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Micron Technology

Makes memory and storage chips for AI and PCs

DRAM Intern

Process EngineeringConfirmed live in the last 24 hours
InternshipBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • Currently pursuing a Master of Science degree in Electrical Engineering, Microelectronics, or a related field, with an anticipated graduation date after September 2027.
  • Demonstrated knowledge of DRAM process integration, device physics, semiconductor scaling, and advanced memory technologies.
  • Experience with Design of Experiments, statistical analysis, and interpretation of complex engineering data.
  • Ability to analyze and resolve technical challenges in a multi-functional research and development environment.
  • Experience using artificial intelligence tools to support technical problem-solving, data analysis, research, or engineering workflows.

Responsibilities

  • Define technology landmarks, design rules, structural and electrical specifications, and integration requirements for next-generation DRAM products.
  • Collaborate with multifunctional teams, including simulation, process development, process architecture, circuit design, and quality engineering, to achieve technical objectives and project timelines.
  • Lead module-related integration activities, identify technical risks, develop test plans, and communicate progress, issues, and recommendations to collaborators.
  • Investigate and evaluate alternative architectures, process enablers, and scaling solutions to support future DRAM technology roadmaps.
  • Use artificial intelligence-assisted tools and data-driven methodologies to improve engineering productivity, analysis, and decision-making throughout the development process.

Desired Qualifications

  • Currently pursuing or planning to pursue a PhD in Electrical Engineering, Microelectronics, or a related technical field.
  • Experience providing technical leadership, project coordination, or mentoring within research or development environments.
  • Familiarity with advanced DRAM architectures, process integration challenges, and emerging memory technology trends.
  • Experience leveraging artificial intelligence or generative artificial intelligence technologies to enhance engineering analysis, technical documentation, or development efficiency.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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