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Micron Technology

Makes memory and storage chips for AI and PCs

Layout Design Engineer New Grad - HBM Layout

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeJalisco, MexicoNo salary listed

About the Job

Requirements

  • Bachelor’s, master’s, or PhD degree in Electronics, Mechatronics, Robotics Engineering, Nanotechnology, or a related technical field.
  • Graduated from a bachelor’s, master’s, or PhD program within the past two years.
  • Strong understanding of electronic circuit concepts and proficiency in electronic circuit simulation or design tools.
  • Conversational English proficiency.
  • Interest in semiconductor technology and motivation to learn, collaborate, and develop technical expertise.

Responsibilities

  • Craft and develop IC layouts for leaf cells, standard cells, and sub-blocks, with attention to performance, power, area, capacitance, and design efficiency.
  • Interpret Design Rule Checking (DRC), Layout Versus Schematic (LVS), and other physical verification results to support accurate custom layouts.
  • Apply a systematic, detail-focused approach to problem-solving and physical verification while planning work efficiently.
  • Collaborate with internal engineering teams across global locations to drive successful layout projects.
  • Continue to learn and develop semiconductor design skills while contributing to innovative HBM solutions.

Desired Qualifications

  • Internship or academic project experience related to pre-silicon circuit design, analog circuits, physical design, or analog layout.
  • Knowledge of MOS fundamentals, semiconductor fabrication, and the effects of layout on circuit speed, capacitance, power, and area.
  • Experience with Cadence VLE/VXL, Siemens/Mentor Graphics Calibre DRC/LVS, or similar layout and physical verification tools.
  • Proficiency in programming or scripting languages such as C++ or Python.
  • Experience using or developing AI-enabled methodologies for automation and engineering problem-solving.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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