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Micron Technology

Makes memory and storage chips for AI and PCs

Front End Central Product Integration Engineer - Test & Product Yield Integration

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listed

About the Job

Requirements

  • A bachelor's or master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
  • At least 4 years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
  • Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
  • Ability in data analysis, debugging, and technical problem solving.
  • Strong written and verbal communication skills.
  • Ability to work independently in a cross-functional, global environment, manage multiple priorities, and travel 20–50%.

Responsibilities

  • Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
  • Integrate and drive execution of cross-site project data spanning design, test, yield, and manufacturing through to closure.
  • Deliver yield improvements through end-to-end understanding of product design, test flow, packaging interaction, and manufacturing while balancing reliability requirements.
  • Define and execute strategies to ensure Packaging Technology and Chip-Package Interaction readiness ahead of product qualification.
  • Lead cross-functional, global task forces to resolve yield and quality issues efficiently.
  • Develop, standardize, and deploy best-known methods and business processes to improve productivity.
  • Communicate status, risks, and technical proposals, and partner with leadership to drive results.
  • Travel to Micron fab and development sites as needed to support execution and alignment.

Desired Qualifications

  • Experience with DRAM High Bandwidth Memory (HBM) products.
  • Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip-package interaction, BEOL integration, or layout topics.
  • Experience collaborating across Product, Test, Yield, Design, Packaging, and Manufacturing teams.
  • Demonstrated ability to drive alignment and execution in central or network-level roles.
  • Interest in innovation, continuous improvement, and scalable solution development.
  • Experience and/or interest in developing Agentic AI workflows into current or future processes.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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