManagementConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • A bachelor's degree in Engineering, Architecture, or a related field, or equivalent experience.
  • At least five years of experience in Facilities Build within front-end semiconductor manufacturing environments.
  • Proven leadership in managing build teams and coordinating across engineering fields.
  • Ability to present technical topics visually, verbally, and in writing.
  • Deep technical expertise in mechanical, electrical, and process systems, and civil, structural, and architectural systems, particularly in cleanroom and semiconductor environments.

Responsibilities

  • Lead build development for major manufacturing and cleanroom projects across U.S. sites, ensuring alignment with operational goals and technical requirements.
  • Assemble and guide multidisciplinary teams, including engineering subject matter experts, to initiate and carry out new projects.
  • Act as the Owner’s Build Representative during design development and construction phases, resolving technical issues and ensuring design intent is maintained.
  • Develop and validate build criteria, scope justification, and concept packages across mechanical, electrical, and process fields, and civil, structural, and architectural fields.
  • Ensure compliance with safety codes, building regulations, and internal standards through build review and change control processes.
  • Review and evaluate design-related bids, contracts, and cost estimates, and inspect construction progress to ensure adherence to approved plans and timelines.

Desired Qualifications

  • Project Management certification, such as PMP or CAPM.
  • Experience managing build or project efforts across multiple geographic locations and engineering fields.
  • Dedication to safety, quality, and continuous improvement in build and construction environments.
  • Use AI tools, such as M365 Copilot or equivalent, to enhance productivity, including prompt-based workflows, automation, and data-driven decision support.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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