ASM International

Semiconductor deposition equipment and ALD tech

Senior Engineer - Field Process

Process EngineeringConfirmed live in the last 24 hours

Full-timeHillsboro, OR, USANo salary listed

About the Job

Requirements

An MS degree and 4 years of experience, or a PhD and 0 years of experience, in materials science, chemical engineering, or physics.
Experience processing, developing, or characterizing thin films in thermal atomic layer deposition, plasma atomic layer deposition, plasma chemical vapor deposition, epitaxy, or low-pressure chemical vapor deposition reactors.
Strong troubleshooting and structured problem-analysis skills using methods such as KT, FMEA, Ishikawa, and 7-step analysis.
Experience designing, running, and interpreting design of experiments and statistical experiments.
Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin-film characterization.
Ability to travel as needed for training and customer engagement and support extended hours or weekends during qualifications or escalations.
Strong verbal and written communication skills and the ability to explain complex concepts clearly.
Ability to maintain confidentiality and uphold intellectual-property boundaries.

Responsibilities

Support New Product Introduction by training with the Business Unit to gain expertise in new deposition processes and hardware.
Lead the introduction and transfer of new processes to the customer site.
Partner with field hardware engineers and Business Unit teams to troubleshoot new products and develop proposals for process or hardware improvements.
Design and execute on-site experiments with the customer, driving development, integration, and continuous improvement projects.
Escalate issues in a timely manner to maintain project scope, timelines, and customer alignment.
Document key learnings during New Product Introduction and ensure effective knowledge transfer to local service and manufacturing teams.
Analyze baseline system and process performance to identify gaps relative to technology-node requirements.
Perform structured problem-solving and root-cause analysis on process or system nonconformances.
Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption.
Support process transfer to high-volume manufacturing fabs, creating and sharing best-known methods and documentation.
Maintain discipline in intellectual-property boundaries, customer communication, and escalation leadership.

Desired Qualifications

Experience with ASM atomic layer deposition, plasma-enhanced atomic layer deposition, plasma chemical vapor deposition, epitaxy, or vertical furnace low-pressure chemical vapor deposition equipment.
Demonstrated success optimizing deposition processes in development or high-volume manufacturing environments.
Experience leading customer-facing technical discussions or escalations.
Background in transferring processes into high-volume manufacturing and supporting local service teams.
Experience coordinating cross-functional action plans during escalations.

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Senior Engineer, Field Process (Hillsboro, OR)

As a Senior Field Process Engineer, you will help expand ASM’s advanced film technologies at our customer’s Oregon site by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. You will serve as the technical link between customer engineering teams and ASM’s global Business Unit, ensuring new products and processes are introduced smoothly and successfully. Your work directly supports ASM’s mission to accelerate next‑generation semiconductor manufacturing through collaboration, technical excellence, and customer partnership.

What you will be working on

Support New Product Introduction (NPI) by training with the Business Unit to gain expertise in new deposition processes and hardware.
Lead the introduction and transfer of new processes to the customer site.
Partner closely with field hardware engineers and Business Unit teams to troubleshoot new products and develop proposals for process or hardware improvements.
Design and execute on-site experiments with the customer, driving development, integration, and continuous improvement projects.
Escalate issues in a timely manner to maintain project scope, timelines, and customer alignment.
Document key learnings during NPI and ensure effective knowledge transfer to local service and manufacturing teams.
Analyze baseline system and process performance to identify gaps relative to technology‑node requirements.
Perform structured problem‑solving and root‑cause analysis on process or system nonconformances.
Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption.
Support process transfer to high‑volume manufacturing (HVM) fabs, creating and sharing best‑known methods (BKMs) and documentation.
Maintain strong discipline in IP boundaries, customer communication, and escalation leadership.

What we are looking for

MS degree + 4 years of experience, OR PhD + 0 years of experience in materials science, chemical engineering, or physics.
Experience processing, developing, or characterizing thin films in thermal ALD, plasma ALD, plasma CVD, Epitaxy, or LPCVD reactors.
Strong troubleshooting and structured problem-analysis skills (KT, FMEA, Ishikawa, 7‑step, etc.).
Experience designing, running, and interpreting DOEs and statistical experiments.
Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization.
Ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
Strong verbal and written communication skills, able to explain complex concepts clearly.
Ability to maintain confidentiality and uphold IP boundaries.

What sets you apart

Experience with ASM ALD, PEALD, PECVD, Epitaxy, or vertical furnace LPCVD equipment.
Demonstrated success optimizing deposition processes in development or HVM environments.
Experience leading customer-facing technical discussions or escalations.
Background in transferring processes into HVM and supporting local service teams.
Experience coordinating cross-functional action plans during escalations.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Almere, Netherlands
Founded: 1968

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