High-Speed Optoelectronic Devices - Process Integration

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.

In this role, you'll shape the development and integration of advanced active devices within our silicon photonics platforms. This includes high-speed Ge photodiodes, III-V lasers and modulators, TFLN modulators and GeSi QCSE modulators for data-communication and telecommunication applications. You'll provide technical leadership on process requirements, fabrication feasibility, device reliability and design-technology co-optimization.

You will be making an impact:

• Leading the integration of advanced materials and active device technologies into silicon photonics platforms, balancing performance ambition with manufacturing feasibility.
• Providing technical direction on the physics, architecture and optimization of high-speed photodetectors and phase-shifters.
• Translating system and circuit-level requirements into device-level specifications that align with broader platform and product objectives.
• Partnering with outsourced 8-inch and 12-inch silicon wafer foundries to guide process development, address integration constraints and advance device-specific requirements.
• Influencing and collaborating across design, test, manufacturing and reliability teams to drive informed technical decisions and accelerate execution.
• Anticipating complex process integration challenges and initiating inventive, technically rigorous solutions that improve device performance, robustness and manufacturability.

The Must Haves

• Experience: Demonstrated success driving 8-inch or 12-inch semiconductor process integration in advanced technology environments.
• Education: Master's degree or higher in Electrical Engineering, Physics, Photonics or a closely related discipline.
• Technical Expertise:
• Strong technical command of device development and design for optical or optoelectronic applications.
• Proven ability to interpret advanced material and failure analysis data, including TEM, SEM, EDX, SIMS, XPS, XRD, HRP and AFM.
• Process & Tools:
• Experience leading 8D investigations, root-cause analysis and resolution of complex process or device failure mechanisms.
• Strong ability to manage and drive Engineering Change Orders (ECOs) with technical and operational stakeholders.
• Leadership & Collaboration:
• Excellent interpersonal skills, with the ability to influence, align and collaborate across multidisciplinary teams.
• Proven ability to work autonomously, take initiative and drive complex technical projects through to successful execution.
• Willingness to travel and collaborate remotely with teams across North America, Europe and Asia.

Assets

• TCAD simulation capability.
• Experience taking silicon photonics devices from concept through to reliable, manufacturable implementation.

At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard.  Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.

Ciena is an Equal Opportunity Employer, including disability and protected veteran status.

If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.