IC Package Mechanical FEA Engineer
Broadcom
IC Package Mechanical FEA Engineer
Broadcom
Designs chips and software for data centers
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Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc..
RESPONSIBILITIES:
Design responsibility for mechanical design aspects of ASIC packages
Use advanced FEA to quantify and optimize reliability and manufacturing
Measure and experiment to validate understanding and improve model accuracy
Collaborate closely with package designers, reliability and manufacturing partners (internal and external)
Schedule, prioritize, & track your work across 4+ projects simultaneously
Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors
Document design rules and guidelines
EDUCATION/EXPERIENCE & REQUIREMENTS:
Bachelors in Mechanical Engineering or similar field and 8+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 6+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 3+ years of experience in FEA modeling.
Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions
Ability to calibrate modeling and results with existing empirical data
Perform mechanical testing and measurement
Devise lab scale tests to validate analyses
Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations
Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
Self-management and organization skills
Presentation and technical documentation skills
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $108,000 - $172,800.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Broadcom designs chips and sells infrastructure software for the companies that run large data centers, telecom networks and corporate IT. Its custom AI processors, built with cloud companies, and its Ethernet switch chips move and process data inside the computer clusters that train AI models. The chip business also makes parts for broadband, wireless, storage and industrial equipment, sold to device makers and cloud operators, while VMware software lets businesses run private clouds and is sold by subscription. Broadcom took its current form in 2016, when Avago Technologies, formed in 2005 from Agilent's chip unit, bought Broadcom Corporation, and it is based in Palo Alto, California.
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